JPH02277770A - Film forming device - Google Patents

Abstract

PURPOSE:To make film thickness uniform on one sheet of base plate by controlling and changing the rotating speed of a rotary jig until the other end is positioned in the front part of a target from a time when one end is positioned in the front part of the target. CONSTITUTION:Both the targets 8 and the base plate fitting faces 6a are provided in a vacuum tank 1. The respective base plate fitting faces 6a are rotated by a rotary jig 6 so that the fitting faces are successively opposed to the target 8. The rotating velocity of the rotary jig 6 is controlled by a controlling means until the other end in the direction of rotation of the fitting faces 6a is positioned in the front parts of the targets 8 from a time when one end in the direction of rotation of the fitting faces 6a is positioned in the front parts of the targets 8. Thereby the difference of film thickness of the respective base plates on one fitting face is made small.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a film forming apparatus for forming a film on a substrate using a film forming material in a vacuum chamber.

(Prior Art) As a film forming apparatus, there is a sputtering apparatus that irradiates a film forming material (target) with ions to form a film of the film forming material on a substrate. Further, vapor deposition apparatuses such as a thermal vapor deposition apparatus that heats and evaporates a film-forming material and performs vapor deposition on a substrate, and an ion blating apparatus that performs vapor deposition by ionizing evaporated particles of a film-forming material are generally known. It is also generally known that such a film forming apparatus uses a rotating jig that has a plurality of substrate mounting surfaces arranged in the circumferential direction and rotates so that each substrate mounting surface sequentially faces a target or evaporation source of the film forming material. ing.

In other words, examples of the rotating jig for sputtering equipment include a carousel type in which a plurality of substrate mounting surfaces are arranged in a rectangular tube shape on a turntable in a vacuum chamber, and a conical rotation jig in which a plurality of substrate mounting surfaces are arranged in a conical shape. Alternatively, there are a dome shape arranged in a pyramidal shape, a drum shape in which a plurality of substrate mounting surfaces are arranged in a rectangular tube shape and the shaft center is horizontal and rotated. The carousel type has a target placed around its outer periphery, the dome type has a target placed below it, and the drum type has a target placed inside. Such various rotating jigs are also provided for the vapor deposition apparatus. Such a rotating jig is usually rotated at a constant speed when forming a film on a substrate.

(Problem to be Solved by the Invention) Generally, in a film forming apparatus, a film having an uneven thickness is formed on a substrate in accordance with the flight angle distribution of the film forming material 9. In this case, the rotation of the substrate also affects the film thickness distribution on the substrate.

That is, for example, in the case of a carousel type sputter link apparatus, as shown in FIG. Assuming that is the product of the emissivity R from target b and the cosine eO9β of the angle that the substrate surface makes with the target, then if the distance from target b to point P is ignored, then the following equation is obtained.

7'-JReos βdt =1/ωΦJ Rcos (θ.+α-θ)dθ=
2R/ω・cos a * sin θO castle R/ωII
W/rIICO82α/ cos α0 Note that 0 is the rotation center of the car-cell type rotating jig, α is the angle between the straight line drawn from the rotation center O to a point P on the substrate a and the perpendicular line drawn on the same substrate a, ω is the rotational angular velocity of substrate a, and θ0 is the angle A
Half of OB, α0 is half of the spread angle of substrate a, W is the width of target b, and r is the distance from the rotation center O to the edge of substrate a.

Therefore, in the case of a carcell type rotating jig with a hexagonal cross section, α
Since it is o-30 degrees, T-R/ω number W/r・1.15cos In the case of a carcell type rotating jig with an octagonal 2a cross section, it is α0-22.5 degrees, so T-R/ (IJ・W/r・1.08cos
2a, and as shown in FIG. 8, the film thickness distribution of the substrate a is such that it is thickest at the center (0 degrees) of the substrate a and becomes thinner as it moves away from the center on both sides.

The fact that the rotation of the rotating jig has an effect on the film thickness distribution of the substrate is true not only for the carousel type but also for the dome type and drum type. Also,
When a plurality of substrates are attached to one substrate mounting surface at intervals in the rotational direction, the film thickness of each substrate differs depending on the mounting position on the substrate mounting surface.

In other words, an object of the present invention is to minimize the non-uniformity of film thickness on one substrate due to the rotation of the rotating jig.
Alternatively, the objective is to minimize the difference in film thickness of each substrate on one substrate mounting surface.

(Means for Solving the Problems) The present invention solves these problems by forming a film at a point Q at the center of the substrate in a range of 1 θ to 10 θ in FIG. Although it does not occur before or after this range, film formation occurs even before the above range at the leading edge of the substrate in the rotational direction, and occurs even after the above range at the rear end of the substrate in the rotational direction. By making the rotating speed of the tool variable, such as increasing the rotation speed when film formation occurs at the center of the substrate mounting surface and slowing it when film formation occurs at both ends, it is possible to achieve uniform film thickness. It is something.

That is, the specific means for achieving this is as follows: First, regarding a sputtering device, a target and a plurality of substrate mounting surfaces for attaching substrates are disposed in the circumferential direction in a vacuum chamber so that each substrate mounting surface faces the target in sequence. The present invention is based on a film forming apparatus that is equipped with a rotating rotating jig and that performs sputtering on the substrate. In contrast, the rotational speed of the rotating jig is changed from when one end of each board mounting surface in the rotational direction is located in front of the target, to when the other end of the board mounting surface in the rotational direction is located in front of the target. The configuration includes a control means for changing the position between the two positions.

Furthermore, specific means regarding the vapor deposition apparatus include, in a vacuum chamber,
An evaporation source that evaporates a film-forming material for forming a film on a substrate from a fixed position in a vacuum chamber, and a plurality of substrate mounting surfaces to which the substrates are attached are arranged in the circumferential direction, and each substrate mounting surface is connected to the evaporation source. A rotating jig that rotates so as to face each other sequentially is provided,
The present invention is based on a film forming apparatus that is configured to evaporate the film forming material onto the substrate. In contrast, the rotational speed of the rotating jig is changed from when one end of each substrate mounting surface in the rotational direction is located in front of the evaporation source to when the other end of the substrate mounting surface in the rotational direction is located in front of the evaporation source. The invention is characterized by comprising a control means for changing the position between when the vehicle is located in front of the vehicle and when the vehicle is located in front of the vehicle.

(Function) In the above-mentioned film forming apparatus, in the case of a sputtering apparatus, the rotation speed of the rotating jig can be changed, so if the speed is constant, a large amount of the film forming material will adhere to the parts where the film thickness is thinner.
By slowing down the rotation speed of the rotating jig, the film thickness can be made uniform. For example, when the film thickness at the center of the substrate is thicker as described above, it is better to have the edge of the substrate in front of the target than to have the center of the substrate in front of the target. The rotational speed may be controlled so that the rotational speed becomes relatively slow. In other words, in this latter state, there is little or no film-forming material adhering to the center of the substrate, but the film-forming material is adhering to either end of the substrate, so rotation Since the speed is slower, the amount of tubes at both ends of the board becomes larger than when the rotation speed is constant.

In addition, in the case of vapor deposition equipment, the rotation speed of the rotating jig can be changed, so if a constant speed is used, when a large amount of the film forming material is deposited on the thinner part, by slowing down the rotation speed of the rotating jig, , the thickness of the deposited film can be made uniform.

For example, when the film thickness at the center of the substrate is thicker as described above, it is better to have the edge of the substrate in front of the evaporation source than to have the center of the substrate in front of the evaporation source. The rotation speed may be controlled so that the rotation speed becomes relatively slow.

In other words, in this latter state, there is little or no deposition material at the center of the substrate, but the deposition material is deposited at either end of the substrate. Since the speed is slower, the amount of evaporation at both ends of the substrate becomes larger than when the rotation speed is constant.

(Effects of the Invention) Therefore, according to the present invention, the rotational speed of the rotating jig is changed from when one end of the substrate mounting surface in the rotational direction is located in front of the target or the evaporation source to Since the control means is provided to change the state between when the other end is located in front of the target or the evaporation source, the center part of the board mounting surface is located in front of the target or the evaporation source. By controlling the rotation speed of the rotating jig so that it is relatively slower when the end is located in front of the target or evaporation source,
It becomes possible to make the film thickness uniform on one substrate, or to reduce the difference in the film thickness of each substrate on one substrate mounting surface.

(Example) Embodiments of the present invention will be described below based on the drawings.

Embodiment 1 - This embodiment is an example of a carousel type sputtering apparatus, and is shown in FIGS. 1 to 3.

In FIG. 1, 1 is a vacuum chamber equipped with a sputter gas introduction boat 2, an exhaust boat 3 for evacuation, and an exhaust boat 4 for sputter gas, and a turntable 5 is installed at the center of the bottom of the chamber with its axis vertically aligned. It is provided. A car cell type rotating jig 6 in which a plurality of board mounting surfaces 6a are arranged in a polygonal (octagonal in this example) cross section is erected on the turntable 5. vacuum)!
It is designed to be driven by a servo drive means 7 disposed below 1. Further, in the vacuum amount 1, a pair of targets 8, 8 are disposed around the outer periphery of the rotating jig 6, facing each other with the rotating jig 6 in between, as shown in FIG. .

Further, in the vacuum chamber 1, shutters 9, 9 for each of the targets 8.8 are rotatably supported by a motor 10 on the ceiling plate of the vacuum chamber 1, and a halogen lamp heater 11 is provided. is installed.

The servo driving means 7 has a rotor 12. The rotor 12 is provided with a stator 13, and its drive is controlled by a control means 15 based on the output of an encoder 14 that detects the position of the rotor 12. In this case, the control means 15 receives the output of the encoder 14 and controls the rotational speed of the turntable 5, that is, the substrate a shown in FIG. From the time when one end in the rotational direction of each board mounting surface 6a is located in front of the target 8, the other end in the rotational direction of the board mounting surface 6a is located in front of the target 8 so as to be substantially constant over the entire surface. It changes from time to time.

That is, the deposition material ff per unit time on the substrate a
1T, the correction coefficient when changing the rotational speed of the substrate a is K(β), and θ for simplicity.

-a. If we ignore the proportionality constant, then at the tip C in the rotational direction of the substrate a, T (C) −
f K (β)・cosβdβ The middle substrate direction of substrate a is T (Q) −1K (β)・cosβdβ At the rear end of substrate a in the circuit board direction, T (D) −1K (β
)・cosβdβ.

Therefore, if K(β)-1/cosβ, then T (C)
-T (Q) -T (D). That is, the control means 15 controls the turntable 5, that is, the rotating jig 6.
The rotational speed of K(β) − above is set to the preset average value.
By giving a sinusoidal amplitude (for example, ±10%) corresponding to 1/cos β, when the center of the substrate a in the rotation direction is located in front of the target 8, the substrate a
Control is performed so that the rotation speed becomes slower when the end in the rotation direction is located in front of the target 8. in this case,
The encoder 14 detects the deviation angle β of the substrate a from a reference position where the substrate a and the target 8 are parallel and face each other, that is, the center of the substrate a is located in front of the target 8. The detection signal will be given to the control means 15.

Further, as shown in FIG.
It is maintained at Further, a plurality of magnets 18 are arranged at intervals on the back of the target 8. Further, the peripheral wall of the vacuum chamber 1 has a movable wall 1b connected by a hinge 19 to a fixed wall 1a provided with exhaust ports 3 and 4 for evacuation and for sputtering gas. At 1b, the vacuum chamber 1 is opened and closed to take in and out the rotary jig 6 to which the substrate a is attached.

Therefore, in the film forming apparatus described above, the rotating jig 6 to which the substrate a is attached is placed in the vacuum chamber 1 and placed on the turntable 5. Then, the pressure inside the vacuum chamber 1 is lowered by exhausting air from the exhaust port 3 for evacuation using a large vacuum pump, and then sputter gas is introduced from the introduction boat 2, and a small Sputtering is performed at a constant temperature using a heater 11 while evacuating the inside of the vacuum chamber 1 to a constant vacuum pressure using a vacuum pump.

This sputtering is performed while rotating the rotating jig 6, so that each substrate mounting surface 6a faces the front of the target 8 in sequence. As mentioned above, the rotational speed of this rotating jig 6 is J! The speed increases when the center in the rotation direction of temporary a is located in front of the target 8, but in this state, a large amount of the film forming material adheres to the center of the substrate a, and as the rotation speed becomes faster, Adhesion of the film-forming material at the center of the substrate a is suppressed. The rotational speed of the substrate a becomes slow when the end of the substrate a in the rotational direction is located in front of the target 8, but in this state, there is little or no deposition material attached to the central part of the substrate a. However, since the film forming material is attached to either end of the substrate a, the slower the rotation speed, the more the film forming material is attached to both ends of the substrate a. This reduces the difference in film thickness between the center and both ends of the substrate a.

In the above embodiment, the substrate a is flat, but if a thin film is to be formed on a curved substrate such as a screen of a cathode ray tube, the control means 15 may control the rotation control in consideration of the curvature of the substrate. The rotation speed of the tool 6 will be controlled. Further, the rotational speed of the rotating jig 6 can also be controlled by experimentally determining the most preferable speed change pattern.

In addition, in the above example, the rotation speed of the rotating jig was explained assuming that there was only one substrate, but when multiple substrates are connected at a certain angle, the boundary between adjacent substrates becomes the target. The rotational speed of the rotating jig is set to be the slowest when the rotating jig is located at the center of (the state shown in FIG. 2).

Further, although the above embodiment uses a rotating jig having an octagonal cross section, it goes without saying that the present invention can also be applied to rotating jigs having other polygonal shapes.

Embodiment 2 - This embodiment is an example of a dome-shaped vapor deposition apparatus, and is shown in FIGS. 4 and 5. This vapor deposition apparatus employs a thermal vapor deposition method.

In FIG. 4, reference numeral 21 denotes a vacuum chamber for performing vapor deposition on the substrate a, and an evaporation source 24 that is heated and evaporated by an electron beam from an electron gun 23 is provided at the bottom of the vacuum chamber. A ring-shaped base 25 is supported on the inner wall surface of the vacuum chamber 21, and a dome-shaped rotating jig has a plurality of flat substrate holders 26 arranged in a polygonal pyramid shape to attach the substrate a to the base 25. 27 is rotatably supported. The evaporation source 24 is connected to the substrate mounting surface 26 of the substrate holder 26 at a specific rotational position.
It is provided so as to face a.

The board holder 26 has a plurality of mounting holes for each mounting the board a. Films are formed on both sides of the substrate a, and both sides of the substrate a are directed toward the evaporation source 24 by reversing the substrate holder 26 while it is attached to the mounting hole.

First, the rotating jig 27 is rotated by a support roller 28 supported by a horizontal axis on the circumferential surface of the base 25 and a rotation position regulating roller 29 supported by a vertical axis on the periphery of the upper surface of the base 25. It consists of a freely supported ring gear 31 and a bed 32 supported on the ring gear 31. In order to rotationally drive the ring gear 31, a servo drive means 33 is provided with an encoder similar to that in the first embodiment on its side.
is provided, and its power can be transmitted to the ring gear 31 via a drive gear 34 and an intermediate gear 35.

Then, the servo drive means 33 controls the rotational speed of the rotating jig 27 based on the output of the encoder.
A control means 40 is provided to control the amount of the film-forming material to be deposited at each part of 6a to be substantially constant. That is, similarly to the first embodiment, the control means 40 of this embodiment also controls the rotation speed of the rotating jig 27 such that one end of the substrate mounting surface 26a of each substrate holder 26 in the rotation direction is in front of the evaporation source 24. The position is changed from when the other end of the substrate mounting surface 26a in the rotational direction is located in front of the evaporation source 24.

The bed 32 includes a ring-shaped base 36 supported by the ring gear 31 and a ring member 3 fixed thereon.
As shown in FIG. 2, a plurality of radial frames 39 are disposed radially between the ring member 37 and a center member 38 provided at a high position in the center thereof. Then, the center member 38 and the ring member 37
A plurality of rotation support shafts 43 extending in the radial direction are provided between the two. That is, these rotational shafts 43 support and invert the substrate holder 26.

Further, in order to reverse the substrate holder 26, an arm is coupled to the rotation support shaft 43 and protrudes radially from the bearing portion of the ring member 37 as a means 44 for applying rotational force to the rotation support shaft 43. member 45 and vacuum chamber 1
A side drive member 46 is provided.

That is, the arm member 45 has an arm 45a arranged in a cross shape and a cam 45b on a shaft connected to the rotation support shaft 43, as shown in FIG. The cam 45b has recesses formed at angular intervals of 90 degrees on its circumferential surface, and a ball 47 that can fit into the recesses is attached to the cam 45 by a spring 48.
5b. On the other hand, the driving member 46 is provided at a position corresponding to the rotation locus of the arm member 45, and a solenoid 46a drives the arm 45a.
It is provided with a rod 46b that is moved forward and backward toward.

Further, the base 25 is provided with a limit switch 49 for detecting the rotational position of the rotating jig 27.

Therefore, when forming a film using the above vapor deposition apparatus, the substrate a is held in the substrate holder 26 of the rotating jig 27, and the driving member 4
The rotating jig 27 is rotated once with the rod 46b of No. 6 protruding. As a result, the arm member 45 connected to each rotation support shaft 43 is connected to the rod 4 to the arm 45a.
6b, the substrate holder 26 rotates at an angle of 90 degrees or less as the rotation jig 27 rotates, and each substrate holder 26 rotates by the same angle. By performing this rotation once or twice, each substrate holder 26 can be sequentially brought into a state facing the evaporation source 4 side.

Then, with the inside of the vacuum chamber 21 set to a predetermined degree of vacuum, and the rod 46b of the driving member 46 retracted, the evaporation source 24 is irradiated with an electron beam while the rotating jig 27 is rotated to remove the film-forming material. is evaporated, and a film forming material is deposited on each substrate a. At that time, each board mounting surface 26a is connected to the evaporation source 2.
You will face the front of 4 one after another. and,
The rotational speed of the rotating jig 27 is increased when the center of the substrate mounting surface 26a of each substrate holder 26 in the rotational direction is located in front of the evaporation source 24, and By controlling the evaporation rate to be slower when positioned in front of the substrate holder 26, the amount of evaporation on each substrate a held in each substrate holder 26 becomes approximately equal, and the film thickness of each substrate a can be made uniform. become.

When the film formation on one side of the substrate a is completed, the rotating jig 27 is rotated twice with the rod 46b of the driving member 46 protruding, thereby rotating the rotating shaft 43 twice by 90 degrees, and the substrate is rotated. The holder 26 is placed in an inverted state. Then, as before, while rotating the rotating jig 27, the film forming material is deposited on each substrate a.

Embodiment 3 - This embodiment is an example of a drum-type vapor deposition apparatus, and is shown in FIGS. 6 and 7. This vapor deposition apparatus employs a thermal vapor deposition method.

In FIGS. 6 and 7, 51 is a cylindrical vacuum chamber with its axis set horizontally, 52 is a rotating jig whose axis is horizontally moved in and out of the vacuum chamber 51, and 53 is a film forming material. is a source of evaporation.

The rotating jig 52 includes a plurality of support bars 55 provided at intervals in the circumferential direction between the end plates 54. Two pieces can be supported side by side. This rotating jig 52
In this case, each board mounting surface constituted by adjacent support bars 55, 55 is arranged in a hexagonal cross section. The evaporation source 53 is of a resistance heating type in which the film-forming material is heated and evaporated using a coil, and is provided in the rotating jig 52 so as to face upward.

Although not shown, the driving means for the rotating jig 52 is a servo-type driving means with an encoder similar to that of the previous embodiment, and rotates based on the output of the encoder. A control means is provided for controlling the rotational speed of the jig 52 so that the amount of deposition material on the substrate a is approximately constant over the entire surface of the substrate a. That is, the control means of this example also controls the rotational speed of the rotating jig 52 from when one end of each substrate mounting surface in the rotational direction is located in front of the evaporation source 53 to the other end of the substrate mounting surface in the rotational direction. It changes between when the evaporation source 53 is located in front of the evaporation source 53.

Therefore, also in the film forming apparatus of this example, the rotating jig 52
As a result of the rotation, each substrate mounting surface sequentially faces the front of the evaporation source 53.

The rotational speed of the rotating jig 52 is increased when the center of each substrate mounting surface in the rotational direction is located in front of the evaporation source 53, and the rotational speed of the rotating jig 52 is increased when the center of each substrate mounting surface in the rotational direction is located in front of the evaporation source 53. By controlling the amount of evaporation to be delayed at the same time, it is possible to make the amount of vapor deposition on the substrate a attached to each of these substrate mounting surfaces substantially equal over the entire surface thereof.

In addition to the above-mentioned embodiments, the present invention can be applied to various types of sputtering apparatuses and vapor deposition apparatuses such as carcell type, dome type, and drum type. In this case, the vapor deposition apparatus may also include other film forming apparatuses such as an ion blating apparatus that performs vapor deposition by ionizing evaporated particles of the film forming material.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of the film forming apparatus of Example 1, FIG. 2 is a partially cutaway plan view of the same apparatus, and FIG. 3 is a schematic plan view showing the relationship between the substrate and target on the same side. Figure 4 shows Example 2
FIG. 5 is a front view showing the rotating means for inverting the substrate of the same device, FIG. 6 is a side view of the film forming device of Example 3, and FIG. 7 is a cross-sectional view of the same device. The plan view and FIG. 8 are diagrams showing a conventional sputtering film thickness distribution. 1.21.51... Vacuum chamber 6.27.52... Rotating jig 6a, 26a... Board mounting surface 7.33... Drive means 8... Target 24.53... Evaporation source 15.40... Control means a... Substrate 1.21.51... Vacuum 1 cost 6, 27.52... Rotating jig 5a, 26a... Board mounting surface 7.33... Drive means 8... Target 24.53 . . . Evaporation source 1540 . . . Control means a . . . Board diagram

Claims (2)

[Claims] (1) A target and a rotating jig, which has a plurality of substrate mounting surfaces arranged circumferentially to which the substrates are attached and rotates so that each substrate mounting surface sequentially faces the target, are provided in the vacuum chamber, In a film forming apparatus that performs sputtering, the rotation speed of the rotating jig is set to
control means for changing the time between one end of each board mounting surface in the rotational direction being located in front of the target and the other end of the board mounting surface in the rotational direction being located in front of the target; A film forming apparatus characterized by: (2) An evaporation source that evaporates a film-forming material for forming a film on a substrate from a fixed position in the vacuum chamber, and a plurality of substrate mounting surfaces to which the substrates are attached are arranged circumferentially in the vacuum chamber. In a film forming apparatus that is provided with a rotating jig that rotates so that the substrate mounting surface sequentially faces the evaporation source, and is configured to evaporate the film forming material onto the substrate, the rotational speed of the rotating jig is set to vary according to each of the above. Control means for changing the substrate mounting surface from when one end in the rotational direction is located in front of the evaporation source to when the other end of the substrate mounting surface in the rotational direction is located in front of the evaporation source. A film forming apparatus characterized by: