JPH07111254A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPH07111254A
JPH07111254A JP5253978A JP25397893A JPH07111254A JP H07111254 A JPH07111254 A JP H07111254A JP 5253978 A JP5253978 A JP 5253978A JP 25397893 A JP25397893 A JP 25397893A JP H07111254 A JPH07111254 A JP H07111254A
Authority
JP
Japan
Prior art keywords
resist
package
chip
chips
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5253978A
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuaki Fujihira
充明 藤平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP5253978A priority Critical patent/JPH07111254A/ja
Priority to TW083108399A priority patent/TW255987B/zh
Priority to US08/319,546 priority patent/US5593926A/en
Priority to KR1019940025950A priority patent/KR950012641A/ko
Priority to CA002117818A priority patent/CA2117818A1/en
Priority to EP94116085A priority patent/EP0647967A3/en
Publication of JPH07111254A publication Critical patent/JPH07111254A/ja
Pending legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing

Landscapes

  • Dicing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Die Bonding (AREA)
JP5253978A 1993-10-12 1993-10-12 半導体装置の製造方法 Pending JPH07111254A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP5253978A JPH07111254A (ja) 1993-10-12 1993-10-12 半導体装置の製造方法
TW083108399A TW255987B (enExample) 1993-10-12 1994-09-12
US08/319,546 US5593926A (en) 1993-10-12 1994-10-07 Method of manufacturing semiconductor device
KR1019940025950A KR950012641A (ko) 1993-10-12 1994-10-11 반도체장치의 제조방법
CA002117818A CA2117818A1 (en) 1993-10-12 1994-10-11 Method of manufacturing semiconductor device
EP94116085A EP0647967A3 (en) 1993-10-12 1994-10-12 Method of assembling a semiconductor chip.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5253978A JPH07111254A (ja) 1993-10-12 1993-10-12 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPH07111254A true JPH07111254A (ja) 1995-04-25

Family

ID=17258574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5253978A Pending JPH07111254A (ja) 1993-10-12 1993-10-12 半導体装置の製造方法

Country Status (6)

Country Link
US (1) US5593926A (enExample)
EP (1) EP0647967A3 (enExample)
JP (1) JPH07111254A (enExample)
KR (1) KR950012641A (enExample)
CA (1) CA2117818A1 (enExample)
TW (1) TW255987B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2006303481A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法、及び固体撮像装置
JP2011040573A (ja) * 2009-08-11 2011-02-24 Renesas Electronics Corp 半導体装置の製造方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2006303481A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法、及び固体撮像装置
JP2011040573A (ja) * 2009-08-11 2011-02-24 Renesas Electronics Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
EP0647967A2 (en) 1995-04-12
CA2117818A1 (en) 1995-04-13
US5593926A (en) 1997-01-14
TW255987B (enExample) 1995-09-01
KR950012641A (ko) 1995-05-16
EP0647967A3 (en) 1997-05-21

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