JPH07188922A - Vapor deposition method - Google Patents

Abstract

PURPOSE:To remarkably improve productivity and to lower the cost of the vapor-deposited material. CONSTITUTION:A sheet-shaped holder 7 carrying a material to be vapor- deposited is set and made rotatable around a horizontal shaft 8 parallel to one side of the holder 7. Three or more holders 7 are radially arranged in the half region on the opposite side of a vaporization source 11 with the body of revolution formed by revolving the holder 7. At first, the two holders 7 are confronted with the source 11 and vapor-deposited. Next, two holders carrying a material having an undeposited surface are turned to a specified angle and successively confronted with the source 11, and the materials on the radially arranged holders 7 are continuously vapor-deposited.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor deposition method, and more particularly to a vapor deposition method capable of continuously depositing a large number of vapor deposition objects by making a plate-shaped holder on which the vapor deposition objects are mounted rotatable. Regarding

[0002]

2. Description of the Related Art Conventionally, as disclosed, for example, in Japanese Utility Model Publication No. 3-120556, vacuum deposition, sputtering,
In ion plating or the like, a device is used that can rotate (reverse) a plate-shaped holder on which an object to be vapor-deposited is mounted in order to perform double-sided vapor deposition and improve productivity. The reversing mechanism of such a vapor deposition apparatus is, for example, as shown in FIG. 3, and includes a plurality of fan-shaped holders 2 for mounting the vapor deposition target 1 such as an optical lens on both front and back surfaces thereof, and these holders. It is composed of a frame body 3 for supporting 2 in a reversible manner. The frame 3 has a small ring 4 at the center and a large ring 5 at the outer periphery.
And are connected by a support member 6 provided at intervals that divide the circumference into six equal parts, and the entire frame body 3 is formed in an umbrella shape.

According to the vapor deposition method of the apparatus having such a reversing mechanism, after vapor-depositing one surface, the other surface can be vapor-deposited continuously by reversing the holder 2, so that double-side vapor deposition is performed once. It becomes possible with. Further, in the case of single-sided vapor deposition, if the vapor deposition target 1 is provided in an overlapping manner and mounted on the holder 2 so that one side of the vapor deposition target 1 is exposed, it is possible to double the number of vapor depositions in one process by performing reverse vapor deposition. Can be vapor-deposited on the object 1 to be vapor-deposited.

[0004]

However, although the above-described conventional vapor deposition method allows reverse vapor deposition to improve productivity to some extent, it is arranged in a disc shape in one step. Moreover, only the object to be vapor-deposited 1 that can be mounted on the six holders 2 can be vapor-deposited. In recent years, it has been particularly desired to improve the productivity when forming an antireflection film or the like of an optical component, and further to reduce the cost, and it is expected to realize a means that enables a larger number of vapor depositions at one time.

The present invention has been made in view of the above conventional problems, and an object of the present invention is to provide a vapor deposition method capable of significantly improving productivity and reducing the cost of a vapor deposit.

[0006]

In order to solve such a problem, the present invention provides a plate-shaped holder on which an object to be vapor-deposited is mounted when performing vapor deposition such as vacuum vapor deposition, sputtering and ion plating. A horizontal axis parallel to one side of the holder is rotatably provided as a rotation axis, and three holders are formed radially around the rotation axis in a half region on the side opposite to the evaporation source of the rotating body formed by rotating the holder. After the above arrangement, two holders of which are opposed to the evaporation source for vapor deposition, and then the vapor deposition object having an untreated vapor deposition surface is mounted.
Each holder is rotated by a predetermined angle so that the holders sequentially face the evaporation source, and vapor deposition is continuously performed on the objects to be vapor-deposited in the radially arranged holders. That is, the present invention is a method in which the conventional planar arrangement of the holders is changed to a three-dimensional radial arrangement, and the holders are rotated in such a manner that pages are sequentially turned over to perform continuous vapor deposition. In the present invention, at least the holder facing the evaporation source may be rotated in the plane for vapor deposition.

[0007]

According to such a vapor deposition method of the present invention, in the case of double-sided vapor deposition, the object to be vapor-deposited is exposed on both sides and mounted on the holder, and first, the two holders are made to face the evaporation source. Vapor deposition. Next, one of the holders is rotated (reversed) by 180 degrees, and the other remaining holders are rotated so as to be fed in the same direction by a predetermined angle, respectively, and an object to be evaporated having an unprocessed surface to be evaporated. After the two holders mounted with are newly facing the evaporation source, vapor deposition is performed. At this time, one of the holders facing the evaporation source has already been vapor-deposited on one side, so the other side is vapor-deposited and the vapor deposition on both sides is completed. In addition, the holder, which faces the evaporation source anew, will be vapor-deposited on one side for the first time.

[0008] By repeating such an operation in sequence and depositing continuously on the deposits on the holders arranged radially, it is possible to deposit on many deposits in one step. On the other hand, in the case of single-sided vapor deposition, the objects to be vapor-deposited are piled up and mounted on a holder so that one surface of the objects to be vapor-deposited is exposed, and if it is performed in the same manner as in the case of the above-mentioned double-sided vapor deposition, it can be performed in one step. It can be vapor-deposited on an extremely large number of vapor-deposited objects. Further, when the vapor deposition target is not provided in a stacked manner, the single side vapor deposition is performed as follows. First, two holders are vapor-deposited by facing the evaporation source. As a result, vapor deposition of the vapor deposition target mounted on these holders is completed.

Next, one of the holders and the adjacent holder in the standby state are rotated (reversed) so as to exceed 180 degrees, and the other remaining holders are respectively fed by a predetermined angle in the same direction. To rotate,
Vapor deposition is performed after the two holders on which the untreated vapor deposition target is mounted are newly faced to the evaporation source. By repeating such an operation in sequence, vapor deposition is continuously performed on the vapor deposition target of the holders arranged radially. In this case, unlike the case of the above-described double-sided vapor deposition, the holders are rotated by two by about 180 degrees after vapor deposition, so the vapor deposition target is mounted on the holder so that the vapor deposition surfaces face each other in a standby state. There is a need.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are a schematic configuration diagram of a vacuum vapor deposition apparatus for carrying out the vapor deposition method of the present invention and a bottom view of a main part thereof. In this apparatus, the holder 7 for mounting the deposition target material 1 with both the front and back surfaces thereof exposed is formed in a substantially semicircular plate shape, as shown in FIG. The holder 7 has a horizontal shaft 8 parallel to its straight side 7a as a rotation axis, and is rotated (reversed) by a drive source (not shown) provided outside the chamber 9 via a power transmission mechanism 10 such as a belt and a pulley. ) Is possible. Then, in the hemisphere region which is the upper half on the side opposite to the evaporation source 11 among the spheres formed by rotating the holder 7, a large number (19 in this embodiment) are radially arranged about the horizontal axis 8. The holder 7 is arranged three-dimensionally. That is, in this embodiment, each holder 7 has 10
Radially arranged at angular intervals of degrees.

Further, all of these holders 7 are adapted to be horizontally rotated about a vertical axis as a rotation axis. In FIG. 1, 12 is a heater arranged so as to surround all the holders 7 for heating the object to be vapor-deposited 1, 13 is a cylindrical protective ring further surrounding the outer periphery of the heater 12, 1
4 is a shutter that can cover the upper part of the evaporation source 11,
Reference numeral 15 is an exhaust port of the chamber 9.

In this embodiment, double-sided vacuum vapor deposition was carried out by the apparatus having such a structure. Hereinafter, for convenience of explanation, the holder 7 in the left horizontal state among the holders 7 arranged radially in FIG.
The 19th sheet is the holder 7 in the right horizontal state. First, as shown in FIG. 2, the deposition object 1 is exposed on both front and back sides and mounted on all holders 7. First, as shown in FIG. 1, the first holder 19 and the second holder 7 are mounted. When facing the evaporation source 11 so as to be flush with the horizontal state, the object to be vapor-deposited 1 is heated by the heater 12, and the pressure in the exhaust port 15 is reduced so that the inside of the chamber 9 has a predetermined vacuum degree. The vapor deposition was performed while rotating horizontally with the vertical axis as the axis of rotation.

Next, the first holder 7 of which one side is vapor-deposited is rotated (reversed) from the bottom by 180 degrees, and
The other remaining second to nineteenth holders 7 are each rotated by 10 degrees so as to be fed in the same direction (counterclockwise in FIG. 1), and the deposition target 1 having an untreated deposition target surface 1 is rotated. After the second and second holders 7 mounted with were facing new evaporation source 11, evaporation was performed again in the same manner as above. At this time, one of the holders 7 facing the evaporation source 11 has already been vapor-deposited on one side, and the other surface is vapor-deposited on the other side, which completes the vapor deposition on both sides. . In addition, the second holder 7 that faces the evaporation source 11 is newly provided.
Will be vapor-deposited on one side for the first time.

By repeating these operations in sequence, double-sided vapor deposition was continuously performed on all the objects to be vapor-deposited 1 mounted on the first to 19th holders 7 arranged radially.
Thereby, it is possible to vapor-deposit a large number of objects to be vapor-deposited 1 in one step, the production efficiency is remarkably improved, and the cost can be reduced.

In the present embodiment, the case where double-sided vapor deposition is carried out has been shown, but as described above, the present invention can be applied to single-sided vapor deposition, and similar effects can be obtained. Further, in the present embodiment, the holder 7 has a substantially semi-circular plate shape, but the present invention is not limited to this embodiment, and a rectangular plate-shaped or trapezoidal plate-shaped holder may be used. . Further, the attachment means of the holder 7, the rotation mechanism, and the like may have any configuration as long as the vapor deposition method of the present invention can be carried out. Also,
The evaporation source 11 may be arranged in the center of the bottom of the chamber 9 and the holder 7 facing the evaporation source 11 may be arranged in an umbrella shape so that the distances from the evaporation source 11 to the respective deposition targets 1 are equal.
The present invention can be applied not only to vacuum vapor deposition but also to sputtering and ion plating.

[0016]

As described above, according to the vacuum vapor deposition method of the present invention, a large number of holders are three-dimensionally radially arranged in the vacuum vapor deposition apparatus, and a large number of vapor-deposited objects are continuously vapor-deposited. Therefore, the productivity can be improved and the cost for forming the thin film can be reduced. Further, if the holder facing the evaporation source is vapor-deposited while rotating in the plane, the film thickness distribution can be made uniform.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a vacuum vapor deposition apparatus used in an example of the present invention.

FIG. 2 is a bottom view showing a main part of the vacuum vapor deposition device.

FIG. 3 is a perspective view showing a reversing mechanism of a conventional vacuum vapor deposition device.

[Explanation of symbols]

 1 Deposition object 2, 7 Holder 3 Frame 4 Small ring 5 Large ring 6 Support member 8 Horizontal shaft 9 Chamber 10 Power transmission mechanism 11 Evaporation source 12 Heater 13 Protective ring 14 Shutter 15 Exhaust port

Claims (2)

[Claims] 1. A plate-shaped holder on which a material to be vapor-deposited is mounted is rotatably provided with a horizontal axis parallel to one side thereof as a rotation axis, and the holder on the side opposite to the evaporation source of a rotary body can be rotated. In the half area, three or more holders are arranged radially around the rotation axis, two holders of which are opposed to the evaporation source for vapor deposition, and then an object to be vapor-deposited having an untreated vapor-deposited surface is mounted. Each of the holders is rotated by a predetermined angle so that the two holders sequentially face the evaporation source, and vapor deposition is continuously performed on the objects to be vapor-deposited in the radially arranged holders. 2. The vapor deposition method according to claim 1, wherein vapor deposition is performed while rotating at least a holder facing the evaporation source in the plane.