JPH0713240Y2 - 半導体光学能動素子用パッケージ - Google Patents

半導体光学能動素子用パッケージ

Info

Publication number
JPH0713240Y2
JPH0713240Y2 JP1988112881U JP11288188U JPH0713240Y2 JP H0713240 Y2 JPH0713240 Y2 JP H0713240Y2 JP 1988112881 U JP1988112881 U JP 1988112881U JP 11288188 U JP11288188 U JP 11288188U JP H0713240 Y2 JPH0713240 Y2 JP H0713240Y2
Authority
JP
Japan
Prior art keywords
cap
package
heat sink
optical
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988112881U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0235454U (enrdf_load_html_response
Inventor
剛 藤谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP1988112881U priority Critical patent/JPH0713240Y2/ja
Publication of JPH0235454U publication Critical patent/JPH0235454U/ja
Application granted granted Critical
Publication of JPH0713240Y2 publication Critical patent/JPH0713240Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
JP1988112881U 1988-08-29 1988-08-29 半導体光学能動素子用パッケージ Expired - Lifetime JPH0713240Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988112881U JPH0713240Y2 (ja) 1988-08-29 1988-08-29 半導体光学能動素子用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988112881U JPH0713240Y2 (ja) 1988-08-29 1988-08-29 半導体光学能動素子用パッケージ

Publications (2)

Publication Number Publication Date
JPH0235454U JPH0235454U (enrdf_load_html_response) 1990-03-07
JPH0713240Y2 true JPH0713240Y2 (ja) 1995-03-29

Family

ID=31352223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988112881U Expired - Lifetime JPH0713240Y2 (ja) 1988-08-29 1988-08-29 半導体光学能動素子用パッケージ

Country Status (1)

Country Link
JP (1) JPH0713240Y2 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2947330B2 (ja) * 1995-02-13 1999-09-13 日本電気株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0235454U (enrdf_load_html_response) 1990-03-07

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