JPH07123180B2 - Method for manufacturing circuit board device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed circuit board or a circuit board device similar thereto.

[0002]

2. Description of the Related Art In order to reduce the size of electronic circuit devices, wiring conductors are often provided on both the front and back surfaces of a circuit board.

[0003]

The pattern of the wiring conductor on the front surface side of the circuit board and the pattern of the wiring conductor on the back surface side are usually not the same. Therefore, two types of masks are required to selectively form the wiring conductors of a desired pattern on both the front surface side and the back surface side of the circuit board using the resist.

When mounting electronic components such as transistors, capacitors and ICs on the circuit board, both a device for mounting the electronic components on the front surface of the circuit board and a device for mounting the electronic components on the rear surface side are provided. Was needed. Therefore, the cost of the manufacturing apparatus becomes high and the manufacturing process becomes complicated.

Therefore, an object of the present invention is to provide a method of manufacturing a circuit board device which can simplify the manufacturing apparatus and the manufacturing process.

[0006]

In order to achieve the above object, the present invention has at least first and second wiring conductors each having a first pattern on its front surface and a second pattern on its back surface. In a method of manufacturing a second circuit board device, a step of preparing a circuit board having first and second portions for forming the first and second circuit board devices; The wiring conductor of the first pattern is formed on the first portion on the main surface side, and the second conductor is formed.
Forming a wiring conductor of the second pattern in the portion of the first pattern, and the first main surface side of the circuit board on the one main surface side.
The second main surface of the circuit board so that the same pattern as the combination pattern of the wiring conductor of the second pattern and the wiring conductor of the second pattern is generated on the second main surface of the circuit board. Forming a wiring conductor having the first pattern on the first portion and forming a wiring conductor having the second pattern on the first portion; and separating the first and second portions from the circuit board. And a process for manufacturing a circuit board device.

The same technical idea as that of the invention of claim 1 can be applied to a case where an electronic component is connected to a wiring conductor, that is, mounted, as shown in claim 2. Also,
As described in claims 3 and 4, when the wiring conductor is formed from a state in which the first and second circuit boards are separated in advance, and when the electronic component is mounted, the same technical idea as in claim 1 Can be applied.

[0008]

According to the present invention, the wiring conductor of the first pattern and the wiring conductor of the second pattern are respectively formed on both one and the other main surfaces of the circuit board, and one main surface side Since the combination pattern of the first and second portions on the other main surface side is the same, the wiring conductors on the front surface side and the back surface side of the first and second circuit board devices are formed by the same device and the same method. It is possible to reduce the cost of manufacturing equipment,
And the work is simplified. According to the second aspect, since the electronic components can be mounted on the front surface side and the back surface side of the circuit board device by the same device and the same method, the cost of the mounting device can be reduced, and the mounting work is simple. Be converted. As in claims 3 and 4, when the first and second circuit boards are separated from the beginning, the positional relationship between the first and second circuit boards is the same as in claims 1 and 2. The same effect can be obtained by keeping it.

[0009]

[First Embodiment] Next, a method of manufacturing a circuit board device according to a first embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 1, the first, second, third and fourth
A circuit board 1 made of a glass epoxy insulating substrate having the circuit board portions 2a, 2b, 2c and 2d is prepared. The circuit board 1 has, in addition to the first to fourth circuit board portions 2a to 2d, a frame-shaped portion 3 and a connection strip portion 4 for connecting these to each other. In this embodiment, the circuit board 1 includes four circuit board portions 2a to 2d, but the number can be any even number. The circuit board 1 is formed symmetrically with respect to the center line 5, the first and second circuit board portions 2a and 2b are arranged symmetrically to each other, and the third and fourth circuit board portions 2c and 2d. Are also arranged symmetrically to each other. The cutouts 6 provided at the corners of the circuit board portions 2a to 2d are used as direction indicating marks.

A groove 7 for separation is formed on substantially the entire front surface (one main surface) 1a and back surface (the other main surface) 1b of the circuit board 1.
Before or after the formation of the metal foil, a metal foil is adhered to non-selectively form a metal layer (not shown).

Next, a photosensitive resist (not shown) is applied on the metal layer (not shown) on the surface 1a side of the circuit board 1 and selectively exposed using a mask (not shown). To do.
In addition, a photosensitive resist (not shown) is coated on the metal layer (not shown) on the back surface 1b side of the circuit board 1 and selectively exposed using the same mask as the front surface side. , The non-exposed portion is removed by etching to leave a resist mask, and the metal layer is selectively removed by etching using this, and the front surface 1a and the back surface 1b of the circuit board 1 are described with reference to FIGS. Wiring conductors 8a to 8d and 9a to 9d
To form. It should be noted that wiring conductors are formed in a complicated manner on an actual circuit board.
Shows only part of the wiring conductor.

It should be noted here that since the entire patterns (combination patterns) of the wiring conductors on the front surface 1a and the back surface 1b of the circuit board 1 are the same, the same method is used by using the same mask. That is, the wiring conductor is formed. In order to make the wiring conductor patterns the same on the front surface 1a and the back surface 1b, the wiring conductor 8 having the first pattern is formed on the first and third circuit board portions 2a and 2c on the front surface 1a side.
a and 8b are arranged, and the second and fourth circuit board portions 2 are provided.
The wiring conductors 9b and 9d of the second pattern are arranged on b and 2d, and as is apparent from FIG. 2, on the back surface 1b side of the circuit board 1, the first and third circuit board portions 2 are formed.
The wiring conductors 9a and 9c of the second pattern are arranged on a and 2c, and the wiring conductors 8b and 8d of the first pattern are arranged on the second and fourth circuit board portions 2b and 2d. First
The wiring conductors 8a to 8d of the first pattern of the fourth circuit board portions 2a to 2d have the same pattern, and the wiring conductors 9a to 9d of the second pattern also have the same pattern. These wiring conductor patterns 8a to 8d, 9a to
9d has the same positional relationship with the notch 6 as the reference position mark of each circuit board portion 2a to 2d.

2 is a bottom view of the circuit board 1 of FIG. Similar to FIG. 1, first to fourth circuit board portions 2a to 2d are sequentially arranged from the left to the right.
2 does not have the same pattern as that of FIG. 1, but when the circuit board 1 is rotated 180 degrees from the position of FIG. Since the combination pattern on the front surface 1a side and the rear surface 1b side of the circuit board 1 are the same, it is possible to form the wiring conductors on the front surface 1a side and the rear surface 1b side by using the same mask as described above. become,
The cost of the mask can be halved.

When the strip portion 4 is cut in the state shown in FIGS. 1 and 2, the first to fourth circuit board portions 2a to 2d are separated and the first side wiring conductors 8a to 8d,
It is possible to obtain four circuit boards having the same configuration, which have the second pattern wiring conductors 9a to 9d on the back surface side. However, in this embodiment, the electronic components are not separated in the state shown in FIGS. 1 and 2 but mounted on the individual circuit boards.

In FIG. 3, the electronic component mounting apparatus 10 is used to mount the first type electronic components 11a, 11 on the surface 1a side of the circuit board 1.
c and the second-type electronic components 12b and 12d are surface-mounted,
A state in which these are connected to the land portions of the wiring conductors 8a, 8c, 9b, 9d by solder (not shown) is shown. In FIG. 4, the same electronic component mounting apparatus 10 as in FIG. 3 is used to surface mount the first type electronic components 11b and 11d and the second type electronic components 12a and 12c on the back surface 1b of the circuit board 1, A state in which these are connected to the land portions of the wiring conductors 8b, 8d, 9a and 9c by solder (not shown) is shown. 4th as shown in FIG.
If the rear surface 1b side of the circuit board 1 is arranged so that the circuit board portion 2d of FIG. 3 is on the leftmost side, the positional relationship between the electronic component mounting apparatus 10 and the wiring conductors 8b, 8d, 9a, 9c is the same as the front surface side of FIG. Then, the electronic components 11b, 11d, 12a, 12 are used in the same procedure using the same electronic component mounting apparatus 10.
c can be surface-mounted by, for example, the solder reflow method. As a result, cost reduction of the electronic component mounting apparatus 10 and simplification of mounting work are achieved.

When the mounting of the electronic components 11a to 11d and 12a to 12d on the front surface 1a and the back surface 1b of the circuit board 1 is completed, the connecting strip portion 4 is cut to obtain four independent circuit board devices. First to fourth circuit board portions 2a to 2
The four circuit board devices corresponding to d have the same structure.
As shown in FIG. 5, on the surface 15 of the circuit board 14 of the circuit board device 13 formed based on the first circuit board portion 2a, the first pattern electronic component 11a is formed on the wiring conductor 8a of the first pattern. Is installed. As shown in FIG. 6, on the back surface 16 of the circuit board 14, the second-type electronic component 12a is mounted on the wiring conductor 9a of the second pattern. The circuit board device based on the second to fourth circuit board portions 2b to 2d also has the same structure as in FIGS.

[0017]

[Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIG. However, in FIG. 7, the same parts as those in FIGS. 1 to 6 are designated by the same reference numerals, and the description thereof will be omitted.

In the second embodiment, the first to fourth circuit boards 14a, 14b, 14c and 14d are separated from the beginning and are connected to each other by the holder 20. Also,
On the surface 15 of the first and third circuit boards 14a and 14c, wiring conductors 8a and 8c having the same first pattern as that of the first and third circuit board portions of FIG. 1 are formed, respectively. The surface 15 of the circuit boards 14b and 14d of FIG.
Also, wiring conductors 9b and 9d of the same second pattern as the fourth circuit board portions 2b and 2d are formed, respectively. First
And the back surfaces of the third circuit boards 14a and 14c (not shown)
2 is formed with the same pattern (not shown) as the wiring conductors 9a, 9c of the second pattern on the back surface of the first and third circuit board portions 2a, 2c of FIG. On the front surface (not shown) of the circuit boards 14b and 14d, the same pattern (not shown) as the wiring conductors 8b and 8d of the first pattern on the back surface side of the second and fourth circuit board portions 2b and 2d of FIG. ) Is formed. In short, the combination pattern of the wiring conductors 8a, 8c, 9b, 9d on the one main surface side in the assembly of the first to fourth circuit boards 14a to 14d shown in FIG. 7 is substantially the same as that of FIG. The wiring conductor combination pattern on the other main surface side is substantially the same as that shown in FIG. As a result, the assembly shown in FIG. 7 can be handled in the same manner as the circuit board 1 shown in FIGS. 1 and 2, so that one electronic component mounting apparatus can be applied to both the front surface side and the back surface side of the assembly. And electronic parts (not shown) are mounted similarly to FIG. After the mounting of the electronic components similar to those in FIGS. 3 and 4 is completed, the holder 20 is removed from the first to fourth circuit boards 14a to 14
Remove d. As a result, four circuit board devices having the same structure as the circuit board device 13 shown in FIGS. 5 and 6 are obtained. Also in FIG. 7, since electronic components can be mounted on the front surface side and the back surface side of the assembly by the same electronic component mounting device, it is possible to obtain the same effect as that of the first embodiment.

[0019]

MODIFICATION The present invention is not limited to the above-mentioned embodiments, and the following modifications are possible. (1) The present invention can also be applied to a case where a circuit board device is manufactured using a ceramic circuit board having a plurality of circuit board portions. (2) It is possible to form a wiring conductor by vapor deposition, or to make a resist on a metal foil by using a screen and bake this to use as a mask to etch the metal foil to form a wiring conductor. (3) The present invention is suitable for a method of surface-mounting a chip-shaped electronic component by using a solder reflow method, but the invention is not limited to this, and a through hole is provided in a circuit board and an electronic component having a lead wire is provided. It can also be applied to the case where a lead is inserted to mount an electronic component.

[Brief description of drawings]

FIG. 1 is a plan view showing a front surface side of a circuit board according to a first embodiment of the present invention.

FIG. 2 is a bottom view of the circuit board shown in FIG.

FIG. 3 is a plan view showing a state where electronic components are mounted on the front surface side of a circuit board.

FIG. 4 is a plan view showing a state where electronic components are mounted on the back surface side of the circuit board in the same manner as the front surface side.

5 is a plan view showing a circuit board device obtained by separating a first circuit board portion from the circuit board of FIG.

6 is a bottom view of the circuit board device of FIG.

FIG. 7 is a plan view showing a circuit board assembly according to a second embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2a-2d 1st-4th circuit board parts 8a-8d 1st wiring conductor 9a-9d 2nd wiring conductor 11a-11d 1st type electronic component 12a-12d 2nd Type of electronic components

Claims (4)

[Claims] 1. A method for manufacturing at least first and second circuit board devices, each having a wiring conductor of a first pattern on a front surface thereof and wiring conductors of a second pattern on a back surface thereof. And a first for forming a second circuit board device
And a step of preparing a circuit board having a second portion, the wiring conductor having the first pattern is formed on the first portion on one main surface side of the circuit board, and the wiring conductor is formed on the second portion. A step of forming a wiring conductor of a second pattern, and a pattern which is the same as the combination pattern of the wiring conductor of the first pattern and the wiring conductor of the second pattern on the one main surface side of the circuit board. A wiring conductor having the first pattern is formed on the second portion on the other main surface side of the circuit board so as to occur on the other main surface of the circuit board, and the wiring conductor of the first pattern is formed on the first portion. 2. A method of manufacturing a circuit board device, comprising: a step of forming a wiring conductor having a second pattern; and a step of separating the first and second portions from the circuit board. 2. A wiring conductor having a first pattern is formed on the first portion on one main surface side, the wiring conductor having at least first and second portions having substantially the same shape.
A wiring conductor having a second pattern is formed on the portion, a wiring conductor having the second pattern is formed on the first portion on the other main surface side, and the first portion is formed on the second portion.
And a combination pattern of the wiring conductor of the first pattern and the wiring conductor of the second pattern on the one main surface side is formed on the one main surface side and the other main surface side. A step of preparing a circuit board formed so as to be the same on the surface side, and the first and second patterns of the first and second portions on the one main surface side of the circuit board. Attaching the first and second electronic components to the wiring conductor; and the wiring conductors of the first and second patterns of the second and first portions on the other main surface side of the circuit board. And a step of mounting third and fourth electronic components substantially the same as the first and second electronic components, and a step of separating the first and second parts from the circuit board. And a method for manufacturing a circuit board device. 3. A first step of preparing first and second circuit boards having substantially the same shape, and a front surface of the first circuit board and a back surface of the second circuit board are flush with each other. So that the first and second circuit boards are juxtaposed to form a wiring conductor having a first pattern on the front surface of the first circuit board, and a second conductor is formed on the back surface of the second circuit board.
The second step of forming the wiring conductor having the pattern of, and the front surface of the second circuit board and the back surface of the first circuit board are on the same plane, and the positional relationship between them is the same as in the second step. The first circuit board and the second circuit board have the same positional relationship between the front surface of the first circuit board and the back surface of the second circuit board.
And a second circuit board, and the wiring conductor of the first pattern is formed on the surface of the second circuit board.
And a step of forming the wiring conductor of the second pattern on the back surface of the circuit board. 4. A first step of preparing at least first and second circuit boards each having a wiring conductor of a first pattern formed on a front surface thereof and wiring conductors of a second pattern formed on a back surface thereof, respectively. , The first and second circuit boards are juxtaposed so that the front surface of the first circuit board and the back surface of the second circuit board are flush with each other. Connecting the first electronic component to the wiring conductor of the pattern and connecting the second electronic component to the wiring conductor of the second pattern on the back surface of the second circuit board; The front surface of the circuit board and the back surface of the first circuit board are on the same plane, and the positional relationship between them is the front surface of the first circuit board and the back surface of the second circuit board in the second step. And the first position so that the positional relationship with
And a second circuit board, and a third electronic component having the same structure as the first electronic component is connected to the wiring conductor of the first pattern on the surface of the second circuit substrate, A step of connecting a fourth electronic component having the same structure as the second electronic component to the wiring conductor of the second pattern on the back surface of the circuit substrate. .