JPH07263489A - Tab tape and semiconductor device using the same tape - Google Patents

Abstract

PURPOSE:To obtain a TAB tape in which multiple pins are not lead-deformed or not displaced by providing burning glass in a string or band state in a lead cross-sectional direction at an intermediate parts of inner leads, and forming a lead coupling zone. CONSTITUTION:Burning glass 11 provided at an intermediate part of inner leads 7 is, for example, low melting point glass, provided in a string or band state in a lead cross-sectional direction, an incoming pitch is maintained between the leads, the leads 7 are coupled and fixed. The glass 11 may be formed slightly higher than a lead surface. The glass 11 formed in the cross-sectional direction of the leads 7 performs a role of a dam, resin is introduced between the leads without leakage to seal the leads, and a thin semiconductor device can be formed. Thus, the attitude of the leads can be maintained without deforming and without displacement, and multiple pins can be further increased in number.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape and a semiconductor device without lead deformation or displacement.

[0002]

2. Description of the Related Art Semiconductor devices are required to have a large number of pins, a small size, and a thin shape. As one of the measures, for example, as described in JP-A-3-11641, a fine lead pattern of inner leads and outer leads is formed by etching on a metal foil bonded to a carrier film, and the carrier film is perforated. A semiconductor chip (hereinafter, referred to as a chip) provided in a device hole that is being manufactured is connected to the inner lead and resin-sealed to manufacture a semiconductor device.
There is an AB tape.

[0003]

The TAB tape is designed to have a large number of pins as the chip density and density are further increased. For example, the number of pins is 400 to 600, and the lead is fine. There is. The lead is easily deformed or displaced, and there is an increased possibility that a defect such as a connection defect or a wire break will occur during connection with a chip or resin sealing.

Further, in a TAB tape semiconductor device, it is important to apply resin to each inner lead in order to improve its reliability and longevity. Must not occur.

A first object of the present invention is to obtain a TAB tape in which the lead is not deformed or displaced even with a large number of pins, and the inner lead of the TAB tape is connected to the mounted chip. However, in a resin-sealed semiconductor device, the lead is not deformed or displaced by thermal stress or some external force, and each lead is not
A second object is to obtain a semiconductor device which is completely resin-sealed and has high reliability and a long life.

[0006]

The gist of the present invention is to provide a device hole, a sprocket hole and an outer lead hole.
The tips of a plurality of inner leads formed on the adhered metal foil are projected on the device hole to the carrier film on which the inner leads are formed to electrically connect the inner leads and a chip separately provided. In TAB tape,
In the TAB tape which connects the inner leads, the inner glass protruding above the device hole is provided with fired glass in a string shape or a band shape in the transverse direction of the leads. Another gist is that in a semiconductor device in which an inner lead of a TAB tape and a chip are electrically connected and resin-sealed, a sintered glass is formed in the middle of the inner lead in the cross direction of the lead in a string shape or There is a semiconductor device using a TAB tape in which a lead connecting band is provided in a band shape and the inside of the connecting band is resin-sealed.

[0007]

In the TAB tape of the present invention, the inner leads projecting onto the device hole are connected by the fired glass having excellent heat resistance and a small coefficient of thermal expansion. Although heated at the time of sealing and subjected to thermal shock and external force, the lead is firmly held and is not deformed or displaced. Further, even when the TAB tape is handled or a chip is mounted, a shape defect does not occur in the lead.

The semiconductor device of the present invention is a TAB table.
Since the inner lead of the chip is connected to the chip, and the inner side of the inner lead connected with the fired glass is resin-sealed, the fired glass functions as a dam of the sealing resin, and each fine lead The resin is spread evenly between them and is completely applied, and the sealing thickness can be reduced. Further, since the fired glass is located on the outermost side of the sealed package, the water absorption resistance of the resin package is enhanced, and peeling or cracking does not occur, so that a highly reliable semiconductor device can be obtained.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail based on one embodiment with reference to the drawings. In the drawing, reference numeral 1 is a carrier film, on which a device hole 2, a sprocket hole 3 and an outer lead hole 4 are provided.
The lead pattern is formed on the metal foil 5 adhered to, for example, a copper foil or a copper alloy foil.

The formation is performed as follows. A photoresist layer 6 is provided on the metal foil 5, and lead patterns of inner leads 7 and outer leads 8 are baked and developed on the photoresist layer 6, and then etched to form fine leads. The inner lead 7 projects from the middle portion to the tip on the device hole 2, and the outer lead 8 is mostly located on the outer lead hole 4. In addition, the test pad 9 and the lead connected to this are
Do also forms. Reference numeral 10 denotes a bump 10 provided on the lower surface of the tip of the inner lead 7.

Reference numeral 11 denotes a fired glass provided in the middle portion of the inner lead 7, which is, for example, a low-melting glass and is provided in a string shape or a belt shape in the transverse direction of the leads and enters between the leads to maintain the lead pitch. The inner leads 7 are connected and fixed. The baked glass 11 may be formed to be slightly higher than the lead surface.

The fired glass 11 is attached to the inner lead 7 by mixing, for example, a low melting point crystallized glass powder, an organic solvent, and an organic binder into a paste shape, and a screen or strip shape in the width direction of the lead. -Apply by a printing method or a dispensing method. After that, for example, the crystallized glass powder is heated to 380 to 440 ° C. and baked to melt the crystallized glass powder.

The lead pattern formed on the TAB tape is fine, and especially the tip of the inner lead 7 has a small pitch and a narrow width and is easily deformed.
Since they are connected and fixed at 1, they will not be deformed or displaced. Further, in the TAB tape, the connection with the chip 12 is made by pressing the bump 10 provided on the lower surface of the tip of the inner lead 7 against the chip terminal by a thermocompression bonding method or an ultrasonic method. The posture of the lead 7 is maintained, and no connection failure or short circuit occurs.

After mounting the chip 12 on the TAB tape and connecting it to the lead, the chip 12 and the inner lead 7 are connected.
Is sealed with resin 13 as shown in FIG. At this time, the fired glass 11 provided in the transverse direction of the inner leads 7 serves as a dam, and the resin can be filled in between the leads to seal each lead and form a thin semiconductor device 14. it can.

[0015]

In the TAB tape of the present invention, since the inner leads are connected by the sintered glass, the lead is fine and reinforced even if the mechanical strength is weak, and when the lead is connected to the chip, Alternatively, thermal stress does not occur even if a heating action is applied during the subsequent resin sealing, the lead is not deformed or displaced, its posture is maintained, and the number of pins can be further increased.

In the semiconductor device of the present invention, the fired glass to which the inner leads of the TAB tape are connected becomes a dam when the chip and the inner leads connected thereto are resin-sealed, and each lead is lead. The resin can flow and be applied without exception, and the sealing thickness can be reduced. In addition, since the sealed semiconductor device has the baked glass on the outermost side of the package, it has excellent water absorption resistance, and the occurrence of peeling, cracks, etc. is significantly reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a TAB tape according to an embodiment of the present invention.

FIG. 2 is a diagram showing a semiconductor device according to one embodiment of the present invention.

[Explanation of symbols]

 1 Carrier Film 2 Device Hole 3 Sprocket Hole 4 Outer Lead Hole 5 Metal Foil 6 Photoresist Layer 7 Inner Lead 8 Outer Lead 9 Test Pad 10 Firing Glass 11 Chip 12 Resin Sealing 13 Semiconductor Device

Claims (2)

[Claims] 1. A carrier film having a device hole, a sprocket hole and an outer lead hole formed thereon, wherein the tip ends of a plurality of inner leads formed on a metal foil adhered to the carrier film are projected onto the device hole. In a TAB tape for electrically connecting the inner lead and a semiconductor chip separately provided, a calcined glass is provided in a cord-like or band-like shape in the middle of the inner lead in a transverse direction of the lead and connects the inner lead. TAB tape that is characterized by. 2. In a semiconductor device in which an inner lead of a TAB tape and a semiconductor chip are electrically connected and resin-sealed, a firing is provided in an intermediate portion of the inner lead in a transverse direction of the lead. A semiconductor device using a TAB tape, characterized in that the inside of the lead connecting band made of glass is resin-sealed.