JPH06827Y2 - 小型スタツド形半導体用絶縁ヒートシンク - Google Patents
小型スタツド形半導体用絶縁ヒートシンクInfo
- Publication number
- JPH06827Y2 JPH06827Y2 JP13925288U JP13925288U JPH06827Y2 JP H06827 Y2 JPH06827 Y2 JP H06827Y2 JP 13925288 U JP13925288 U JP 13925288U JP 13925288 U JP13925288 U JP 13925288U JP H06827 Y2 JPH06827 Y2 JP H06827Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- ceramic thin
- copper
- thin plate
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 239000000919 ceramic Substances 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- 239000000498 cooling water Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000010292 electrical insulation Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241001385733 Aesculus indica Species 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13925288U JPH06827Y2 (ja) | 1988-10-27 | 1988-10-27 | 小型スタツド形半導体用絶縁ヒートシンク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13925288U JPH06827Y2 (ja) | 1988-10-27 | 1988-10-27 | 小型スタツド形半導体用絶縁ヒートシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260254U JPH0260254U (enrdf_load_stackoverflow) | 1990-05-02 |
| JPH06827Y2 true JPH06827Y2 (ja) | 1994-01-05 |
Family
ID=31402338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13925288U Expired - Lifetime JPH06827Y2 (ja) | 1988-10-27 | 1988-10-27 | 小型スタツド形半導体用絶縁ヒートシンク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06827Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3996133A4 (en) * | 2019-07-02 | 2022-07-13 | Mitsubishi Electric Corporation | POWER MODULE AND MANUFACTURING METHOD THEREOF |
-
1988
- 1988-10-27 JP JP13925288U patent/JPH06827Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0260254U (enrdf_load_stackoverflow) | 1990-05-02 |
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