JPH07166381A - 銅および銅合金の表面処理剤 - Google Patents
銅および銅合金の表面処理剤Info
- Publication number
- JPH07166381A JPH07166381A JP34115393A JP34115393A JPH07166381A JP H07166381 A JPH07166381 A JP H07166381A JP 34115393 A JP34115393 A JP 34115393A JP 34115393 A JP34115393 A JP 34115393A JP H07166381 A JPH07166381 A JP H07166381A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- acid
- treating agent
- metal
- surface treating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34115393A JPH07166381A (ja) | 1993-12-13 | 1993-12-13 | 銅および銅合金の表面処理剤 |
| TW82110575A TW256857B (enExample) | 1993-12-13 | 1993-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34115393A JPH07166381A (ja) | 1993-12-13 | 1993-12-13 | 銅および銅合金の表面処理剤 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07166381A true JPH07166381A (ja) | 1995-06-27 |
Family
ID=18343746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34115393A Pending JPH07166381A (ja) | 1993-12-13 | 1993-12-13 | 銅および銅合金の表面処理剤 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH07166381A (enExample) |
| TW (1) | TW256857B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0791671A1 (en) * | 1996-02-26 | 1997-08-27 | Shikoku Chemicals Corporation | Surface treating agent for copper or copper alloy |
| JP2014101554A (ja) * | 2012-11-20 | 2014-06-05 | Shikoku Chem Corp | 銅または銅合金の表面処理液及びその利用 |
-
1993
- 1993-12-13 JP JP34115393A patent/JPH07166381A/ja active Pending
- 1993-12-14 TW TW82110575A patent/TW256857B/zh active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0791671A1 (en) * | 1996-02-26 | 1997-08-27 | Shikoku Chemicals Corporation | Surface treating agent for copper or copper alloy |
| US5795409A (en) * | 1996-02-26 | 1998-08-18 | Shikoku Chemicals Corporation | Surface treating agent for copper or copper alloy |
| KR100473905B1 (ko) * | 1996-02-26 | 2005-09-06 | 시코쿠 가세이 고교 가부시키가이샤 | 구리또는구리합금용표면처리제및이를사용하는표면처리방법 |
| JP2014101554A (ja) * | 2012-11-20 | 2014-06-05 | Shikoku Chem Corp | 銅または銅合金の表面処理液及びその利用 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW256857B (enExample) | 1995-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5439783A (en) | Composition for treating copper or copper alloys | |
| KR100263516B1 (ko) | 벤즈이미다졸 유도체 및 이를 함유하는 동 및 동합금의 표면처리 조성물 | |
| KR19990022285A (ko) | 구리표면 보호용 유기금속계 복합 피복물 | |
| KR20150085542A (ko) | 구리 및 구리합금의 표면에 피막을 형성하는 프리플럭스 조성물 | |
| EP0428260B1 (en) | Metal surface treatment agents | |
| JP4647073B2 (ja) | 銅及び銅合金のはんだ付け方法 | |
| JP2007308776A (ja) | 金属の表面処理剤およびその利用 | |
| CN101713089A (zh) | 金属表面处理水溶液和抑制金属表面晶须的方法 | |
| JP2005068530A (ja) | 表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 | |
| JP2009500842A (ja) | プリフラックス組成物 | |
| JP2007297685A (ja) | 金属の表面処理剤およびその利用 | |
| JPH07166381A (ja) | 銅および銅合金の表面処理剤 | |
| JP2923596B2 (ja) | イミダゾール系化合物を用いた銅および銅合金の表面処理剤 | |
| CN101348913B (zh) | 表面处理剂 | |
| JPH0779061A (ja) | 銅および銅合金の表面処理剤 | |
| JPH03124395A (ja) | はんだ付け用プレフラックス | |
| JPH06268356A (ja) | プリフラックスの使用方法およびプリント配線板の製造方法 | |
| JP2913410B2 (ja) | 銅又は銅合金の表面処理剤 | |
| US5631091A (en) | Bismuth coating protection for copper | |
| JPH05230674A (ja) | 金属の表面処理方法 | |
| JPH07330738A (ja) | 金属の表面保護剤ならびにそれを用いた製造方法 | |
| JPH06299375A (ja) | はんだ、無電解はんだ、銀、ニッケル、亜鉛、銅、銅合金等 の金属の表面処理方法 | |
| JP3677990B2 (ja) | 封孔処理剤 | |
| JPH05156475A (ja) | 金属の表面処理方法 | |
| JPH05202492A (ja) | 金属の表面処理方法 |