JPH073637Y2 - ボンディングパターン - Google Patents

ボンディングパターン

Info

Publication number
JPH073637Y2
JPH073637Y2 JP1989024503U JP2450389U JPH073637Y2 JP H073637 Y2 JPH073637 Y2 JP H073637Y2 JP 1989024503 U JP1989024503 U JP 1989024503U JP 2450389 U JP2450389 U JP 2450389U JP H073637 Y2 JPH073637 Y2 JP H073637Y2
Authority
JP
Japan
Prior art keywords
bonding pattern
bonding
chip
pattern
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989024503U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02114931U (enExample
Inventor
正行 清宮
Original Assignee
セイコー電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコー電子工業株式会社 filed Critical セイコー電子工業株式会社
Priority to JP1989024503U priority Critical patent/JPH073637Y2/ja
Publication of JPH02114931U publication Critical patent/JPH02114931U/ja
Application granted granted Critical
Publication of JPH073637Y2 publication Critical patent/JPH073637Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP1989024503U 1989-03-03 1989-03-03 ボンディングパターン Expired - Lifetime JPH073637Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989024503U JPH073637Y2 (ja) 1989-03-03 1989-03-03 ボンディングパターン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989024503U JPH073637Y2 (ja) 1989-03-03 1989-03-03 ボンディングパターン

Publications (2)

Publication Number Publication Date
JPH02114931U JPH02114931U (enExample) 1990-09-14
JPH073637Y2 true JPH073637Y2 (ja) 1995-01-30

Family

ID=31244405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989024503U Expired - Lifetime JPH073637Y2 (ja) 1989-03-03 1989-03-03 ボンディングパターン

Country Status (1)

Country Link
JP (1) JPH073637Y2 (enExample)

Also Published As

Publication number Publication date
JPH02114931U (enExample) 1990-09-14

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