JPH05320892A - Vacuum device for forming thin film - Google Patents

Abstract

PURPOSE:To provide a vacuum device for forming a thin film capable of forming a uniform thin film even on a body with a rugged surface. CONSTITUTION:A target 4 made of a film forming material and a holder 2 for holding a body 3 on which a thin film is formed are placed opposite to each other in a vacuum vessel 1, a power source 5 is connected to the target 4 and electric discharge is caused to form a thin film of the film forming material on the body 3. At this time, one or more targets 4 are used and the counter angle of at least one of the targets 4 to the body 3 is made arbitrarily variable.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum thin film forming apparatus used in the field of electronic component manufacturing, and more particularly to a vacuum thin film forming apparatus for forming a uniform thin film on a thin film forming object having irregularities. ..

[0002]

2. Description of the Related Art A conventional example of a vacuum thin film forming apparatus (sputtering apparatus) for forming a thin film on a substrate (thin film forming object) will be described with reference to FIG.

In FIG. 3, a conventional example is a vacuum container 1,
An exhaust port 7 and a gas inlet port 8 provided in the vacuum container 1,
A substrate holder 2 that is provided in the vacuum container 1 and rotates about a support shaft, a target 4 that is arranged in parallel to the substrate holder 2 at a position facing the substrate holder 2, and an RF or DC power supply that is connected to the target 4. 5 and. The target 4 is made of a film forming material.

Next, the operation of this conventional example will be described with reference to FIG. The substrate 3 is held by the substrate holder 2, and the inside of the vacuum container 1 is evacuated from the exhaust port 7 to a high vacuum state,
A certain amount of gas such as Ar is introduced from the gas introduction port 8 to maintain the degree of vacuum at which discharge is possible. In this state, the RF or DC power supply 5 is connected to the target 4 to cause discharge from the target 4 to vaporize the film forming material forming the target 4 and form a thin film of this vaporized film forming material on the substrate 3. To do.

[0005]

However, in the above-mentioned structure of the conventional example, when the surface of the substrate 3 has irregularities as shown in FIG. 3, the mutual positions of the target 4 and the substrate 3 are fixed and Since they are parallel to each other, even if the substrate holder 2 is rotated about the support axis, the rotation cancels out the partial difference in the distance between the respective portions of the substrate 3 having unevenness on the surface with respect to the target 4 and the facing angle. There is no change (there is no change in the relative distance between each part of the substrate 3 having an uneven surface and the target 4 even when rotated, and the shadow (the part where the facing angle is small) is always the shadow. }, There is a problem that the film forming rate is partially different and the film forming thickness on the substrate 3 having unevenness is partially different.

An object of the present invention is to solve the above problems and to provide a vacuum thin film forming apparatus capable of forming a uniform thin film even on a substrate 3 having irregularities.

[0007]

In order to solve the above-mentioned problems, a vacuum thin film forming apparatus of the present invention is a thin film forming object for holding a target composed of a film forming material and a thin film forming object in a vacuum container. A vacuum thin film forming apparatus for forming a thin film made of a film forming material that constitutes the target on the thin film forming object by arranging the forming object holder facing each other and connecting a power source to the target to discharge the target. The number of the targets is one or more, and at least one of the targets can arbitrarily change the facing angle with respect to the thin film forming body.

Further, in the vacuum thin film forming apparatus of the present invention, in order to solve the above problems, it is preferable that the targets are connected to the power source simultaneously or individually.

Further, in the vacuum thin film forming apparatus of the present invention, in order to solve the above problems, it is preferable that the target is composed of two or more kinds of individual or mixed film forming materials.

[0010]

In the vacuum thin film forming apparatus of the present invention, the thin film forming object holder provided in the vacuum container 1 rotates about the support shaft even for the thin film forming object having an uneven surface. A uniform thin film can be formed by having at least one target and at least one target being able to arbitrarily change the facing angle with respect to the thin film formation target. That is, in the case where the facing angle of at least one target with respect to the thin film forming body is arbitrarily changed according to the uneven shape of the surface of the thin film forming body, the surface is The rotation causes the partial difference in the distance and the facing angle of each portion of the thin film forming object having unevenness to be canceled out by the rotation {each portion of the thin film forming object having unevenness on the surface and these targets. The relative distance between the target and the target makes one revolution, and the partial difference in the distance and the facing angle of each part of the thin film forming object having an uneven surface with respect to the target cancels each other and disappears. The part that is the small part) disappears. }, The partial film formation rates are the same, and the thickness of the film formed on the thin film forming object having an uneven surface is uniform. Of course, the effect is improved by increasing the number of targets that can arbitrarily change the facing angle with respect to the thin film forming body.

Further, if the targets can be connected to the power source at the same time or individually, a convenient target,
For example, since only a target whose facing angle can be changed arbitrarily can be selected and used, the adaptability to the irregularities on the surface of the thin film forming object is improved.

Further, if the target is composed of two or more kinds of individual or mixed film forming materials, a mixed film can be formed, and the targets can be connected to a power source simultaneously or individually. With the synergistic effect with that, it is possible to form a multilayer film or a mixed film.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the vacuum thin film forming apparatus of the present invention will be described with reference to FIGS.

1 and 2, in the present embodiment, a vacuum container 1, an exhaust port 7 and a gas introduction port 8 provided in the vacuum container 1, and a support shaft provided in the vacuum container 1 are centered. A rotating substrate holder (thin film formation object holder) 2 and at least one target 4 at a position facing the substrate holder 2.
The tilt angle varying mechanism 6 allows the facing angle of at least one target 4 to the substrate holder (thin film formation object holder) 2 to be arbitrarily changed. In this embodiment, five targets 4 are provided,
One in the center is a fixed target 4, and the other four in the periphery are variable in tilt angle by a tilt angle varying mechanism 6. Further, in this embodiment, the RF or DC power supply 5 is connected to the target 4, but the power can be applied to the five targets 4 simultaneously or individually. And target 4
Is composed of a film-forming material.
In some cases, the target 4 may be composed of two or more kinds of film-forming materials, and may be composed of two or more kinds of film-forming materials. Alternatively, the target 4 may be composed by mixing them. Also, the RF or DC power source 5 is
The power can be applied to the plurality of targets 4 simultaneously or individually.

The operation of this embodiment will be described with reference to FIGS.

1 and 2, in the present embodiment, a substrate (thin film formation target holder) 2 holds a substrate (thin film formation target) 3 and the inside of the vacuum container 1 is evacuated from an exhaust port 7. A high vacuum state is obtained by exhausting, and a certain amount of gas such as Ar is introduced from the gas introduction port 8 to maintain the degree of vacuum at which discharge is possible. In this state, the RF or DC power supply 5 is connected to the target 4 to cause discharge from the target 4 to vaporize the film forming material forming the target 4 and form a thin film of this vaporized film forming material on the substrate (formation of a thin film to be formed). Form on body 3.

In this case, if the surface of the substrate (thin film formation target) 3 is uneven, the substrate holder (thin film formation target holder) 2 provided in the vacuum container 1 rotates about the support shaft and The four targets 4 can arbitrarily change the facing angle with respect to the substrate (thin film forming object) 3. By doing so, the distance of each part of the substrate (thin film formation target) 3 having unevenness on the surface and the four targets whose facing angles to the substrate (thin film formation target) 3 are arbitrarily changed, The partial difference in the facing angle will be canceled by the rotation {the rotation changes the relative distance between each part of the thin film forming object having unevenness on the surface and its target, and one rotation makes the target. The partial difference in the distance and the facing angle of each portion of the thin film forming object having the unevenness on the surface is canceled by each other and disappears, and the portion which is always the shadow (the portion where the facing angle is small) disappears. }, The partial film formation rates are the same, and the thickness of the thin film on the thin film forming object having the uneven surface becomes uniform. In this case, the effect is improved by increasing the number of targets 4 capable of arbitrarily changing the facing angle with respect to the substrate (subject to be thin film formed) 3, but as in the present embodiment, the target 4 having the facing angle which can be arbitrarily changed can be changed. When the numbers are set to be even numbers and arranged at symmetrical positions, the targets 4 at the symmetrical positions cancel out the influence of the unevenness of the surface of the substrate (subject to be thin film formed) 3, so that the uniformity is improved. It is also effective to make the film formation uniform by changing the tilt angle at any time by the tilt angle varying mechanism 6 during the film forming operation.

Further, if the five targets 4 of this embodiment can be connected to a power source simultaneously or individually, a convenient target can be obtained corresponding to the uneven shape of the surface of the substrate (thin film forming object) 3. Since 4 can be selectively used (for example, the center target 4 is not used), the adaptability to the irregularities on the surface of the thin film formation target is improved.

In addition, the arbitrary target 4 of this embodiment is set to 2
If it is composed of more than one type of individual (in this case, a plurality of targets 4) or a mixture of film forming materials (for example, four surrounding targets 4 are used, the targets 4 in symmetrical positions are formed in the same composition). Since it can be formed by two or more kinds of film forming materials at the same time, a mixed film can be formed. Furthermore, the targets 4 can be connected to a power source at the same time or individually, and the same film can be formed. If a film is formed for each target made of a film forming material, not only a mixed film but also a multilayer film can be formed.

[0020]

According to the vacuum thin film forming apparatus of the present invention, even if the surface of the thin film forming object has irregularities, the thin film forming object holder provided in the vacuum container rotates about the support shaft. By having one or more targets and at least one target being able to arbitrarily change the facing angle with respect to the thin film forming object, it is possible to form a uniform thin film on the uneven thin film forming object. ..

In the vacuum thin film forming apparatus of the present invention,
When the targets are connected to the power source at the same time or individually, the number of targets to be used and the facing angle thereof can be selected according to the uneven shape of the surface of the thin film forming object. An effect that the adaptability to surface irregularities is improved.

In the vacuum thin film forming apparatus of the present invention,
When the target is composed of two or more kinds of individual or mixed film forming materials, a mixed film can be formed, and synergistic effect with the target can be connected to a power source simultaneously or individually Thus, not only the mixed film but also the multilayer film can be formed.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of a vacuum thin film forming apparatus of the present invention.

FIG. 2 is a partially enlarged perspective view of FIG.

FIG. 3 is a configuration diagram of a conventional example.

[Explanation of symbols]

 1 Vacuum Container 2 Substrate Holder (Thin Film Forming Object Holder) 3 Substrate (Thin Film Forming Object) 4 Target 5 RF or DC Power Supply (Power Supply) 6 Tilt Angle Adjusting Mechanism 7 Exhaust Port 8 Gas Inlet Port

Claims (3)

[Claims] 1. A target made of a film forming material and a thin film forming object holder for holding a thin film forming object are arranged to face each other in a vacuum container, and a power source is connected to the target for discharging. In the vacuum thin film forming apparatus for forming a thin film made of a film forming material that constitutes the target on the thin film forming object, the target is one or more, and at least one target is the thin film forming object. A vacuum thin film forming apparatus characterized in that the facing angle with respect to can be changed arbitrarily. 2. The vacuum thin film forming apparatus according to claim 1, wherein the targets are connected to a power source simultaneously or individually. 3. The vacuum thin film forming apparatus according to claim 1, wherein the target is composed of two or more kinds of individual or mixed film forming materials.