JPH0726852Y2 - 発光ダイオードアレイ - Google Patents
発光ダイオードアレイInfo
- Publication number
- JPH0726852Y2 JPH0726852Y2 JP1989100465U JP10046589U JPH0726852Y2 JP H0726852 Y2 JPH0726852 Y2 JP H0726852Y2 JP 1989100465 U JP1989100465 U JP 1989100465U JP 10046589 U JP10046589 U JP 10046589U JP H0726852 Y2 JPH0726852 Y2 JP H0726852Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- recognition
- inspection
- diode array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989100465U JPH0726852Y2 (ja) | 1989-08-30 | 1989-08-30 | 発光ダイオードアレイ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989100465U JPH0726852Y2 (ja) | 1989-08-30 | 1989-08-30 | 発光ダイオードアレイ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339864U JPH0339864U (cs) | 1991-04-17 |
| JPH0726852Y2 true JPH0726852Y2 (ja) | 1995-06-14 |
Family
ID=31649472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989100465U Expired - Fee Related JPH0726852Y2 (ja) | 1989-08-30 | 1989-08-30 | 発光ダイオードアレイ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726852Y2 (cs) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5996729A (ja) * | 1982-11-26 | 1984-06-04 | Hitachi Ltd | ホトマスク等の位置精度測定方法 |
| JPS59143159A (ja) * | 1983-02-07 | 1984-08-16 | Mitsubishi Electric Corp | 写真製版技術におけるパタ−ン重ね合わせ方法 |
| JPS6229138A (ja) * | 1985-07-31 | 1987-02-07 | Oki Electric Ind Co Ltd | マ−ク合わせ方法およびそれに用いるアライメントマ−ク |
| JPS62170655U (cs) * | 1986-04-18 | 1987-10-29 | ||
| JPS6490527A (en) * | 1987-10-01 | 1989-04-07 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1989
- 1989-08-30 JP JP1989100465U patent/JPH0726852Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339864U (cs) | 1991-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8530248B2 (en) | Method for placing a component onto a target platform by an apparatus using a probe | |
| CN1150605C (zh) | 测试ic芯片的探针卡 | |
| JP3884100B2 (ja) | 半導体デバイスの製造方法 | |
| KR970005032A (ko) | 상이한 피치로 형성되는 패턴을 위치 지정하기 위한 얼라인먼트 마크를 갖는 가공품과 이 가공품의 제조 방법 | |
| US7573278B2 (en) | Semiconductor device | |
| JPH0726852Y2 (ja) | 発光ダイオードアレイ | |
| CN101689540B (zh) | 制造集成电路的方法 | |
| US9620456B2 (en) | Integrated circuits on a wafer and methods for manufacturing integrated circuits | |
| JP2901223B2 (ja) | 画像装置 | |
| JP3150219B2 (ja) | 半導体部品製造用リードフレームに対する半導体チップの供給装置 | |
| US7535240B2 (en) | Semiconductor device | |
| JP6784146B2 (ja) | 収容装置、基板装置の製造方法 | |
| JPH0556444U (ja) | Ledプリントヘッド | |
| JPS59182516A (ja) | ウエハチツプのマ−キング装置 | |
| US20070184564A1 (en) | Die attaching method | |
| JP2969986B2 (ja) | 電子部品観察用レーザ装置 | |
| JP2663846B2 (ja) | 極細半導体装置 | |
| JPH11114737A (ja) | 導電性ボールの移載方法 | |
| JP2000021695A (ja) | ウェーハ検査装置 | |
| JPS60246645A (ja) | 半導体ウエハチツプの位置合わせ方法 | |
| JPH06340119A (ja) | 画像装置 | |
| KR100267562B1 (ko) | 포토다이오드 칩 픽업장치 | |
| CN117524945A (zh) | 一种扩膜后晶圆检查测试一体机及检查方法 | |
| JPS6016415A (ja) | 半導体装置 | |
| JPH0541155U (ja) | Ledアレイの拡散長検出パターン |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |