JPH07307386A - 半導体集積回路装置の製造方法 - Google Patents

半導体集積回路装置の製造方法

Info

Publication number
JPH07307386A
JPH07307386A JP6098548A JP9854894A JPH07307386A JP H07307386 A JPH07307386 A JP H07307386A JP 6098548 A JP6098548 A JP 6098548A JP 9854894 A JP9854894 A JP 9854894A JP H07307386 A JPH07307386 A JP H07307386A
Authority
JP
Japan
Prior art keywords
antifuse
integrated circuit
semiconductor integrated
circuit device
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6098548A
Other languages
English (en)
Japanese (ja)
Inventor
Chikashi Suzuki
爾 鈴木
Kosuke Okuyama
幸祐 奥山
Toshifumi Takeda
敏文 竹田
Katsuhiko Kubota
勝彦 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6098548A priority Critical patent/JPH07307386A/ja
Priority to TW084103793A priority patent/TW283789B/zh
Priority to KR1019950009647A priority patent/KR950034685A/ko
Priority to CN95106069A priority patent/CN1123956A/zh
Publication of JPH07307386A publication Critical patent/JPH07307386A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP6098548A 1994-05-12 1994-05-12 半導体集積回路装置の製造方法 Pending JPH07307386A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6098548A JPH07307386A (ja) 1994-05-12 1994-05-12 半導体集積回路装置の製造方法
TW084103793A TW283789B (enrdf_load_stackoverflow) 1994-05-12 1995-04-18
KR1019950009647A KR950034685A (ko) 1994-05-12 1995-04-24 반도체 집적회로장치의 제조방법
CN95106069A CN1123956A (zh) 1994-05-12 1995-05-12 制造半导体集成电路器件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6098548A JPH07307386A (ja) 1994-05-12 1994-05-12 半導体集積回路装置の製造方法

Publications (1)

Publication Number Publication Date
JPH07307386A true JPH07307386A (ja) 1995-11-21

Family

ID=14222749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6098548A Pending JPH07307386A (ja) 1994-05-12 1994-05-12 半導体集積回路装置の製造方法

Country Status (4)

Country Link
JP (1) JPH07307386A (enrdf_load_stackoverflow)
KR (1) KR950034685A (enrdf_load_stackoverflow)
CN (1) CN1123956A (enrdf_load_stackoverflow)
TW (1) TW283789B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328709B1 (ko) * 1999-07-07 2002-03-20 박종섭 프로그래밍 부위 형성방법
US7271076B2 (en) * 2003-12-19 2007-09-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
CN101562151B (zh) * 2008-04-15 2012-04-18 和舰科技(苏州)有限公司 具有金属硅化物的半导体结构及形成金属硅化物的方法

Also Published As

Publication number Publication date
TW283789B (enrdf_load_stackoverflow) 1996-08-21
KR950034685A (ko) 1995-12-28
CN1123956A (zh) 1996-06-05

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