JPH0726852Y2 - 発光ダイオードアレイ - Google Patents
発光ダイオードアレイInfo
- Publication number
- JPH0726852Y2 JPH0726852Y2 JP1989100465U JP10046589U JPH0726852Y2 JP H0726852 Y2 JPH0726852 Y2 JP H0726852Y2 JP 1989100465 U JP1989100465 U JP 1989100465U JP 10046589 U JP10046589 U JP 10046589U JP H0726852 Y2 JPH0726852 Y2 JP H0726852Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- recognition
- inspection
- diode array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000000523 sample Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003909 pattern recognition Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989100465U JPH0726852Y2 (ja) | 1989-08-30 | 1989-08-30 | 発光ダイオードアレイ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989100465U JPH0726852Y2 (ja) | 1989-08-30 | 1989-08-30 | 発光ダイオードアレイ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339864U JPH0339864U (enrdf_load_stackoverflow) | 1991-04-17 |
| JPH0726852Y2 true JPH0726852Y2 (ja) | 1995-06-14 |
Family
ID=31649472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989100465U Expired - Fee Related JPH0726852Y2 (ja) | 1989-08-30 | 1989-08-30 | 発光ダイオードアレイ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726852Y2 (enrdf_load_stackoverflow) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5996729A (ja) * | 1982-11-26 | 1984-06-04 | Hitachi Ltd | ホトマスク等の位置精度測定方法 |
| JPS59143159A (ja) * | 1983-02-07 | 1984-08-16 | Mitsubishi Electric Corp | 写真製版技術におけるパタ−ン重ね合わせ方法 |
| JPS6229138A (ja) * | 1985-07-31 | 1987-02-07 | Oki Electric Ind Co Ltd | マ−ク合わせ方法およびそれに用いるアライメントマ−ク |
| JPS62170655U (enrdf_load_stackoverflow) * | 1986-04-18 | 1987-10-29 | ||
| JPS6490527A (en) * | 1987-10-01 | 1989-04-07 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1989
- 1989-08-30 JP JP1989100465U patent/JPH0726852Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339864U (enrdf_load_stackoverflow) | 1991-04-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |