JPH0711888Y2 - 石材研磨加工用レジンポリッシャー - Google Patents
石材研磨加工用レジンポリッシャーInfo
- Publication number
- JPH0711888Y2 JPH0711888Y2 JP12287890U JP12287890U JPH0711888Y2 JP H0711888 Y2 JPH0711888 Y2 JP H0711888Y2 JP 12287890 U JP12287890 U JP 12287890U JP 12287890 U JP12287890 U JP 12287890U JP H0711888 Y2 JPH0711888 Y2 JP H0711888Y2
- Authority
- JP
- Japan
- Prior art keywords
- pedestal
- polishing
- polisher
- abrasive layer
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004575 stone Substances 0.000 title claims description 7
- 239000011347 resin Substances 0.000 title claims description 6
- 229920005989 resin Polymers 0.000 title claims description 6
- 238000005498 polishing Methods 0.000 title description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 11
- 244000145845 chattering Species 0.000 description 9
- 239000003082 abrasive agent Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12287890U JPH0711888Y2 (ja) | 1990-11-24 | 1990-11-24 | 石材研磨加工用レジンポリッシャー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12287890U JPH0711888Y2 (ja) | 1990-11-24 | 1990-11-24 | 石材研磨加工用レジンポリッシャー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0479053U JPH0479053U (enrdf_load_html_response) | 1992-07-09 |
| JPH0711888Y2 true JPH0711888Y2 (ja) | 1995-03-22 |
Family
ID=31870620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12287890U Expired - Lifetime JPH0711888Y2 (ja) | 1990-11-24 | 1990-11-24 | 石材研磨加工用レジンポリッシャー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711888Y2 (enrdf_load_html_response) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6323911B1 (en) | 1995-10-02 | 2001-11-27 | Starsight Telecast, Inc. | System and method for using television schedule information |
| US7801888B2 (en) | 2007-03-09 | 2010-09-21 | Microsoft Corporation | Media content search results ranked by popularity |
-
1990
- 1990-11-24 JP JP12287890U patent/JPH0711888Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0479053U (enrdf_load_html_response) | 1992-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4252093B2 (ja) | 円盤状基板の研削方法、研削装置 | |
| JP2003300165A (ja) | セグメントタイプ砥石 | |
| JP3830291B2 (ja) | 研磨砥石の作製方法 | |
| JPH0711888Y2 (ja) | 石材研磨加工用レジンポリッシャー | |
| JP2564223B2 (ja) | ドーナツ型基板の切出し研削具および切出し研削方法 | |
| JPH1177515A (ja) | 平面研磨装置及び研磨装置に用いる研磨布 | |
| JP2003236743A5 (enrdf_load_html_response) | ||
| JPH1133918A (ja) | 磁気記録媒体用基板の内外径加工用砥石及び内外径加工方法 | |
| JPH05208373A (ja) | 切断砥石及び切断方法 | |
| JP2542445Y2 (ja) | バフ溝加工装置 | |
| JP3368928B2 (ja) | 押出成形用金型の製造方法 | |
| JPH07100737A (ja) | 半導体ウエーハの研磨方法 | |
| KR19980080547A (ko) | 디스크 기판 중간체와 그 제조 방법 및 연삭 가공 장치 | |
| JP2003291069A (ja) | 研削盤用の砥石及びこの砥石を使用する研削方法 | |
| JP2762200B2 (ja) | ウエーハ面取部研磨用バフの総形溝加工装置 | |
| JP2001205548A (ja) | 片面研削装置および片面研削方法 | |
| JPS6322259A (ja) | 半導体ウエハ加工方法および加工装置 | |
| JP2000190199A (ja) | 定盤平面修正方法 | |
| JPH0111415Y2 (enrdf_load_html_response) | ||
| JPH10249625A (ja) | ダイヤモンドコーティングエンドミル及びその製造方法 | |
| JPH07223152A (ja) | 平面研削盤 | |
| JPH03104567A (ja) | 研削砥石及び研削方法 | |
| JP2005028513A (ja) | 被加工球の球形仕上げ加工方法及び被加工球の球形仕上げ加工装置 | |
| JPH11156617A (ja) | ダイヤモンドコアドリル | |
| JPH027014Y2 (enrdf_load_html_response) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |