JPH0719657Y2 - チップ状電子部品半田付用保持具 - Google Patents
チップ状電子部品半田付用保持具Info
- Publication number
- JPH0719657Y2 JPH0719657Y2 JP13740989U JP13740989U JPH0719657Y2 JP H0719657 Y2 JPH0719657 Y2 JP H0719657Y2 JP 13740989 U JP13740989 U JP 13740989U JP 13740989 U JP13740989 U JP 13740989U JP H0719657 Y2 JPH0719657 Y2 JP H0719657Y2
- Authority
- JP
- Japan
- Prior art keywords
- core
- winding
- chip
- soldering
- shaped electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 21
- 238000004804 winding Methods 0.000 claims description 43
- 229910000679 solder Inorganic materials 0.000 claims description 41
- 238000007654 immersion Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 description 6
- 238000007598 dipping method Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 239000011527 polyurethane coating Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740989U JPH0719657Y2 (ja) | 1989-11-28 | 1989-11-28 | チップ状電子部品半田付用保持具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740989U JPH0719657Y2 (ja) | 1989-11-28 | 1989-11-28 | チップ状電子部品半田付用保持具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0376656U JPH0376656U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-07-31 |
| JPH0719657Y2 true JPH0719657Y2 (ja) | 1995-05-10 |
Family
ID=31684567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13740989U Expired - Lifetime JPH0719657Y2 (ja) | 1989-11-28 | 1989-11-28 | チップ状電子部品半田付用保持具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719657Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6221794B2 (ja) * | 2014-02-06 | 2017-11-01 | 株式会社オートネットワーク技術研究所 | 電磁シールド部材およびワイヤハーネス |
-
1989
- 1989-11-28 JP JP13740989U patent/JPH0719657Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0376656U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-07-31 |