JPH0715100Y2 - 回路基板用リード端子 - Google Patents
回路基板用リード端子Info
- Publication number
- JPH0715100Y2 JPH0715100Y2 JP1990032120U JP3212090U JPH0715100Y2 JP H0715100 Y2 JPH0715100 Y2 JP H0715100Y2 JP 1990032120 U JP1990032120 U JP 1990032120U JP 3212090 U JP3212090 U JP 3212090U JP H0715100 Y2 JPH0715100 Y2 JP H0715100Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead terminal
- lead
- electrode land
- surface portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032120U JPH0715100Y2 (ja) | 1990-03-28 | 1990-03-28 | 回路基板用リード端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032120U JPH0715100Y2 (ja) | 1990-03-28 | 1990-03-28 | 回路基板用リード端子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03124476U JPH03124476U (enrdf_load_stackoverflow) | 1991-12-17 |
| JPH0715100Y2 true JPH0715100Y2 (ja) | 1995-04-10 |
Family
ID=31535011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990032120U Expired - Lifetime JPH0715100Y2 (ja) | 1990-03-28 | 1990-03-28 | 回路基板用リード端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0715100Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-03-28 JP JP1990032120U patent/JPH0715100Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03124476U (enrdf_load_stackoverflow) | 1991-12-17 |
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