JPH0735390Y2 - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPH0735390Y2
JPH0735390Y2 JP8306489U JP8306489U JPH0735390Y2 JP H0735390 Y2 JPH0735390 Y2 JP H0735390Y2 JP 8306489 U JP8306489 U JP 8306489U JP 8306489 U JP8306489 U JP 8306489U JP H0735390 Y2 JPH0735390 Y2 JP H0735390Y2
Authority
JP
Japan
Prior art keywords
lead
camera
width
image processing
detection point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8306489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0323930U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
公路 西巻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP8306489U priority Critical patent/JPH0735390Y2/ja
Publication of JPH0323930U publication Critical patent/JPH0323930U/ja
Application granted granted Critical
Publication of JPH0735390Y2 publication Critical patent/JPH0735390Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP8306489U 1989-07-17 1989-07-17 ボンディング装置 Expired - Lifetime JPH0735390Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8306489U JPH0735390Y2 (ja) 1989-07-17 1989-07-17 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8306489U JPH0735390Y2 (ja) 1989-07-17 1989-07-17 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0323930U JPH0323930U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-03-12
JPH0735390Y2 true JPH0735390Y2 (ja) 1995-08-09

Family

ID=31630424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8306489U Expired - Lifetime JPH0735390Y2 (ja) 1989-07-17 1989-07-17 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0735390Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPH0323930U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-03-12

Similar Documents

Publication Publication Date Title
US5119436A (en) Method of centering bond positions
US10107853B2 (en) Apparatus and method for inspecting PCB-mounted integrated circuits
US5780866A (en) Method and apparatus for automatic focusing and a method and apparatus for three dimensional profile detection
US20090046921A1 (en) Pick and place machine with improved component pick up inspection
JP2009508361A (ja) 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
JPH0713990B2 (ja) プローブ針とパッドの位置合わせ方法
JP2003060398A (ja) 部品実装方法及び装置
JPH0735390Y2 (ja) ボンディング装置
JP2000013097A (ja) 部品搭載装置
JPH11307567A (ja) バンプ検査工程を有する半導体装置の製造方法
JP2000315896A (ja) 表面実装部品装着機
JP2533375B2 (ja) テ―プボンディングにおけるリ―ドとバンプの位置検出方法
JP3725993B2 (ja) 電子部品実装回路基板の検査方法及びその装置
JP2539015B2 (ja) ペレットボンディング方法およびその装置
JPS6337479A (ja) パタ−ン認識装置
JPH06185994A (ja) 実装基板検査装置
JPH10150298A (ja) 電子部品の補正角度修正方法とそれを用いた電子部品 実装装置
JPH04166709A (ja) 表面性状観測装置
JP3158351B2 (ja) 微小ワーク片の位置検出方法
JP3008745B2 (ja) ワイヤボンディング検査方法及びワイヤボンディング検査装置
JP3385916B2 (ja) ワイヤボンディングにおけるワイヤの検出方法
JPH0367567B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH07175522A (ja) 位置合せ装置と位置合せ方法及びベアボ−ドテスタ
JP3813345B2 (ja) ワイヤボンディング方法
JP3419263B2 (ja) 電子部品の位置ずれ検査方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term