JPH07318612A - Method and jig for testing semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a method for testing a semiconductor device including a large number of external leads while preventing deformation of the external leads, lightening the damage on the plating of the external leads, taking countermeasures against noise and matching the impedance at the contact part. CONSTITUTION:An external lead 8 of a semiconductor device 1 is brought into electric contact with a probe 10 in order to test the electrical characteristics of the semiconductor device 1. In order to increase the contact area with the external lead 8 of the semiconductor device 1, an inserting part 10a1 is formed in the contactor 10. The external lead 8 is then inserted into the inserting part 10a1 of the contactor 10 and brought into electric contact therewith.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for testing a semiconductor device including a large number of external leads and a test jig for the semiconductor device used in this testing method.

In recent years, the number of external leads has increased due to the high integration of semiconductor devices, and miniaturization of semiconductor devices has been required. Along with this, the external leads have become extremely thin. Therefore, the mechanical strength of the external leads is also extremely reduced. As a result, the external leads are easily deformed when the characteristic test is performed.

Further, at the present time when automation of mounting a semiconductor device on a printed circuit board is progressing, when the characteristic test is completed and the semiconductor device having the deformed external lead is mounted on the printed circuit board, the deformed part of the external lead is deformed. It is time-consuming and labor-intensive to discover and repair deformed external leads.

Furthermore, when a semiconductor device having a deformed external lead cannot be found, in the worst case, a device incorporating a printed circuit board on which this semiconductor device is mounted may cause an accident.

Further, in the method of testing a semiconductor device, as the speed of the semiconductor device is increased, the noise resistance at the contact portion between the contactor and the external lead is improved and the impedance matching is improved at the time of the characteristic test. Optimization is required.

For the above reasons, it is necessary to prevent deformation of the external leads and to take measures against noise and impedance matching at the contact portion between the external lead and the contactor during the characteristic test of the semiconductor device.

[0007]

2. Description of the Related Art Generally, a surface mount semiconductor device is sandwiched between sockets which are test jigs, and a semiconductor device test system tests the electrical characteristics of the semiconductor device.

FIG. 6 is a view showing a conventional test jig for a semiconductor device.

In FIG. 6, a socket 6 which is a test jig.
The main body 62 of No. 1 is formed in a box shape. In this body 62,
An upper lid 67 is provided rotatably around the hinge 63.

On the bottom of the main body 62, a large number of contacts 66, which are contacts, are arranged in a rectangular shape, and are provided corresponding to a large number of external leads 8 of the semiconductor device 1. The contact 66 is made of a conductive material. The tip of the contactor 66 can contact the lower surface of the external lead 8.

The main body 62 is fixed on a printed circuit board 68. The printed circuit board 68 has the contact 66.
Is passing. Then, the terminal end of the contactor 66 and the signal line of the coaxial cable 69 are soldered to the lower surface of the printed board 68. The coaxial cable 69 is connected to a semiconductor device test system (not shown).

The main body 62 is closed by rotating the upper lid 67 in the counterclockwise direction in the figure. As a result, the upper surface 1a of the main body of the semiconductor device 1 is pressed against the upper lid 67, and the external lead 8 is firmly pressed against the tip of the contact 66. At this time, the external lead 8 is pressed upward against the main body 2.

As a result, each contact 66 and each external lead 8
The contact between the external lead 8 and the signal line of the coaxial cable 69 is surely electrically connected via the contact 66.

Then, an electrical characteristic test of the semiconductor device 1 has been conducted by the semiconductor device test system.

[0015]

However, in the conventional semiconductor device testing method, the mechanical strength of the external leads 8 of the semiconductor device 1 is weak and the external leads 8 are pressed upward. The external lead 8 was easily deformed.

Further, when the semiconductor device 1 is strongly pressed by the upper lid 67, the force for pressing the outer lead 8 upward due to the restoring force of the elastic deformation of the contact 66 becomes strong, and the plating coated on the outer lead 8 is strengthened. It also hurt me.

Further, the contact 66 is made of only a conductive material, is not covered with the shielded wire, and the contact 66 serving as a signal path has a complicated shape and is long, so that the semiconductor device 1 is a high-speed element. In this case, noise was likely to occur.

Since the contactor 66 serving as a signal path has a complicated shape and is long, the electrical resistance of the contactor 66 is large and the contact area between the contactor 66 and the external lead 8 is small. The contact resistance was increased and the impedance was increased. When the semiconductor device 1 is a high-speed element, it is affected by impedance and characteristic variation occurs,
An accurate characteristic test could not be performed.

Therefore, the present invention has been made in view of the above problems, and prevents deformation of the external leads of the semiconductor device, alleviates damage to the plating of the external leads, and measures against noise and impedance at the contact portion during measurement. It is an object of the present invention to provide a semiconductor device testing method and a test jig for the semiconductor device, which are designed to be consistent with each other.

[0020]

The above-mentioned problems can be solved by the constitutions of the following inventions.

According to a first aspect of the present invention, there is provided a semiconductor device testing method for electrically contacting an external lead of a semiconductor device with a contact to test an electrical characteristic of the semiconductor device. An insertion portion is formed in the contactor so as to have a large contact area, and the external lead is inserted into the insertion portion of the contactor to make electrical contact.

According to a second aspect of the present invention, there is provided a semiconductor device testing method for testing the electrical characteristics of the semiconductor device by bringing the external leads of the semiconductor device into contact with the contactors. The external lead is shaped while the external lead is brought into contact with the contactor.

According to a third aspect of the present invention, there is provided a semiconductor device test jig which is in electrical contact with an external lead of a semiconductor device and is used for testing the electrical characteristics of the semiconductor device. It is characterized in that the contactor is provided with an electric conductor having an insertion portion formed to have a large contact area with.

According to a fourth aspect of the present invention, there is provided a semiconductor device test jig which is in contact with a plated external lead of the semiconductor device and is used for testing the electrical characteristics of the semiconductor device.
The contact element is formed so that the contact area with the plated external lead is large, and the contact element includes a conductor having an elastically deformable insertion portion. Is.

According to a fifth aspect of the present invention, there is provided a semiconductor device test jig which is in electrical contact with an external lead of a semiconductor device and is used for testing the electrical characteristics of the semiconductor device. A contactor including an inner conductor electrically contactable with the outer conductor, an outer conductor electrically shielding the inner conductor, and an insulator electrically insulating the outer conductor from the inner conductor. It is characterized by having done.

[0026]

As described above, in the semiconductor device testing method according to the first aspect of the present invention, the insertion portion is formed in the contactor so that the contact area with the external lead of the semiconductor device is large. An external lead is inserted into the insertion portion to make electrical contact. Since the contact area between the contact and the outer lead is large, the electrical contact resistance between the contact and the outer lead can be reduced.

Further, a semiconductor device testing method according to a second aspect of the present invention is configured such that the external lead of the semiconductor device is guided to a contact and the external lead is shaped while the external lead and the contact are in contact with each other. did. Therefore, even if the external lead of the semiconductor device is deformed from the regular shape before the contact with the contactor, the external lead is guided to the contactor, the external lead is shaped, and the deformation is corrected. You can

A semiconductor device test jig according to a third aspect of the present invention comprises a contactor including a conductor having an insertion portion formed so as to have a large contact area with an external lead of the semiconductor device. It was configured. Therefore, the contact area between the contact and the external lead is increased, and the contact resistance can be reduced. Furthermore, it is possible to avoid an increase in impedance.

When the semiconductor element is a high speed element,
An accurate characteristic test can be performed without being affected by impedance and preventing characteristic fluctuation.

According to a fourth aspect of the present invention, there is provided a test jig for a semiconductor device, which is formed so as to have a large contact area with a plated external lead and has an elastically deformable insertion portion. A contactor having a conductor having
It was configured. Therefore, when the external lead is inserted into the insertion portion of the conductor, the pressure pushing the external lead can be reduced. This is because the contact area is wider than before. Therefore, the pressure applied to the external leads is small, and the plating coated on the external leads is not easily damaged.

According to a fifth aspect of the present invention, there is provided a test jig for a semiconductor device, which comprises an inner conductor electrically contactable with an outer lead of the semiconductor device, an outer conductor electrically shielding the inner conductor, and an outer conductor. The contactor is provided with an insulator that electrically insulates the outer conductor from the inner conductor. Since the inner conductor is electrically shielded by the outer conductor, the contactor has excellent noise resistance.

[0032]

FIG. 1 is a diagram for explaining a method of testing a semiconductor device according to a first embodiment of the present invention. Figure 1 (A)
1B is a perspective view showing a state before contact with the contact 10 in a characteristic test of the semiconductor device 1, and FIG. 1B is a cross-sectional view showing a part of the state during contact with the contact 10. .

The semiconductor device 1 is a QFP (Quad Flat Packa).
g) A surface mount type structure, in which the number of pins exceeding 100 pins is simplified to 20 pins (see FIG. 3).

This semiconductor device 1 extends in a horizontal direction from four sides of the package 7 and the package 7, and
The external lead 8 is formed in a gull wing shape that is mountable on the surface of the circuit board.

The external lead 8 has a base end portion 8a extending horizontally from the package 7, a bending portion 8b bent from the base end portion 8a, and a tip portion 8c bending horizontally from the bending portion 8b. Composed of.

The semiconductor device 1 is mounted on an electrically insulating base 11. The base 11 is provided with a rectangular recess 11 a for positioning the package 7 of the semiconductor device 1 and a protrusion 11 b protruding upward. A tapered surface 11c is formed on the protrusion 11b so as to correspond to the shape of the external lead 8.

When the semiconductor device 1 is placed on the base 11, the package 7 is positioned and the external leads 8 are placed.
The refraction part 8b comes into contact with the tapered surface 11c.

The contact 10 is made up of the external lead 8
This is a structure into which the tip portion 8c of can be inserted. Figure 1 (B)
The cross section of the tip 8c of the external lead 8 inserted into the contact 10 is shown.

Here, a sectional view of the contactor 10 as seen from the front is shown in FIG. 2A, and a sectional view as seen from the side is shown in FIG. 2B. In FIG. 2B, a coaxial cable 12 connected to the contact 10 is shown.

Since the contacts 10 come into contact with a large number of external leads 8, a plurality of contacts 10 are arranged in a rectangular shape so as to surround the package 7 in correspondence with each external lead 8 (see FIG. 3).

The contact 10 has a rectangular tubular shape, and includes an inner conductor 10a made of a conductive material and an outer conductor 10b provided outside the inner conductor 10a and made of a conductive material. And an insulator 10c that electrically insulates the outer conductor 10b from the inner conductor 10a and covers the outer conductor 10b.

A rectangular hole 10a2, which is an insertion portion, is formed along the axial direction at the tip portion 10a1 of the inner conductor 10a.

At the tip of the hole 10a2 and the insulator 10c, the gull-wing-shaped bending portion 8 of the external lead 8 is formed.
In addition to corresponding to b, the tip portion 8c of the external lead 8 is provided with the hole 1
0a2 guiding taper surface 10a3 and taper surface 10
c1 are formed respectively.

The tip portion 10a1 having the rectangular hole 10a2 is composed of four plates, and each plate is elastically deformable. When the tip portion 8c of the outer lead 8 is inserted into the hole 10a2 of the tip portion 10a1, the tip portion 8c of the outer lead 8 is pressed against each side surface of the hole 10a2 so that the outer lead 8 and the inner conductor 10a are not separated from each other. Fixed. At this time, the upper surface, the lower surface, the left side surface, the right side surface, and the tip surface of the tip portion 8c of the outer lead 8 are formed in the holes 10a2 of the inner conductor 10a.
It comes into contact with and is pressed against each surface.
That is, the tips 8c of the outer leads 8 are three-dimensionally contacted by the elastic deformation of the holes 10a2 (four plates of the tips 10a1) of the inner conductor 10a of the contact 10.

Specifically, the tip portion 8c of the external lead 8 is
The contactor 10 is in contact with each side surface of the hole 10a2 of the inner conductor 10a, and the contact area is wider than in the prior art.

The base end portion 10a of the inner conductor 10a of the contactor 10
4 is electrically connected to one end of the signal line 12a of the coaxial cable 12. The other end of the signal line 12a is connected to a semiconductor device test system (not shown).

Further, the shielded wire 12 of the coaxial cable 12
b is electrically connected to the outer conductor 10b of the contact 10. One end of the outer conductor 10b is grounded to the ground 13.

Then, as shown in FIG. 3, the contacts 10 connected to the coaxial cable 12 are arranged corresponding to the external leads 8 of the semiconductor device 1, and as shown in FIG. The contact 10 is horizontally moved in a direction (A1) opposite to the direction (A2) in which the lead 8 projects from the package 7, and the external lead 8 is moved to the contact 1 as shown in FIG.
Insert at 0.

As a result, due to the spring property of the hole 10a2 of the inner conductor 10a of the contactor 10, the upper surface, the lower surface, the left side surface, the right side surface and the front surface of the tip portion 8c of the outer lead 8 are the inner conductor 1a.
It makes contact and conducts with the respective surfaces of the hole 10a2 of 0. In this state, the characteristic test of the semiconductor device 1 is performed.

Further, in this state, the bending portion 8b of the external lead 8 has the insulator 10 even when it is deformed from the normal state.
c tapered surface 10c1 and inner conductor 10a tapered surface 10a
The guide portion 8 is guided to the hole 10a2 by 1 and is sandwiched between the tapered surface 10c1 of the insulator 10c and the tapered surface 11c of the base 11, so that the shape of the bent portion 8b can be modified.

Therefore, in the semiconductor device testing method, the shape of the bent portion 8b is corrected when the external lead 8 of the semiconductor device 1 contacts the contact 10, so that the external lead 8 is
Can be prevented from being deformed.

Further, the pressure for pushing the tip 8c of the external lead 8 of the semiconductor device 1 can be made smaller than in the conventional case.

In the conventional case, the contact with the contact 66 was made only on the lower surface of the external lead 8. However, in the case of the present embodiment, the contact with the contact 10 is provided at the tip of the external lead 8. This is because the contact area is wider than in the conventional case because the upper surface, the lower surface, the left side surface, the right side surface, and the tip surface of the portion 8c are used.

That is, the force for pushing the outer lead 8 by the restoring force of the elastic deformation of the conventional contactor 66 is equal to the force of pushing the outer lead 8 by the restoring force of the elastic deformation of the hole 10a2 of the inner conductor 10a of the contactor 10. Even so, since the contact area becomes wider than in the conventional case, the pressure becomes smaller.

Therefore, since the pressure applied to the tip portion 8a of the outer lead 8 is small, it is difficult to damage the plating coated on the outer lead 8.

Further, the contact 10 has a structure in which the inner conductor 10a serving as a signal path is covered with the grounded outer conductor 10b. Since the inner conductor 10a serving as a signal path has a simple shape and is short, When the semiconductor device 1 is a high speed element, noise is unlikely to occur.

Since the inner conductor 10a serving as a signal path has a simple shape and is short, the electrical resistance of the contact 10 is small, and the contact area between the contact 10 and the external lead 8 is large. The contact resistance is reduced, and the increase in impedance can be avoided.

When the semiconductor device 1 is a high-speed element, it is not affected by impedance, characteristic fluctuations are prevented, and accurate characteristic tests can be performed.

Next, a method of testing a semiconductor device according to the second embodiment of the present invention will be described with reference to FIGS.

FIG. 4 is a diagram for explaining the method of testing the semiconductor device according to the second embodiment. FIG. 5 shows a sectional view taken along the line VV in FIG. The clamper 18 is shown in FIG.

This embodiment is characterized by a method of horizontally moving the contact 10 toward the semiconductor device 1 during the characteristic test of the semiconductor device.

Reference numeral 14 in FIG. 4 is a package guide,
It is provided at four corners of the package 7 of the semiconductor device 1 and positions the package 7 together with the base 11 of the first embodiment.

Further, reference numeral 15 is a guide pin, which is provided on both sides of the contactors 10 ... Which are arranged in series and is movable in a support plate 16 which supports each contactor 10. This support plate 1
6 and the head of the guide pin 15 between the compression spring 17
Is locked.

The clamper 18 fixes the package 7 of the semiconductor device 1 and at the time of the characteristic test.
Is to heat.

Further, as shown in FIG. 5, the package guide 14 has a hole 14a for fitting with the tip of the guide pin 15.
Are formed. Other configurations of the semiconductor device test jig used in the semiconductor device test method of this example are as follows.
It is the same as that of the first embodiment.

Then, as shown in FIG. 4, the package 7 of the semiconductor device 1 is positioned by the package guide 14 and the base 11.

Next, the guide pin 15 is fitted into the hole 14a of the package guide 14. As a result, each contact 10
Are determined to correspond to the positions of the external leads 8.

Further, the compression of the compression spring 17 is released.
As a result, the compression spring 17 expands, the contacts 10 supported by the support plate 16 move horizontally toward the external leads 8 of the semiconductor device 1, and the contacts 10 move toward the external leads 8.
Contact at the same time.

Then, as shown in FIG. 5, the package 7 is fixed by a clamper 18 and heated. In this state, the characteristic test of the semiconductor device 1 is performed.

In this embodiment, the positioned contacts 10 can be brought into contact with the positioned external leads 8 at the same time. The time until contact can be shortened as compared with the case where a large number of contacts 10 are contacted separately.

[0071]

As described above, according to the invention of claim 1,
An insertion portion is formed in the contactor so that the contact area with the external lead of the semiconductor device is large, and the external lead is inserted into the insertion portion of the contactor to make electrical contact. Since the contact area between the contact and the outer lead is large, the electrical contact resistance between the contact and the outer lead can be reduced.

According to the second aspect of the invention, the external lead of the semiconductor device is guided to the contact, and the external lead is shaped while the external lead and the contact are in contact with each other. Even when the external lead is deformed from the regular shape before the contact with the contact, the external lead can be guided to the contact, the external lead can be shaped, and the deformation can be corrected.

According to the third aspect of the invention, the contactor is provided with the conductor having the insertion portion formed so that the contact area with the external lead of the semiconductor device is large. And the contact area between the external lead and
The contact resistance can be reduced, the increase in impedance can be avoided, and when the semiconductor element is a high-speed element,
An accurate characteristic test can be performed without being affected by impedance and preventing characteristic fluctuation.

Further, according to the invention of claim 4, a contact is provided which is formed so as to have a large contact area with the plated external lead and which is provided with a conductor having an insertion portion elastically deformable. Since the structure is composed of a child, when the external lead is inserted in the insertion part of the conductor, the pressure to push the external lead can be reduced, and the pressure to press the external lead is small. Hard to hurt.

Further, according to the invention of claim 5, an inner conductor capable of electrically contacting the outer lead of the semiconductor device, an outer conductor for electrically shielding the inner conductor, and the outer conductor and the inner conductor. Since the contactor is provided with an insulator that electrically insulates and, the contactor is excellent in noise resistance.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a method of testing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the contact of FIG.

FIG. 3 is a diagram showing an arrangement state of the contacts of FIG.

FIG. 4 is a diagram for explaining a semiconductor device testing method according to a second embodiment of the present invention.

5 is a cross-sectional view taken along the line VV in FIG.

FIG. 6 is a diagram showing a conventional test jig for a semiconductor device.

[Explanation of symbols]

 1 Semiconductor Device 7 Package 8 External Lead 10 Contact 10a Inner Conductor 10b Outer Conductor 10c Insulator 11 Base 11b Protrusion 11c Tapered Surface 12 Coaxial Cable 12a Signal Line 12b Shield Wire 13 Earth 14 Package Guide 15 Guide Pin 16 Support Plate 17 Compression Spring 18 clamper

Claims (5)

[Claims] 1. A method for testing a semiconductor device, wherein an external lead (8) of the semiconductor device (1) is electrically contacted with a contactor (10) to test the electrical characteristics of the semiconductor device (1). The insertion part (10a) is attached to the contact (10) so that the contact area with the external lead (8) of the semiconductor device (1) becomes large.
2) is formed, and the external lead (8) is inserted into the insertion portion (10a2) of the contactor (10) to make an electrical contact. 2. A semiconductor device testing method for testing the electrical characteristics of the semiconductor device (1) by bringing the external leads (8) of the semiconductor device (1) into contact with a contactor (10). Connect the external lead (8) of (1) to the contact (1
0), and the outer lead (8) is shaped while the outer lead (8) and the contactor (10) are brought into contact with each other. 3. A test jig for a semiconductor device, which is electrically contacted with an external lead (8) of the semiconductor device (1) and is used for testing the electrical characteristics of the semiconductor device (1), (1) A contactor (10) having a conductor (10a) having an insertion portion (10a2) formed so as to have a large contact area with the external lead (8). A test jig for semiconductor devices. 4. A test jig for a semiconductor device, which is in contact with a plated external lead (8) of the semiconductor device (1) and is used for testing the electrical characteristics of the semiconductor device (1), wherein And a contactor (10) having a conductor (10a) which is formed so as to have a large contact area with the external lead (8) and has an elastically deformable insertion portion (10a2). A test jig for the configured semiconductor device. 5. A test jig for a semiconductor device, which is in electrical contact with an external lead (8) of the semiconductor device (1) and is used to test the electrical characteristics of the semiconductor device (1), The inner conductor (10a) capable of electrically contacting the outer lead (8) of (1), the outer conductor (10b) that electrically shields the inner conductor (10a), the outer conductor (10b), and the above An insulator (10c) electrically insulating the inner conductor (10a);
0) A test jig for a semiconductor device, characterized in that