JPH0728692Y2 - ウエハディスク - Google Patents
ウエハディスクInfo
- Publication number
- JPH0728692Y2 JPH0728692Y2 JP1988084278U JP8427888U JPH0728692Y2 JP H0728692 Y2 JPH0728692 Y2 JP H0728692Y2 JP 1988084278 U JP1988084278 U JP 1988084278U JP 8427888 U JP8427888 U JP 8427888U JP H0728692 Y2 JPH0728692 Y2 JP H0728692Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cooling medium
- disk
- wafer mounting
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002826 coolant Substances 0.000 claims description 29
- 238000001816 cooling Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 54
- 238000003466 welding Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084278U JPH0728692Y2 (ja) | 1988-06-25 | 1988-06-25 | ウエハディスク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084278U JPH0728692Y2 (ja) | 1988-06-25 | 1988-06-25 | ウエハディスク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH025873U JPH025873U (enExample) | 1990-01-16 |
| JPH0728692Y2 true JPH0728692Y2 (ja) | 1995-06-28 |
Family
ID=31308974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988084278U Expired - Lifetime JPH0728692Y2 (ja) | 1988-06-25 | 1988-06-25 | ウエハディスク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0728692Y2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919518U (enExample) * | 1972-05-18 | 1974-02-19 | ||
| JP5151651B2 (ja) * | 2008-04-22 | 2013-02-27 | 株式会社Ｓｕｍｃｏ | 酸素イオン注入装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3588237T2 (de) * | 1984-09-19 | 2002-11-14 | Applied Materials, Inc. | Vorrichtung zum Abtasten von Wafern durch einen Ionenstrahl |
-
1988
- 1988-06-25 JP JP1988084278U patent/JPH0728692Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025873U (enExample) | 1990-01-16 |
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