JPH07122684A - Liquid epoxy resin composition - Google Patents
Liquid epoxy resin compositionInfo
- Publication number
- JPH07122684A JPH07122684A JP5267386A JP26738693A JPH07122684A JP H07122684 A JPH07122684 A JP H07122684A JP 5267386 A JP5267386 A JP 5267386A JP 26738693 A JP26738693 A JP 26738693A JP H07122684 A JPH07122684 A JP H07122684A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid epoxy
- resin composition
- wire
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体等の電子部品を
実装した電子部品実装装置、特にＣＯＢ（chip on boar
d)用の封止樹脂として使用される液状エポキシ樹脂組成
物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus on which electronic components such as semiconductors are mounted, and particularly COB (chip on boar).
The present invention relates to a liquid epoxy resin composition used as a sealing resin for d).
【０００２】[0002]
【従来の技術】図１にはＣＯＢと称される電子部品実装
装置が示してある。この装置は、ガラス布基材エポキシ
樹脂等の基板１に回路を形成すると共に基板１の表面に
半導体等の電子部品２を搭載し、この電子部品２と回路
とを金属製のワイヤー３でボンディングして電子部品２
と回路とを電気的に接続し、電子部品２とワイヤー３を
封止樹脂４で封止し、その後半田リフローに基板１を通
して半田付けをおこなうことによって形成されるもので
ある。2. Description of the Related Art FIG. 1 shows an electronic component mounting apparatus called COB. In this apparatus, a circuit is formed on a substrate 1 made of a glass cloth base epoxy resin, an electronic component 2 such as a semiconductor is mounted on the surface of the substrate 1, and the electronic component 2 and the circuit are bonded by a metal wire 3. Then electronic component 2
And the circuit are electrically connected, the electronic component 2 and the wire 3 are sealed with the sealing resin 4, and then the substrate 1 is passed through the solder reflow to perform soldering.
【０００３】このような電子部品実装装置において、従
来、ワイヤー３は一般的に金ワイヤー（直径２５μｍ程
度）で形成されるものであったが、最近、金ワイヤーよ
りも安価なアルミニウムワイヤー（直径２５μｍ程度）
を代替に用い、コストダウンを図るようにすることがお
こなわれている。In such an electronic component mounting apparatus, conventionally, the wire 3 has generally been formed of a gold wire (diameter of about 25 μm), but recently, an aluminum wire (diameter of 25 μm) which is cheaper than the gold wire. degree)
Has been used as a substitute to reduce costs.
【０００４】[0004]
【発明が解決しようとする課題】しかし上記のようなア
ルミニウムワイヤーを用いた電子部品実装装置に、金ワ
イヤーを用いた電子部品実装装置と同様の半田温度（２
６０℃程度）で半田付けをおこなうと、アルミニウムワ
イヤーは金ワイヤーよりも熱膨張係数が大きいので、半
田付けをおこなう際の半田の熱でアルミニウムワイヤー
は金ワイヤーよりも大きく伸長して断線し易く、金ワイ
ヤーを用いた電子部品実装装置では発生し難かった半田
付け時のワイヤー３の断線が、アルミニウムワイヤーを
用いた電子部品実装装置では多発するようになった。However, in the electronic component mounting apparatus using the aluminum wire as described above, the same soldering temperature (2) as in the electronic component mounting apparatus using the gold wire is used.
When soldering at about 60 ° C), the aluminum wire has a larger coefficient of thermal expansion than the gold wire, so the heat of the solder when soldering causes the aluminum wire to stretch more than the gold wire and easily break. Breakage of the wire 3 at the time of soldering, which was difficult to occur in the electronic component mounting apparatus using the gold wire, has frequently occurred in the electronic component mounting apparatus using the aluminum wire.
【０００５】本発明は上記の点に鑑みてなされたもので
あり、アルミニウムワイヤーを用いた電子部品実装装置
であっても半田付け時のワイヤーの断線が発生しないよ
うにすることができる液状エポキシ樹脂組成物を提供す
ることを目的とするものである。The present invention has been made in view of the above points, and even in an electronic component mounting apparatus using an aluminum wire, a liquid epoxy resin capable of preventing the wire from breaking during soldering. It is intended to provide a composition.
【０００６】[0006]
【課題を解決するための手段】本発明に係る液状エポキ
シ樹脂組成物は、基板１に電子部品２を実装すると共に
電子部品２と基板１に設けた回路とをアルミニウムで形
成されるワイヤー３でボンディングし、この電子部品２
とワイヤー３とを封止する液状エポキシ樹脂組成物にお
いて、フィラーとしてシリカを７５重量％以上含有して
成ることを特徴とするものである。A liquid epoxy resin composition according to the present invention mounts an electronic component 2 on a substrate 1 and a wire 3 made of aluminum for the electronic component 2 and a circuit provided on the substrate 1. Bond this electronic component 2
The liquid epoxy resin composition for sealing the wire 3 and the wire 3 is characterized by containing 75% by weight or more of silica as a filler.
【０００７】また本発明は、シリカとして球状シリカを
用いるのが好ましい。以下本発明を詳述する。本発明で
使用されるエポキシ樹脂は、例えばビスフェノールＡ型
エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ノボ
ラック型エポキシ樹脂、クレゾールノボラック型エポキ
シ樹脂、可撓性エポキシ樹脂、ハロゲン化エポキシ樹
脂、グリシジルエステル型エポキシ樹脂等の液状のエポ
キシ樹脂であれば何れでもよく、一液型であることが好
ましい。フィラーとしては球状シリカを用いることがで
きる。この球状シリカは溶融系で平均粒径が１５μｍで
あることが好ましい。平均粒径１５μｍの球状シリカ
は、粒径が１μｍ、６μｍ、１５μｍ、３０μｍの球状
シリカをそれぞれ１０重量％、３０重量％、２０重量
％、４０重量％の割合で配合することによって作成でき
る。硬化剤としては脂肪族ポリアミン、ポリアミド樹
脂、芳香族ジアミン等のアミン系硬化剤、酸無水物硬化
剤、ルイス酸錯化合物等を例示することができる。硬化
促進剤としてはリン系、イミダゾール系、三級アミン系
等のものを使用することができる。In the present invention, it is preferable to use spherical silica as the silica. The present invention will be described in detail below. The epoxy resin used in the present invention is, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, flexible epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin. Any liquid epoxy resin such as the above may be used, and a one-component type is preferable. Spherical silica can be used as the filler. This spherical silica is preferably in a molten system and has an average particle size of 15 μm. The spherical silica having an average particle size of 15 μm can be prepared by blending spherical silica having a particle size of 1 μm, 6 μm, 15 μm, and 30 μm in the proportions of 10% by weight, 30% by weight, 20% by weight, and 40% by weight, respectively. Examples of the curing agent include aliphatic polyamines, polyamide resins, amine-based curing agents such as aromatic diamines, acid anhydride curing agents, and Lewis acid complex compounds. As the curing accelerator, phosphorus-based ones, imidazole-based ones, tertiary amine-based ones and the like can be used.
【０００８】そして上記エポキシ樹脂、球状シリカ、硬
化剤、硬化促進剤及びカーボンブラック等の着色剤を混
練することによって本発明の液状エポキシ樹脂組成物を
形成することができる。液状エポキシ樹脂組成物は球状
シリカを７５重量％以上含有ように調製する。混練は三
本ロールによって強い混練をおこなうのが好ましく、ま
た全球状シリカとエポキシ樹脂の一部とを予めプレ混練
し、その後エポキシ樹脂の残り全部を配合して混練する
ようにしてもよい。The liquid epoxy resin composition of the present invention can be formed by kneading the above epoxy resin, spherical silica, a curing agent, a curing accelerator and a coloring agent such as carbon black. The liquid epoxy resin composition is prepared so as to contain spherical silica in an amount of 75% by weight or more. The kneading is preferably performed by three rolls, and it is also possible to pre-knead all spherical silica and a part of the epoxy resin in advance and then mix and knead the rest of the epoxy resin.
【０００９】このように調製される液状エポキシ樹脂組
成物は、フィラーとして配合された球状シリカの割合
（フィラー率）が７５重量％以上であるので、熱膨張係
数を１．８×１０-5以下の小さい値にすることができる
（ちなみにフィラー率が７０重量％であれば、熱膨張係
数は２．２×１０-5程度である）。よって電子部品２と
基板１に設けた回路とをアルミニウムのワイヤー３でボ
ンディングして形成される電子部品実装装置において、
電子部品２とワイヤー３とを封止する樹脂としてこの液
状エポキシ樹脂組成物を使用すると、半田付けの際の熱
でアルミニウムワイヤーが大きく伸長しないように熱膨
張係数の小さい液状エポキシ樹脂組成物の封止樹脂４で
抑えることができる。またフィラーとして球状シリカを
用いることで、球状でない通常のシリカを使用するより
も液状エポキシ樹脂組成物の粘度の上昇を抑えることが
でき、液状エポキシ樹脂組成物の流動性が低下するのを
防ぐことができる。The liquid epoxy resin composition thus prepared has a thermal expansion coefficient of 1.8 × 10 -5 or less because the proportion of spherical silica (filler ratio) blended as a filler is 75% by weight or more. (By the way, if the filler ratio is 70% by weight, the coefficient of thermal expansion is about 2.2 × 10 −5 ). Therefore, in the electronic component mounting apparatus formed by bonding the electronic component 2 and the circuit provided on the substrate 1 with the aluminum wire 3,
When this liquid epoxy resin composition is used as a resin for sealing the electronic component 2 and the wire 3, the liquid epoxy resin composition having a small coefficient of thermal expansion is sealed so that the aluminum wire does not greatly expand due to heat during soldering. It can be suppressed with the stop resin 4. Further, by using spherical silica as a filler, it is possible to suppress an increase in the viscosity of the liquid epoxy resin composition as compared with the case of using non-spherical ordinary silica, and to prevent the fluidity of the liquid epoxy resin composition from decreasing. You can
【００１０】[0010]
【実施例】以下本発明を実施例によって詳述する。 （実施例１） エポキシ樹脂としてビスフェノールＦ型
エポキシ樹脂を、硬化剤として酸無水物でＯＨ当量１６
８のメチルヘキサヒドロ無水フタル酸（ＭＨＨＰＡ）
を、硬化促進剤としてイミダゾールをそれぞれ使用し、
これらと平均粒径１５μｍの溶融系の球状シリカとカー
ボンブラックを表１に示す重量部数の割合（以下同じ）
で配合して混練し、フィラー率７５重量％の液状エポキ
シ樹脂組成物を作成した。EXAMPLES The present invention will be described in detail below with reference to examples. (Example 1) A bisphenol F type epoxy resin was used as an epoxy resin, and an acid anhydride was used as a curing agent and the OH equivalent was 16
8 Methylhexahydrophthalic anhydride (MHHPA)
, Each using imidazole as a curing accelerator,
The ratio of these and the fused type spherical silica having an average particle diameter of 15 μm and carbon black in parts by weight shown in Table 1 (the same applies hereinafter)
Was mixed and kneaded to prepare a liquid epoxy resin composition having a filler rate of 75% by weight.
【００１１】（実施例２） 上記実施例１と同様にビス
フェノールＦ型エポキシ樹脂、メチルヘキサヒドロ無水
フタル酸、イミダゾール、球状シリカとカーボンブラッ
クを表１に示す割合で配合して混練し、フィラー率８０
重量％の液状エポキシ樹脂組成物を作成した。 （実施例３） 上記実施例１と同様にビスフェノールＦ
型エポキシ樹脂、メチルヘキサヒドロ無水フタル酸、イ
ミダゾール、球状シリカとカーボンブラックを表１に示
す割合で配合して混練し、フィラー率８５重量％の液状
エポキシ樹脂組成物を作成した。(Example 2) As in Example 1 above, bisphenol F type epoxy resin, methylhexahydrophthalic anhydride, imidazole, spherical silica and carbon black were blended in the proportions shown in Table 1 and kneaded to obtain a filler ratio. 80
A wt% liquid epoxy resin composition was prepared. Example 3 Bisphenol F as in Example 1 above
Type epoxy resin, methylhexahydrophthalic anhydride, imidazole, spherical silica and carbon black were blended in a ratio shown in Table 1 and kneaded to prepare a liquid epoxy resin composition having a filler ratio of 85% by weight.
【００１２】（比較例１） 上記実施例１と同様にビス
フェノールＦ型エポキシ樹脂、メチルヘキサヒドロ無水
フタル酸、イミダゾール、球状シリカとカーボンブラッ
クを表１に示す割合で配合して混練し、フィラー率６５
重量％の液状エポキシ樹脂組成物を作成した。 （比較例２） 上記実施例１と同様にビスフェノールＦ
型エポキシ樹脂、メチルヘキサヒドロ無水フタル酸、イ
ミダゾール、球状シリカとカーボンブラックを表１に示
す割合で配合して混練し、フィラー率７０重量％の液状
エポキシ樹脂組成物を作成した。(Comparative Example 1) In the same manner as in Example 1 above, bisphenol F type epoxy resin, methylhexahydrophthalic anhydride, imidazole, spherical silica and carbon black were blended in the proportions shown in Table 1 and kneaded to obtain a filler ratio. 65
A wt% liquid epoxy resin composition was prepared. Comparative Example 2 Bisphenol F as in Example 1 above
Type epoxy resin, methylhexahydrophthalic anhydride, imidazole, spherical silica and carbon black were blended in a ratio shown in Table 1 and kneaded to prepare a liquid epoxy resin composition having a filler ratio of 70% by weight.
【００１３】上記実施例１乃至３、比較例１、２につい
て、それぞれの熱膨張係数と粘度を測定した。結果を表
１に示す。また実施例１乃至３、比較例１、２の液状エ
ポキシ樹脂組成物を用いて封止樹脂４を形成して図１に
示す電子部品実装装置をそれぞれ作成し、これらについ
てヒートサイクル試験と耐半田性試験をおこなった。The thermal expansion coefficient and viscosity of each of Examples 1 to 3 and Comparative Examples 1 and 2 were measured. The results are shown in Table 1. Further, the liquid epoxy resin compositions of Examples 1 to 3 and Comparative Examples 1 and 2 were used to form the encapsulating resin 4 to produce the electronic component mounting apparatuses shown in FIG. 1, respectively. A sex test was conducted.
【００１４】ヒートサイクル試験は上記電子部品実装装
置を−６５℃で３０分間処理した後、１５０℃で３０分
間処理することを一サイクルとし、このサイクルを１０
００回繰り返した後の不良個数を測定した。試料数は各
実施例及び比較例について１０個である。結果を表１に
示す。耐半田性試験では上記電子部品実装装置を２６０
℃の半田リフローに３０秒間、２回通した後の不良個数
を測定した。試料数は各実施例及び比較例について１０
個である。結果を表１に示す。In the heat cycle test, one cycle consists of treating the electronic component mounting apparatus at -65 ° C. for 30 minutes and then at 150 ° C. for 30 minutes.
The number of defectives after repeating 00 times was measured. The number of samples is 10 for each Example and Comparative Example. The results are shown in Table 1. In the solder resistance test, 260
The number of defectives was measured after passing through solder reflow at ℃ twice for 30 seconds. The number of samples is 10 for each Example and Comparative Example.
It is an individual. The results are shown in Table 1.
【００１５】尚、上記の不良とは、ワイヤー３に断線が
発生したり封止樹脂４にクラックやひび割れが発生した
りした場合をさす。The above-mentioned defects refer to cases where the wire 3 is broken or the sealing resin 4 is cracked or cracked.
【００１６】[0016]
【表１】 [Table 1]
【００１７】表１から判るように、実施例１乃至３の液
状エポキシ樹脂組成物は比較例１、２のものよりも熱膨
張係数を小さくすることができる。そして実施例１乃至
３の液状エポキシ樹脂組成物を使用した電子部品実装装
置では、ヒートサイクル試験及び耐半田性試験の何れの
試験においても不良が発生しなかった。それに比較して
比較例１、２の液状エポキシ樹脂組成物を使用した電子
部品実装装置では、ヒートサイクル試験及び耐半田性試
験で不良が発生し、特に耐半田性試験において不良の発
生する割合が多い。As can be seen from Table 1, the liquid epoxy resin compositions of Examples 1 to 3 can have a smaller coefficient of thermal expansion than those of Comparative Examples 1 and 2. Then, in the electronic component mounting apparatuses using the liquid epoxy resin compositions of Examples 1 to 3, no defects occurred in any of the heat cycle test and the solder resistance test. On the other hand, in the electronic component mounting apparatus using the liquid epoxy resin compositions of Comparative Examples 1 and 2, the heat cycle test and the soldering resistance test were defective, and the soldering resistance test was particularly defective. Many.
【００１８】[0018]
【発明の効果】上記のように本発明は、電子部品とワイ
ヤーとを封止する液状エポキシ樹脂組成物において、フ
ィラーとしてシリカを７５重量％以上含有したので、熱
膨張係数を従来の液状エポキシ樹脂組成物よりも小さい
値にすることができ、アルミニウムワイヤーを用いた電
子部品実装装置であってもこの液状エポキシ樹脂組成物
を封止樹脂として使用することによってアルミニウムワ
イヤーの伸長を押さえて半田付け時のワイヤーの断線が
発生しないようにすることができるものである。As described above, according to the present invention, since the liquid epoxy resin composition for sealing electronic parts and wires contains silica in an amount of 75% by weight or more as a filler, the thermal expansion coefficient of the conventional liquid epoxy resin composition is The value can be made smaller than that of the composition, and even in an electronic component mounting device using an aluminum wire, when the liquid epoxy resin composition is used as a sealing resin, the extension of the aluminum wire is suppressed and soldering is performed. It is possible to prevent disconnection of the wire.
【００１９】またシリカとして球状シリカを用いたの
で、球状でない通常のシリカを使用するよりも液状エポ
キシ樹脂組成物の粘度の上昇を抑えることができ、液状
エポキシ樹脂組成物の流動性が低下するのを防ぐことが
できるものである。Further, since spherical silica is used as the silica, the increase in the viscosity of the liquid epoxy resin composition can be suppressed and the fluidity of the liquid epoxy resin composition can be lowered as compared with the case of using non-spherical ordinary silica. Can be prevented.
【図１】電子部品実装装置の一例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of an electronic component mounting apparatus.
１ 基板 ２ 電子部品 ３ ワイヤー 1 substrate 2 electronic component 3 wire
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０９Ｊ 163/00 ＪＦＮ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location C09J 163/00 JFN
Claims (2)
品と基板に設けた回路とをアルミニウムで形成されるワ
イヤーでボンディングし、この電子部品とワイヤーとを
封止する液状エポキシ樹脂組成物において、フィラーと
してシリカを７５重量％以上含有して成ることを特徴と
する液状エポキシ樹脂組成物。1. A liquid epoxy resin composition for mounting an electronic component on a substrate, bonding the electronic component and a circuit provided on the substrate with a wire made of aluminum, and sealing the electronic component and the wire. A liquid epoxy resin composition comprising 75% by weight or more of silica as a filler.
とを特徴とする請求項１に記載の液状エポキシ樹脂組成
物。2. The liquid epoxy resin composition according to claim 1, wherein spherical silica is used as the silica.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267386A JPH07122684A (en) | 1993-10-26 | 1993-10-26 | Liquid epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267386A JPH07122684A (en) | 1993-10-26 | 1993-10-26 | Liquid epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07122684A true JPH07122684A (en) | 1995-05-12 |
Family
ID=17444131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5267386A Pending JPH07122684A (en) | 1993-10-26 | 1993-10-26 | Liquid epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07122684A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100268989B1 (en) * | 1996-10-09 | 2000-10-16 | 마이클 디. 오브라이언 | Semiconductor package with built-in heat sink having double sealing part and manufacturing method thereof |
| JP2001049220A (en) * | 1999-08-05 | 2001-02-20 | Nippon Steel Chem Co Ltd | Composition for film-type adhesive |
| TWI384028B (en) * | 2005-05-31 | 2013-02-01 | Adeka Corp | Epoxy resin hardening composition |
-
1993
- 1993-10-26 JP JP5267386A patent/JPH07122684A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100268989B1 (en) * | 1996-10-09 | 2000-10-16 | 마이클 디. 오브라이언 | Semiconductor package with built-in heat sink having double sealing part and manufacturing method thereof |
| JP2001049220A (en) * | 1999-08-05 | 2001-02-20 | Nippon Steel Chem Co Ltd | Composition for film-type adhesive |
| JP4642173B2 (en) * | 1999-08-05 | 2011-03-02 | 新日鐵化学株式会社 | Composition for film adhesive |
| TWI384028B (en) * | 2005-05-31 | 2013-02-01 | Adeka Corp | Epoxy resin hardening composition |
| US8426504B2 (en) * | 2005-05-31 | 2013-04-23 | Adeka Corporation | Hardenable epoxy resin composition |
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