JPH0739615Y2 - 樹脂モールド装置 - Google Patents

樹脂モールド装置

Info

Publication number
JPH0739615Y2
JPH0739615Y2 JP11486089U JP11486089U JPH0739615Y2 JP H0739615 Y2 JPH0739615 Y2 JP H0739615Y2 JP 11486089 U JP11486089 U JP 11486089U JP 11486089 U JP11486089 U JP 11486089U JP H0739615 Y2 JPH0739615 Y2 JP H0739615Y2
Authority
JP
Japan
Prior art keywords
plunger
pot
resin molding
resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11486089U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0352119U (US07166745-20070123-C00016.png
Inventor
俊範 清原
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP11486089U priority Critical patent/JPH0739615Y2/ja
Publication of JPH0352119U publication Critical patent/JPH0352119U/ja
Application granted granted Critical
Publication of JPH0739615Y2 publication Critical patent/JPH0739615Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP11486089U 1989-09-29 1989-09-29 樹脂モールド装置 Expired - Lifetime JPH0739615Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11486089U JPH0739615Y2 (ja) 1989-09-29 1989-09-29 樹脂モールド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11486089U JPH0739615Y2 (ja) 1989-09-29 1989-09-29 樹脂モールド装置

Publications (2)

Publication Number Publication Date
JPH0352119U JPH0352119U (US07166745-20070123-C00016.png) 1991-05-21
JPH0739615Y2 true JPH0739615Y2 (ja) 1995-09-13

Family

ID=31663208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11486089U Expired - Lifetime JPH0739615Y2 (ja) 1989-09-29 1989-09-29 樹脂モールド装置

Country Status (1)

Country Link
JP (1) JPH0739615Y2 (US07166745-20070123-C00016.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4607478B2 (ja) * 2004-03-17 2011-01-05 株式会社トクホン 貼付剤用両面離型フィルム

Also Published As

Publication number Publication date
JPH0352119U (US07166745-20070123-C00016.png) 1991-05-21

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