JP2001049220A - Composition for film-type adhesive - Google Patents
Composition for film-type adhesiveInfo
- Publication number
- JP2001049220A JP2001049220A JP11222619A JP22261999A JP2001049220A JP 2001049220 A JP2001049220 A JP 2001049220A JP 11222619 A JP11222619 A JP 11222619A JP 22261999 A JP22261999 A JP 22261999A JP 2001049220 A JP2001049220 A JP 2001049220A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- film
- silica
- adhesive
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フィルム状接着剤
組成物に関するものであり、詳しくは、半導体チップと
リードフレーム又は回路基板を接合するに適した絶縁性
フィルム状接着剤組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film adhesive composition, and more particularly to an insulating film adhesive composition suitable for bonding a semiconductor chip to a lead frame or a circuit board. is there.
【０００２】[0002]
【従来の技術】ＤＩＰ、ＳＯＰ、ＱＦＰ、ＢＧＡ、ＣＳ
Ｐに代表される半導体パッケージを構成する材料の中
で、半導体チップとリードフレーム又は回路基板を接着
するダイボンディング材料は、従来Ａｕ−Ｓｉ共晶合
金、はんだ、銀ペースト等が使用されてきた。現在、汎
用及び大型のパッケージには生産性、放熱性、大チップ
適用性、価格等の総合的な判断から銀ペーストによる接
着が主流となっている。銀ペーストは、ディスペンス方
式でリードフレーム又は回路基板に塗布し、半導体チッ
プの仮圧着も容易にできることから優れた生産性を示す
反面、液状であるために接着厚み精度、塗布位置精度及
びボイドレスのコントロールが難しいという問題があっ
た。2. Description of the Related Art DIP, SOP, QFP, BGA, CS
Among the materials constituting a semiconductor package represented by P, as a die bonding material for bonding a semiconductor chip to a lead frame or a circuit board, an Au-Si eutectic alloy, solder, silver paste, or the like has been conventionally used. At present, silver paste bonding has become the mainstream for general-purpose and large-sized packages from the comprehensive judgment of productivity, heat dissipation, large chip applicability, price and the like. Silver paste is applied to a lead frame or circuit board by a dispensing method, and it is possible to easily perform temporary press-bonding of semiconductor chips.It shows excellent productivity, but because it is liquid, it controls adhesive thickness accuracy, application position accuracy, and voidless. There was a problem that was difficult.
【０００３】近年、エリアアレイタイプのチップサイズ
パッケージが登場し、携帯機器の軽薄短小化に大きく貢
献している。しかしながら、このようなパッケージは半
導体チップとパッケージの大きさが限りなく近づくこと
から、半導体チップとリードフレーム及び回路基板を接
着するときのフィレットエリアは最小面積が求められる
とともに、チップ接着面は完全に接着層に覆われること
も同時に要求される。更に、形成された接着層内部のボ
イドは耐湿信頼性やパッケージクラックに大きく影響を
及ぼすことから、ボイドフリーであることが好ましい。
以上の経緯から、より高い位置精度の接着剤への要求が
高まり、従来のペースト状接着剤の生産性を維持しつ
つ、厚み精度、位置精度が高く、ボイドの生じにくいフ
ィルム状接着剤が求められていた。また、エリアアレイ
タイプの半導体パッケージは、マザーボードに実装され
たのち、温度サイクル試験のような応力によるダメージ
を加速する評価を行うと、パッケージ構成材料やマザー
ボード材料との接合部分が線膨張率の違いで発生する応
力によって破壊される問題も発生していることから、接
合される異種材料の線膨張率の違いにより発生する応力
を抑制する接着剤も求められている。[0003] In recent years, an area array type chip size package has appeared, and has greatly contributed to the reduction in size and size of portable devices. However, in such a package, since the size of the semiconductor chip and the package are infinitely close, a fillet area when bonding the semiconductor chip to the lead frame and the circuit board is required to have a minimum area, and the chip bonding surface is completely completed. It is also required to be covered with an adhesive layer. Furthermore, voids inside the formed adhesive layer are preferably void-free because they greatly affect humidity resistance reliability and package cracks.
From the above circumstances, the demand for adhesives with higher positional accuracy has increased, and a film adhesive that has high thickness accuracy, high positional accuracy, and hardly generates voids while maintaining the productivity of conventional paste adhesives has been required. Had been. In addition, after an area array type semiconductor package is mounted on a motherboard and evaluated to accelerate damage due to stress, such as a temperature cycle test, the difference between the coefficient of linear expansion of the package material and the joint with the motherboard material There is also a problem in that the adhesive is destroyed by the stress generated in the bonding, and therefore, an adhesive that suppresses the stress generated due to the difference in the linear expansion coefficient of the dissimilar materials to be joined is also required.
【０００４】一方、フィルム状接着剤に用いられる接着
剤組成物として、特開平５−３２０６１０号公報にはフ
ェノキシ樹脂、多官能グリシジルエーテル型エポキシ樹
脂、潜在性硬化剤を必須成分としたものが記載されてい
る。しかしながら、ここに記載されたフィルム状接着剤
は、エリアタイプの半導体パッケージに用いた場合、線
膨張率が大きいため前記した被着体との関係で応力を抑
制する性質が劣るばかりでなく、仮圧着性にも問題があ
る。On the other hand, as an adhesive composition used for a film adhesive, Japanese Patent Application Laid-Open No. 5-320610 discloses a composition containing phenoxy resin, polyfunctional glycidyl ether type epoxy resin, and a latent curing agent as essential components. Have been. However, when the film adhesive described here is used for an area-type semiconductor package, the linear adhesive has a large coefficient of linear expansion, so that not only is it inferior in the property of suppressing the stress in relation to the adherend described above, but also temporarily. There is also a problem with the crimpability.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的は、厚み
精度、位置精度が高くボイドの発生が極力少ないフィル
ム状接着剤特性を有することに加え、半導体チップとリ
ードフレーム又は回路基板を接合するような異種物質間
の接合時に発生する応力を抑制し、且つ、接着作業時の
加工性（仮圧着性）に優れた絶縁性フィルム状接着剤を
提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a film-like adhesive having high thickness accuracy and high position accuracy and minimal void generation, as well as joining a semiconductor chip to a lead frame or a circuit board. An object of the present invention is to provide an insulating film adhesive which suppresses the stress generated at the time of joining between different kinds of materials and is excellent in workability (temporary pressure bonding) at the time of bonding work.
【０００６】[0006]
【課題を解決するための手段】本発明者等は鋭意検討し
た結果、従来の組成物にシリカを加えた特定の性質を有
する組成物が上記問題を解決するのに有効であることを
見出し、本発明を完成するに至った。As a result of intensive studies, the present inventors have found that a composition having specific properties obtained by adding silica to a conventional composition is effective in solving the above problems. The present invention has been completed.
【０００７】すなわち、本発明は、（Ａ）シリカ、
（Ｂ）フェノキシ樹脂、（Ｃ）グリシジルエーテル型エ
ポキシ樹脂及び（Ｄ）エポキシ樹脂硬化剤を必須成分と
し、組成物中のシリカ含有量が５０〜８０ｗｔ％であ
り、且つ（Ｂ）フェノキシ樹脂／（Ｃ）グリシジルエー
テル型エポキシ樹脂の重量比が０．０２〜１の範囲であ
ることを特徴とするフィルム状接着剤用組成物である。
また、本発明は、シリカが、平均粒径５〜４０μｍの球
状シリカと、平均粒径０．１〜５μｍの微粒子球状シリ
カの混合物であり、全シリカ中に占める微粒子球状シリ
カの割合が５０ｗｔ％以下である前記フィルム状接着剤
用組成物である。更に、本発明は、組成物中の樹脂成分
の軟化点が１００℃以下である前記フィルム状接着剤用
組成物である。That is, the present invention relates to (A) silica,
(B) Phenoxy resin, (C) glycidyl ether type epoxy resin and (D) epoxy resin curing agent are essential components, the silica content in the composition is 50 to 80 wt%, and (B) phenoxy resin / ( C) A composition for a film adhesive, wherein the weight ratio of the glycidyl ether type epoxy resin is in the range of 0.02 to 1.
Further, the present invention provides a method wherein the silica is a mixture of spherical silica having an average particle size of 5 to 40 μm and fine particle spherical silica having an average particle size of 0.1 to 5 μm, and the proportion of the fine particle spherical silica in the total silica is 50 wt%. The composition for a film adhesive is as follows. Further, the present invention is the composition for a film adhesive, wherein the softening point of the resin component in the composition is 100 ° C. or less.
【０００８】また、本発明は、フィルム状接着剤用組成
物を厚さ１０〜１５０μｍのフィルム状にしてなるフィ
ルム状接着剤、及びこれを硬化して得られる常温での線
膨張率が３０ｐｐｍ以下であるフィルム状接着剤であ
る。Further, the present invention provides a film adhesive obtained by forming a film adhesive composition into a film having a thickness of 10 to 150 μm, and a linear expansion coefficient at room temperature obtained by curing the film adhesive of 30 ppm or less. Is a film adhesive.
【０００９】[0009]
【発明の実施の形態】本発明に用いる（Ａ）シリカは、
特に限定されるものではないが、破砕状や球状の溶融シ
リカ粉末が挙げられる。その中でも平均粒径が５〜４０
μｍの球状シリカと平均粒径が０．１〜５μｍの微粒子
球状シリカの混合物であることが好ましい。この場合、
全球状シリカ中に占める微粒子球状シリカの割合は、５
０ｗｔ％以下であることが好ましく、５〜５０ｗｔ％の
範囲であることがより好ましい。微粒子球状シリカの割
合が５０ｗｔ％より多い場合は、組成物の溶融粘度が増
大し、仮圧着特性を低下させる傾向があり、また、微粒
子球状シリカの割合が５ｗｔ％より少ないとフィルム状
接着剤としたときのシートの表面状態が悪くなったり、
シート自体がやや脆いものとなったりする傾向がある。
微粒子球状シリカ比率が５〜５０ｗｔ％のときには、幅
広い粒度分布となり、安定したフィルム表面性状、フィ
ルム流動性を示す。BEST MODE FOR CARRYING OUT THE INVENTION The silica (A) used in the present invention comprises:
Although not particularly limited, a crushed or spherical fused silica powder may be used. Among them, the average particle size is 5 to 40
It is preferably a mixture of micron spherical silica and fine particle spherical silica having an average particle size of 0.1 to 5 μm. in this case,
The ratio of the fine particle spherical silica in the total spherical silica is 5
It is preferably at most 0 wt%, more preferably within the range of 5 to 50 wt%. When the proportion of the fine-particle spherical silica is more than 50 wt%, the melt viscosity of the composition tends to increase, and the temporary compression characteristics tend to be reduced. The surface condition of the sheet when
The sheet itself tends to be somewhat brittle.
When the ratio of the fine particle spherical silica is 5 to 50 wt%, the particle size distribution is wide, and stable film surface properties and film fluidity are exhibited.
【００１０】組成物中のシリカの総使用量は線膨張率低
減のためにはできるだけ多いほうがよいが、組成物全体
中５０〜８０ｗｔ％の範囲であることが必要である。シ
リカ含有量が８０ｗｔ％を超えると、バインダーとして
働く樹脂成分の不足による組成物の粘度上昇で脆いフィ
ルム状接着剤となり仮圧着性能を著しく低下させる。シ
リカ含有量が５０ｗｔ％未満では、線膨張率が十分に低
減できないため、半導体チップとリードフレーム及び回
路基板間の応力を抑制する働きが小さいため好ましくな
い。例えば、パッケージに組み立てられた後の温度サイ
クル試験（−６５〜１５０℃）等の際に発生する応力に
耐えられないケースが生じる。The total amount of silica used in the composition is preferably as large as possible in order to reduce the coefficient of linear expansion, but must be in the range of 50 to 80% by weight of the whole composition. When the silica content exceeds 80% by weight, the viscosity of the composition increases due to a shortage of the resin component acting as a binder, resulting in a brittle film-like adhesive, which significantly reduces the temporary press-bonding performance. If the silica content is less than 50 wt%, the coefficient of linear expansion cannot be sufficiently reduced, and the effect of suppressing the stress between the semiconductor chip and the lead frame and the circuit board is small. For example, there are cases in which stress generated during a temperature cycle test (−65 to 150 ° C.) after being assembled into a package cannot be tolerated.
【００１１】本発明に用いる（Ｂ）フェノキシ樹脂は、
公知のフェノキシ樹脂を用いることができる。フェノキ
シ樹脂は、例えば、ビスフェノールＡのようなビスフェ
ノールとエピクロロヒドリンとから得られる通常、分子
量が１０,０００以上の熱可塑性樹脂である。このフェ
ノキシ樹脂は、エポキシ樹脂と構造が類似していること
から相溶性がよく、また、接着性もよいという特徴を示
す。好ましいフェノキシ樹脂は、主骨格がビスフェノー
ルＡ型のものであるが、その他にビスフェノールＡ／Ｆ
混合型フェノキシ樹脂や臭素化フェノキシ樹脂等市販の
フェノキシ樹脂が好ましいものとして挙げられる。[0011] The phenoxy resin (B) used in the present invention comprises:
Known phenoxy resins can be used. The phenoxy resin is, for example, a thermoplastic resin having a molecular weight of 10,000 or more, usually obtained from a bisphenol such as bisphenol A and epichlorohydrin. This phenoxy resin has characteristics that it has good compatibility because of its similar structure to epoxy resin and also has good adhesiveness. The preferred phenoxy resin has a main skeleton of bisphenol A type, but other bisphenol A / F
Commercially available phenoxy resins such as mixed phenoxy resins and brominated phenoxy resins are preferred.
【００１２】本発明に用いる（Ｃ）グリシジルエーテル
型エポキシ樹脂は、単独あるいは複数の混合物を使用す
ることが可能である。使用できるグリシジルエーテル型
エポキシ樹脂としては、フェノールノボラックグリシジ
ルエーテル型、オルソクレゾールノボラックグリシジル
エーテル型、フルオレンビスフェノールグリシジルエー
テル型、トリアジングリシジルエーテル型、ナフトール
グリシジルエーテル型、ナフタレンジオールグリシジル
エーテル型、トリフェニルグリシジルエーテル型、テト
ラフェニルグリシジルエーテル型、ビスフェノールＡグ
リシジルエーテル型、ビスフェノールＦグリシジルエー
テル型、ビスフェノールＡＤグリシジルエーテル型、ビ
スフェノールＳグリシジルエーテル型、トリメチロール
メタングリシジルエーテル型等が例として挙げられる。
これらの中でも、分子内に２個以上のグルシジルエーテ
ル基を持つものが好ましい。The glycidyl ether type epoxy resin (C) used in the present invention can be used alone or in a mixture of plural kinds. Glycidyl ether type epoxy resins that can be used include phenol novolac glycidyl ether type, orthocresol novolak glycidyl ether type, fluorene bisphenol glycidyl ether type, triazine glycidyl ether type, naphthol glycidyl ether type, naphthalene diol glycidyl ether type, triphenyl glycidyl ether type Examples thereof include tetraphenyl glycidyl ether type, bisphenol A glycidyl ether type, bisphenol F glycidyl ether type, bisphenol AD glycidyl ether type, bisphenol S glycidyl ether type, and trimethylolmethane glycidyl ether type.
Among these, those having two or more glycidyl ether groups in the molecule are preferable.
【００１３】（Ｃ）エポキシ樹脂と（Ｂ）フェノキシ樹
脂の混合比率は、組み合わせによって変わるが、樹脂成
分の混合物の軟化点が、好ましくは１００℃以下、更に
好ましくは５０〜１００℃、最も好ましくは６５〜９０
℃の範囲にあるものが、これを本発明のフィルム状接着
剤とした場合、優れた仮圧着性を示すことから好まし
い。樹脂成分の軟化点が１００℃を超える場合は、シー
トが硬く、脆くなるとともにマイルドな条件での仮圧着
が困難になるので好ましくなく、また、軟化点が５０℃
以下の場合、シート表面にタック性が強く発現してハン
ドリング性が著しく悪化するとともに、常温保存時にシ
ートが流動するという不具合が発生するので好ましくな
い。ここで、樹脂成分とは、（Ｃ）エポキシ樹脂と
（Ｂ）フェノキシ樹脂とその他必要により加えられる樹
脂（但し、（Ｄ）エポキシ樹脂硬化剤を除く）をいい、
樹脂成分の軟化点とはこれらを均一な組成物としたとき
の軟化点をいう。そして、（Ｂ）フェノキシ樹脂／
（Ｃ）エポキシ樹脂で計算される重量比は０．０２〜
１、好ましくは０．１〜０．７の範囲である。The mixing ratio of the epoxy resin (C) and the phenoxy resin (B) varies depending on the combination, but the softening point of the mixture of resin components is preferably 100 ° C. or lower, more preferably 50 to 100 ° C., and most preferably. 65-90
When the adhesive is in the range of ° C, the adhesive in the form of a film of the present invention exhibits excellent temporary press-bonding properties, and is therefore preferable. If the softening point of the resin component exceeds 100 ° C., the sheet becomes hard and brittle, and it becomes difficult to perform temporary press bonding under mild conditions.
In the following cases, the tackiness is strongly developed on the sheet surface, and the handling property is remarkably deteriorated, and a problem that the sheet flows when stored at room temperature is not preferable. Here, the resin component refers to (C) an epoxy resin, (B) a phenoxy resin, and other resins added as necessary (excluding (D) an epoxy resin curing agent),
The softening point of the resin component means the softening point when these are made into a uniform composition. And (B) phenoxy resin /
(C) The weight ratio calculated with the epoxy resin is 0.02 to 0.02.
1, preferably in the range of 0.1 to 0.7.
【００１４】本発明の組成物中の樹脂成分は、エポキシ
樹脂とフェノキシ樹脂を主成分とするが、本発明の効果
を損なわない範囲であれば他の樹脂成分を少量含有させ
てもよい。組成物中の樹脂成分中に占めるフェノキシ樹
脂の割合は、５０ｗｔ％以下であることが好ましい。フ
ェノキシ樹脂の割合を５０ｗｔ％以下とすることで、フ
イルム状接着剤（接着シート又はシートともいう）とし
ての支持性を持たせることが容易となる。ここで、樹脂
成分中フェノキシ樹脂の割合は、１０〜５０ｗｔ％の範
囲にあるものが好ましい。フェノキシ樹脂の割合が１０
ｗｔ％未満の場合、シートは脆いものになり、樹脂成分
の軟化点も低くなるため、シート単独での支持性が発現
しにくく、また、フェノキシ樹脂の割合が、５０ｗｔ％
を超えるとシートが硬くなり、シート単独では割れやす
くなる。The resin component in the composition of the present invention contains an epoxy resin and a phenoxy resin as main components, but other resin components may be contained in a small amount as long as the effects of the present invention are not impaired. The proportion of the phenoxy resin in the resin component in the composition is preferably 50% by weight or less. By setting the proportion of the phenoxy resin to 50 wt% or less, it becomes easy to provide a film-like adhesive (also referred to as an adhesive sheet or a sheet) with supportability. Here, the ratio of the phenoxy resin in the resin component is preferably in the range of 10 to 50 wt%. The ratio of phenoxy resin is 10
When the content is less than wt%, the sheet becomes brittle and the softening point of the resin component is lowered, so that the supportability of the sheet alone is hardly exhibited, and the ratio of the phenoxy resin is 50 wt%.
If it exceeds, the sheet becomes hard, and the sheet alone tends to break.
【００１５】本発明に用いる（Ｄ）エポキシ樹脂硬化剤
には、アミン類、酸無水物類、多価フェノール類等の公
知の硬化剤を使用することができるが、好ましくは常温
以上の所定の温度、例えば前記樹脂成分が必要な粘着性
を示す温度以上で硬化性を発揮し、しかも速硬化性を発
揮する潜在性硬化剤である。潜在性硬化剤には、ジシア
ンジアミド、イミダゾール類、ヒドラジド類、三弗化ホ
ウ素−アミン錯体、アミンイミド、ポリアミン塩及びこ
れらの変性物、更にマイクロカプセル型のものも使用可
能である。これらは、単独あるいは２種以上混ぜて使用
できる。潜在性硬化剤を使用することで室温での長期保
存も可能な保存安定性の高いフィルム接着剤用組成物を
提供できる。エポキシ樹脂硬化剤の使用量は、通常、エ
ポキシ樹脂に対して０．５〜５０ｗｔ％の範囲である。As the epoxy resin curing agent (D) used in the present invention, known curing agents such as amines, acid anhydrides and polyhydric phenols can be used. It is a latent curing agent that exhibits curability at a temperature, for example, a temperature at which the resin component exhibits the required tackiness, and also exhibits rapid curability. As the latent curing agent, dicyandiamide, imidazoles, hydrazides, boron trifluoride-amine complexes, amine imides, polyamine salts, modified products thereof, and microcapsules can also be used. These can be used alone or as a mixture of two or more. By using a latent curing agent, it is possible to provide a composition for a film adhesive having high storage stability and long-term storage at room temperature. The amount of the epoxy resin curing agent used is usually in the range of 0.5 to 50 wt% based on the epoxy resin.
【００１６】上記で得られた絶縁性フィルム状接着剤組
成物中には、他の添加剤として、例えばカップリング
剤、酸化防止剤、難燃剤、着色剤、応力緩和剤としてブ
タジエン系ゴムやシリコーンゴム等を含有することも可
能である。In the insulating film adhesive composition obtained above, other additives such as a coupling agent, an antioxidant, a flame retardant, a colorant, and a butadiene rubber or silicone as a stress relieving agent may be used. It is also possible to contain rubber and the like.
【００１７】カップリング剤は、シリカとの界面を補強
し高い破壊強度を発現させるとともに接着力向上の目的
から好ましい。カップリング剤としては、アミノ基、エ
ポキシ基を含有したものが好ましい。The coupling agent is preferred for the purpose of reinforcing the interface with silica, exhibiting high breaking strength, and improving the adhesive strength. As the coupling agent, those containing an amino group or an epoxy group are preferable.
【００１８】本発明のフィルム状接着剤は、例えばトル
エン、キシレン等の芳香族炭化水素、ＭＩＢＫやＭＥＫ
等のケトン系、モノグライム、ジグライム等のエーテル
系の単独又は混合物に本組成物を溶解させたワニスを、
離型処理されたＰＰ、ＰＥ、ＰＥＴ等の基材（保護フィ
ルム）に塗工し、樹脂混合物の硬化開始温度以下の熱処
理を施し、乾燥することで得られる。本発明の組成物か
ら形成されるフィルム状接着剤の厚みは、１０〜１５０
μｍの範囲であることがよい。The film-like adhesive of the present invention includes aromatic hydrocarbons such as toluene and xylene, MIBK and MEK.
A varnish obtained by dissolving the present composition in a single or mixture of ketones such as ketone, monoglyme, and diglyme, etc.,
It is obtained by applying to a base material (protective film) such as PP, PE, PET or the like subjected to a release treatment, performing a heat treatment at a temperature equal to or lower than a curing start temperature of the resin mixture, and drying the mixture. The thickness of the film adhesive formed from the composition of the present invention is 10 to 150.
It is preferably in the range of μm.
【００１９】本発明の組成物の硬化物又はフィルム状接
着剤の硬化物の線膨張率は、常温において３０ｐｐｍ以
下であることが好ましい。線膨張率の値が３０ｐｐｍよ
り高いと、リードフレームや回路基板等との線膨張率の
差が大きくなるため、これら被接着物との応力を抑制す
る効果が低く、製品の一部を破壊させることにつながり
好ましくない。リードフレームや回路基板の線膨張率に
合わせるためには、１０〜２０ｐｐｍがより好ましい。The coefficient of linear expansion of the cured product of the composition of the present invention or the cured product of the film adhesive is preferably 30 ppm or less at room temperature. When the value of the coefficient of linear expansion is higher than 30 ppm, the difference in the coefficient of linear expansion between the lead frame and the circuit board becomes large, so that the effect of suppressing the stress with these adherends is low, and a part of the product is broken. This is not desirable. In order to match the coefficient of linear expansion of the lead frame or circuit board, 10 to 20 ppm is more preferable.
【００２０】本発明のフィルム状接着剤は各種の用途に
使用され、各種の使用方法で使用可能であるが、次のよ
うな使用方法に適する。例えば、基板にチップ等を接着
する場合、まず所定の形状、大きさに切断したフィルム
状接着剤を、基板の所定位置に配置し、５０℃以上に加
熱して、０．５〜５ｋｇｆ／ｃｍ2程度の圧をかけて仮
圧着させる。この際、フィルムの形状、大きさは可及的
に変化しないことがよい。フィルム状接着剤は常温では
殆ど粘着性がなく、５０℃以上で粘着性を発揮すること
がよいが、その硬化温度以下で仮圧着する。ボイドの発
生を防止するためには、圧力が必要であるが、高すぎる
とフィルムの変形等が生じる。フィルム状接着剤を仮圧
着したのち、表面側の保護フィルムを剥がし、この上に
チップを載せて仮圧着、フィルム状接着剤の硬化を行
い、基板とチップを、硬化フィルム状接着剤を介して完
全に接着させる。硬化は、硬化温度以上の熱をかけるこ
とにより行う。ここでいう仮圧着性が優れるとは、フィ
ルム状接着剤の変形が少ないこと、ボイドの発生が少な
いこと、粘着力により所定の接着強度が生じること等を
いう。The film adhesive of the present invention is used for various uses and can be used in various uses, but is suitable for the following uses. For example, when bonding a chip or the like to a substrate, first, a film-shaped adhesive cut into a predetermined shape and size is placed at a predetermined position on the substrate, and heated to 50 ° C. or more to obtain 0.5 to 5 kgf / cm. Apply a pressure of about 2 and perform temporary compression. At this time, the shape and size of the film are preferably not changed as much as possible. The film adhesive has almost no tackiness at room temperature, and it is preferable to exhibit tackiness at 50 ° C. or higher, but it is temporarily pressed at a temperature lower than its curing temperature. To prevent the generation of voids, pressure is required, but if it is too high, the film will be deformed. After temporarily bonding the film adhesive, the protective film on the front side is peeled off, the chip is placed on this, the temporary bonding is performed, the film adhesive is cured, and the substrate and the chip are bonded through the cured film adhesive. Adhere completely. Curing is performed by applying heat above the curing temperature. The term "excellent temporary pressure-bonding property" as used herein means that the film-like adhesive is less deformed, less voids are generated, and a predetermined adhesive strength is generated by the adhesive force.
【００２１】[0021]
【実施例】実施例１ ＹＰ−５０（フェノキシ樹脂、重量平均分子量５９，０
００、Tg約１００℃、東都化成社製）２０ｇ、ＹＤＣＮ
−７０２（オルソクレゾールノボラック型エポキシ樹
脂、軟化点７５℃、東都化成社製）５０ｇ、ＹＤ−１２
７（ビスフェノールＡ型エポキシ樹脂、東都化成社製）
４０ｇを秤量し、８０ｇのＭＩＢＫを溶剤として５００
ｍｌのセパラブルフラスコ中、１１０℃で２時間加熱攪
拌して樹脂ワニスを得た。この溶液１９０ｇを８００ｍ
ｌのプラネタリーミキサーに秤量し、ＦＢ−４８（球状
シリカ、平均粒径１６μｍ、デンカ社製）２４０ｇとＳ
Ｏ−Ｃ２（微粒子球状シリカ、平均粒径０．５μｍ、ア
ドマテックス社製）４０ｇを加えて混合したものを３本
ロールで混練した。この混合物に、ＡＨ−１５０（ジシ
アンジアミド、味の素社製）８ｇ、ＨＸ−３７２２（マ
イクロカプセル型イミダゾール系潜在性硬化剤、旭チバ
社製）２ｇを加えてプラネタリーミキサーで攪拌混合
後、真空脱泡して混合ワニスを得た。上記混合ワニスを
厚さ５０μｍの離型処理されたＰＥＴフィルム上に塗布
後、６０℃／５分、１２０℃／５分で熱風乾燥させ、７
０μｍ厚の接着シート、すなわちフィルム状接着剤を得
た。EXAMPLES Example 1 YP-50 (phenoxy resin, weight average molecular weight 59,0
00, Tg about 100 ° C, manufactured by Toto Kasei Co., Ltd.) 20 g, YDCN
-702 (orthocresol novolak type epoxy resin, softening point 75 ° C, manufactured by Toto Kasei Co., Ltd.) 50 g, YD-12
7 (Bisphenol A type epoxy resin, manufactured by Toto Kasei)
40 g is weighed, and 80 g of MIBK is used as a solvent for 500 g.
The resin varnish was obtained by heating and stirring at 110 ° C. for 2 hours in a separable flask having a capacity of 110 ml. 190 g of this solution is 800 m
1 g of planetary mixer, 240 g of FB-48 (spherical silica, average particle size 16 μm, manufactured by Denka) and S
A mixture obtained by adding and mixing 40 g of O-C2 (fine-particle spherical silica, average particle size: 0.5 μm, manufactured by Admatechs Co., Ltd.) was kneaded with a three-roll mill. To this mixture, 8 g of AH-150 (dicyandiamide, manufactured by Ajinomoto Co.) and 2 g of HX-3722 (microcapsule-type imidazole-based latent curing agent, manufactured by Asahi Ciba Co.) were added, followed by stirring and mixing with a planetary mixer, followed by vacuum defoaming. Thus, a mixed varnish was obtained. After applying the mixed varnish on a 50 μm-thick release-treated PET film, it was dried with hot air at 60 ° C./5 minutes and 120 ° C./5 minutes.
An adhesive sheet having a thickness of 0 μm, that is, a film adhesive was obtained.
【００２２】このフィルム状接着剤の仮圧着性能は、１
２５μｍの銅板の上に１０×１０ｍｍの大きさのフィル
ム状接着剤を置き、６０℃に加熱したヒートブロックを
エアシリンダーによって３ｋｇ／ｃｍ2の圧力で３秒間
プレス後、フィルム状接着剤の銅板へ圧着した外観を観
察することで評価した。プレス後にフィルム状接着剤が
完全に仮圧着できているものを◎（良好）とし、接着不
良（未充填）を○とし、流れ出し（流れ）のものを△と
し、殆ど圧着できなかったものを×とする４段階評価を
行った。The temporary pressure-bonding performance of this film adhesive is 1
A film adhesive having a size of 10 × 10 mm is placed on a copper plate of 25 μm, and a heat block heated to 60 ° C. is pressed by an air cylinder at a pressure of 3 kg / cm 2 for 3 seconds. Evaluation was made by observing the appearance of the crimp.フ ィ ル ム (good) indicates that the film adhesive was completely pre-pressed after pressing, ○ indicates poor adhesion (unfilled), △ indicates outflow (flow), and × indicates that almost no pressure bonding was possible. The four-step evaluation was performed.
【００２３】シート性状は、接着シート表面状態、離型
処理ＰＥＴフィルムからの剥離性、単独シートでの支持
性、柔軟性、脆さ等を観察し、◎（良好）、○ほぼ良
好、△やや悪い、×（悪い）の４段階で評価した。The properties of the sheet were evaluated by observing the surface state of the adhesive sheet, the releasability from the release-treated PET film, the supportability of a single sheet, the flexibility, the brittleness, and the like. Poor, × (bad) was evaluated in four stages.
【００２４】樹脂混合物軟化点は、フィルム接着剤作成
時の中間品として得られる樹脂ワニスを単独で７０℃減
圧乾燥でシート化し、溶媒を除去したものを、滴下式軟
化点測定装置（Ｍｅｔｔｌｅｒ ＦＰ８３ メトラー
製）にて測定した。The softening point of the resin mixture was determined by using a resin varnish obtained as an intermediate product at the time of preparing the film adhesive alone, forming a sheet by drying under reduced pressure at 70 ° C., and removing the solvent, and using a dropping softening point measuring device (Mettler FP83 METTLER Manufactured).
【００２５】線膨張率は、フィルム状接着剤を１８０
℃、１時間の硬化条件で圧縮成形した成形物を４×４×
１０ｍｍの大きさに切削したものを試験片として使用
し、熱機械分析装置（ＴＭＡ ＳＳＣ５２００ セイコ
ー電子製）で、−１００〜３００℃、昇温速度７℃／分
で測定後、１０〜３０℃の範囲での線膨張率を求めた。The coefficient of linear expansion is determined by using a film adhesive of 180.
At 4 ° C for 1 hour at 4 ° C
Using a sample cut to a size of 10 mm as a test piece, and measuring with a thermomechanical analyzer (TMA SSC5200 manufactured by Seiko Denshi) at -100 to 300 ° C at a heating rate of 7 ° C / min, 10 to 30 ° C The linear expansion coefficient in the range was determined.
【００２６】以下の例は、組成物の組成を変えた他は、
実施例１と同様にしてフィルム状接着剤を製造し、同様
にして評価した例である。The following example shows that the composition of the composition was changed,
This is an example in which a film adhesive was produced in the same manner as in Example 1 and evaluated in the same manner.
【００２７】実施例２ グリシジルエーテル型エポキシ樹脂として、ＥＰＰＮ−
５０１Ｈ（多官能グリシジルエーテル型エポキシ樹脂、
軟化点５５℃、日本化薬社製）６０ｇ及びＹＤ−１２７
を３０ｇ使用した他は、実施例１と同様にして接着シー
トを製造し、評価した。Example 2 As a glycidyl ether type epoxy resin, EPPN-
501H (polyfunctional glycidyl ether type epoxy resin,
Softening point 55 ° C, Nippon Kayaku Co., Ltd.) 60 g and YD-127
Was prepared and evaluated in the same manner as in Example 1 except that 30 g of the adhesive sheet was used.
【００２８】実施例３ グリシジルエーテル型エポキシ樹脂として、ＥＳＮ−１
８５（ナフタレン系グリシジルエーテル型エポキシ樹
脂、軟化点８５℃、新日鐵化学社製）５０ｇ、ＹＤ−１
２７を４０ｇ使用した他は、実施例１と同様にして接着
シートを製造し、評価した。Example 3 As a glycidyl ether type epoxy resin, ESN-1 was used.
85 (naphthalene-based glycidyl ether type epoxy resin, softening point 85 ° C, manufactured by Nippon Steel Chemical Co., Ltd.) 50 g, YD-1
An adhesive sheet was manufactured and evaluated in the same manner as in Example 1 except that 40 g of 27 was used.
【００２９】実施例４ グリシジルエーテル型エポキシ樹脂として、ＹＤ−１２
７のみを７０ｇ、更にフェノキシ樹脂としてＹＰ−５０
を４０ｇ使用した他は、実施例１と同様にして接着シー
トを製造し、評価した。Example 4 As a glycidyl ether type epoxy resin, YD-12 was used.
7 alone and 70 g of YP-50 as a phenoxy resin.
Was prepared and evaluated in the same manner as in Example 1, except that 40 g of the adhesive sheet was used.
【００３０】実施例５ シリカとして、ＦＢ−４８を１８０ｇ、ＳＯ−Ｃ２を１
００ｇ使用した他は、実施例１と同様にして接着シート
を製造し、評価した。Example 5 As silica, 180 g of FB-48 and 1 of SO-C2 were used.
An adhesive sheet was manufactured and evaluated in the same manner as in Example 1 except that 00 g was used.
【００３１】実施例６ シリカとして、ＦＢ−４８を３００ｇ、ＳＯ−Ｃ２を５
０ｇ使用した他は、実施例１と同様にして接着シートを
製造し、評価した。Example 6 As silica, 300 g of FB-48 and 5 g of SO-C2 were used.
An adhesive sheet was manufactured and evaluated in the same manner as in Example 1 except that 0 g was used.
【００３２】実施例７ シリカとして、ＦＢ−４８のみを２８０ｇ使用した他
は、実施例１と同様にして接着シートを製造し、評価し
た。Example 7 An adhesive sheet was produced and evaluated in the same manner as in Example 1 except that 280 g of FB-48 alone was used as silica.
【００３３】実施例８ シリカとして、ＦＢ−４８を１３０ｇ、ＳＯ−Ｃ２を１
５０ｇ使用した他は、実施例１と同様にして接着シート
を製造し、評価した。Example 8 As silica, 130 g of FB-48 and 1 of SO-C2 were used.
An adhesive sheet was manufactured and evaluated in the same manner as in Example 1 except that 50 g was used.
【００３４】実施例９ グリシジルエーテル型エポキシ樹脂として、ＹＤＣＮ−
７０２を６５ｇ、ＹＤ−１２７を４０ｇ使用し、更にフ
ェノキシ樹脂としてＹＰ−５０を５ｇ使用した他は、実
施例１と同様にして接着シートを製造し、評価した。Example 9 As a glycidyl ether type epoxy resin, YDCN-
An adhesive sheet was manufactured and evaluated in the same manner as in Example 1 except that 65 g of 702, 40 g of YD-127, and 5 g of YP-50 as a phenoxy resin were used.
【００３５】実施例１０ グリシジルエーテル型エポキシ樹脂としてＹＤＣＮ−７
０２のみを９０ｇ使用した他は、実施例１と同様にして
接着シートを製造し、評価した。Example 10 YDCN-7 as a glycidyl ether type epoxy resin
An adhesive sheet was produced and evaluated in the same manner as in Example 1 except that 90 g of only 02 was used.
【００３６】比較例１ シリカとして、ＦＢ−４８を９０ｇ、ＳＯ−Ｃ２を２０
ｇ使用した他は、実施例１と同様にして接着シートを製
造し、評価した。 比較例２ シリカとして、ＦＢ−４８を６００ｇ、ＳＯ−Ｃ２を１
００ｇ使用した他は、実施例１と同様にして接着シート
を製造し、評価した。 比較例３ グリシジルエーテル型エポキシ樹脂としてＹＤ−１２７
のみを５０ｇ、フェノキシ樹脂としてＹＰ−５０を６０
ｇ使用した他は、実施例１と同様にして接着シートを製
造し、評価した。 比較例４ シリカを全く使用しない他は、実施例１と同様にして接
着シートを製造し、評価した。以上の組成及び評価結果
をまとめて表１に示す。Comparative Example 1 As silica, 90 g of FB-48 and 20 g of SO-C2 were used.
Except for using g, an adhesive sheet was manufactured and evaluated in the same manner as in Example 1. Comparative Example 2 600 g of FB-48 and 1 of SO-C2 were used as silica.
An adhesive sheet was manufactured and evaluated in the same manner as in Example 1 except that 00 g was used. Comparative Example 3 YD-127 as a glycidyl ether type epoxy resin
50 g of YP-50 as a phenoxy resin.
Except for using g, an adhesive sheet was manufactured and evaluated in the same manner as in Example 1. Comparative Example 4 An adhesive sheet was produced and evaluated in the same manner as in Example 1 except that silica was not used at all. Table 1 summarizes the above composition and evaluation results.
【００３７】[0037]
【表１】 [Table 1]
【００３８】シリカの含有量が７０ｗｔ％のレベルで
は、線膨張率が１７〜２０ｐｐｍとなり、回路基板並み
の線膨張率を示した。実施例１〜３ではグリシジルエー
テル型エポキシ樹脂の種類を変えたが、オルソクレゾー
ル型、多官能型、ナフタレン型何れも良好な仮圧着性
能、シート性状を示した。特に、ナフタレン型について
は、他の骨格よりも低い線膨張率であった。実施例１に
対して、実施例５、６、７、８ではシリカ配合を変えた
が、全量球状シリカを使用するとシート表面の艶が低下
し、やや脆いものであった。また、微粒子球状シリカ使
用量が５０％を超える領域では、シートが硬く、やや脆
くなり、銅板との仮圧着評価でも未充填が若干発生し
た。実施例１と６及び比較例１，２，４では、シリカ使
用量を変えたが、シリカ使用量が５０ｗｔ％以下のとき
は、仮圧着時の流れ出し、シート表面のベタツキが激し
くなり、シートの支持性も無かった。また、８０ｗｔ％
を超える時は、仮圧着できず、シートも脆いものであっ
た。実施例１に対し、実施例４、９、比較例３では樹脂
混合物中に占めるフェノキシ樹脂比率を変えたが、１０
ｗｔ％以下の時にはシートが柔らかく支持性が低下し、
５０ｗｔ％を超えるときは、硬くて脆いシートとなり、
仮圧着性も未充填が発生した。実施例１０、比較例３で
は樹脂混合物の軟化点を変えたが、１００℃を超えた軟
化点のときは、未充填がやや発生した。なお、シリカを
配合していない比較例４のものは、仮圧着時の流れ出
し、シート表面のベタツキが激しくなり、シートの支持
性も無く、線膨張率も大きなものとなった。When the silica content was at a level of 70 wt%, the coefficient of linear expansion was 17 to 20 ppm, showing a coefficient of linear expansion comparable to that of a circuit board. In Examples 1 to 3, the type of the glycidyl ether type epoxy resin was changed. However, the orthocresol type, the polyfunctional type, and the naphthalene type all showed good temporary press-bonding performance and sheet properties. In particular, the naphthalene type had a lower linear expansion coefficient than other skeletons. As compared with Example 1, the silica content was changed in Examples 5, 6, 7, and 8. However, when spherical silica was used in its entirety, the gloss of the sheet surface was reduced and the sheet was somewhat brittle. Further, in the region where the use amount of the fine-particle spherical silica exceeds 50%, the sheet was hard and slightly brittle, and some unfilling occurred in the evaluation of the temporary press-bonding with the copper plate. In Examples 1 and 6 and Comparative Examples 1, 2, and 4, the amount of silica used was changed. However, when the amount of silica used was 50 wt% or less, the flow out during temporary compression bonding and the stickiness of the sheet surface became severe, and the sheet There was no support. In addition, 80wt%
When it exceeded, temporary compression bonding was not possible, and the sheet was brittle. Compared to Example 1, in Examples 4 and 9, and Comparative Example 3, the ratio of the phenoxy resin in the resin mixture was changed.
When it is less than wt%, the sheet is soft and the supportability is reduced,
If it exceeds 50 wt%, it becomes a hard and brittle sheet,
Unfilling also occurred in the temporary press bonding. In Example 10 and Comparative Example 3, the softening point of the resin mixture was changed. However, when the softening point exceeded 100 ° C., unfilling occurred slightly. In the case of Comparative Example 4 in which silica was not blended, the flow out during temporary press-bonding, the stickiness of the sheet surface became severe, there was no sheet support, and the coefficient of linear expansion was large.
【００３９】[0039]
【発明の効果】本発明のフィルム状接着剤用組成物によ
って、マイルドな条件で仮圧着が可能な、低線膨張率の
半導体チップ接合用フィルム状接着剤を提供することが
できる。本発明のフィルム状接着剤用組成物は、半導体
チップとリードフレーム、回路基板に近づけた線膨張率
を持つことから、半導体チップとリードフレーム、回路
基板等の組み合わせのような異種材料の接合時に発生す
る応力を最小限に留めることが可能になることから、製
品の破壊を防止することができる。更に、軟化点を調整
した樹脂混合物をバインダーとして使用することで、低
温、低圧、短時間のマイルドな条件での仮圧着が可能と
なり、ペースト材料使用時のディスペンス方式に比べ
て、生産速度を落とすことなく、かつボイドが発生しに
くいので平滑な位置精度の高い接着層を形成することが
可能となる。According to the composition for a film adhesive of the present invention, it is possible to provide a film adhesive for bonding semiconductor chips having a low coefficient of linear expansion, which can be temporarily pressed under mild conditions. Since the composition for a film adhesive of the present invention has a linear expansion coefficient close to that of a semiconductor chip and a lead frame, and a circuit board, it can be used when joining different kinds of materials such as a combination of a semiconductor chip and a lead frame or a circuit board. Since it is possible to minimize the generated stress, it is possible to prevent the product from being broken. Furthermore, by using a resin mixture whose softening point has been adjusted as a binder, temporary compression bonding can be performed under low-temperature, low-pressure, short-time mild conditions, and the production speed is reduced as compared with the dispensing method when using a paste material. Without the occurrence of voids, it is possible to form a smooth adhesive layer with high positional accuracy.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 西尾 公孝 千葉県木更津市築地１番地 新日鐵化学株 式会社電子材料開発センター内 Ｆターム(参考） 4J004 AA02 AA11 AA13 AA17 AA18 AB04 BA02 FA05 4J040 EC021 EC031 EC051 EC061 EC071 EC081 EC161 EC171 EE061 EE062 HA306 HB22 HB36 HC01 HC15 HC16 HC21 HC24 HD43 JA02 JA09 JB02 KA03 KA16 KA42 LA03 LA06 LA08 LA09 NA20 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Kimitaka Nishio 1 Tsukiji, Kisarazu-shi, Chiba F-term in Nippon Steel Chemical Co., Ltd. Electronic Materials Development Center (reference) 4J004 AA02 AA11 AA13 AA17 AA18 AB04 BA02 FA05 4J040 EC021 EC031 EC051 EC061 EC071 EC081 EC161 EC171 EE061 EE062 HA306 HB22 HB36 HC01 HC15 HC16 HC21 HC24 HD43 JA02 JA09 JB02 KA03 KA16 KA42 LA03 LA06 LA08 LA09 NA20
Claims (5)
（Ｃ）グリシジルエーテル型エポキシ樹脂及び（Ｄ）エ
ポキシ樹脂硬化剤を必須成分とし、組成物中のシリカ含
有量が５０〜８０ｗｔ％であり、且つ（Ｂ）フェノキシ
樹脂／（Ｃ）グリシジルエーテル型エポキシ樹脂の重量
比が０．０２〜１の範囲であることを特徴とするフィル
ム状接着剤用組成物。(A) silica, (B) a phenoxy resin,
(C) a glycidyl ether type epoxy resin and (D) an epoxy resin curing agent as essential components, a silica content of 50 to 80 wt% in the composition, and (B) a phenoxy resin / (C) glycidyl ether type epoxy A composition for a film adhesive, wherein the weight ratio of the resin is in the range of 0.02 to 1.
シリカと、平均粒径０．１〜５μｍの微粒子球状シリカ
の混合物であり、全シリカ中に占める微粒子球状シリカ
の割合が５０ｗｔ％以下である請求項１記載のフィルム
状接着剤用組成物。2. The silica is a mixture of spherical silica having an average particle size of 5 to 40 μm and fine particle spherical silica having an average particle size of 0.1 to 5 μm, and the ratio of the fine particle spherical silica in the total silica is 50 wt% or less. The composition for a film adhesive according to claim 1, which is:
以下である請求項１又は２記載のフィルム状接着剤用組
成物。3. The softening point of the resin component in the composition is 100 ° C.
The composition for a film adhesive according to claim 1, wherein the composition is:
ム状接着剤用組成物を厚さ１０〜１５０μｍのフィルム
状にしてなるフィルム状接着剤。4. A film adhesive obtained by converting the composition for a film adhesive according to claim 1 into a film having a thickness of 10 to 150 μm.
物であって常温での線膨張率が３０（×１０-6）以下で
あるフィルム状接着剤。5. A cured product of the film adhesive according to claim 4, which has a coefficient of linear expansion at room temperature of 30 (× 10 −6 ) or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22261999A JP4642173B2 (en) | 1999-08-05 | 1999-08-05 | Composition for film adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22261999A JP4642173B2 (en) | 1999-08-05 | 1999-08-05 | Composition for film adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001049220A true JP2001049220A (en) | 2001-02-20 |
| JP4642173B2 JP4642173B2 (en) | 2011-03-02 |
Family
ID=16785301
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22261999A Expired - Lifetime JP4642173B2 (en) | 1999-08-05 | 1999-08-05 | Composition for film adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4642173B2 (en) |
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| JP2003268337A (en) * | 2002-03-15 | 2003-09-25 | Denki Kagaku Kogyo Kk | Adhesive composition and adhesive sheet |
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