JPH0727667Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0727667Y2 JPH0727667Y2 JP14669188U JP14669188U JPH0727667Y2 JP H0727667 Y2 JPH0727667 Y2 JP H0727667Y2 JP 14669188 U JP14669188 U JP 14669188U JP 14669188 U JP14669188 U JP 14669188U JP H0727667 Y2 JPH0727667 Y2 JP H0727667Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- external lead
- circuit board
- hybrid integrated
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14669188U JPH0727667Y2 (ja) | 1988-11-10 | 1988-11-10 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14669188U JPH0727667Y2 (ja) | 1988-11-10 | 1988-11-10 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0267682U JPH0267682U (enrdf_load_stackoverflow) | 1990-05-22 |
| JPH0727667Y2 true JPH0727667Y2 (ja) | 1995-06-21 |
Family
ID=31416418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14669188U Expired - Fee Related JPH0727667Y2 (ja) | 1988-11-10 | 1988-11-10 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727667Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0132297Y2 (enrdf_load_stackoverflow) * | 1980-10-07 | 1989-10-03 | ||
| JPS6057194U (ja) * | 1983-09-28 | 1985-04-20 | 日本インター株式会社 | 金属ケ−ス封止型電子機器 |
-
1988
- 1988-11-10 JP JP14669188U patent/JPH0727667Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0267682U (enrdf_load_stackoverflow) | 1990-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |