JPH068087A - Wafer grinding suction board - Google Patents
Wafer grinding suction boardInfo
- Publication number
- JPH068087A JPH068087A JP16799792A JP16799792A JPH068087A JP H068087 A JPH068087 A JP H068087A JP 16799792 A JP16799792 A JP 16799792A JP 16799792 A JP16799792 A JP 16799792A JP H068087 A JPH068087 A JP H068087A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- housing
- plate
- suction plate
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ウエーハの表面を研削
する研削装置において、ウエーハを真空吸着してこれを
保持するウエーハ研削用吸着盤に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer grinding suction plate for vacuum-sucking and holding a wafer in a grinding apparatus for grinding the surface of a wafer.
【０００２】[0002]
【従来の技術】斯かる吸着盤の従来例を図３に示す。即
ち、図３は従来の吸着盤１０１の縦断面図であり、同図
において、１１０は通気性を有するポーラスセラミック
等から成る円板状の吸着プレートであって、これはその
外周面に無機ガラス接着剤を塗布された状態で保持リン
グ１０２に嵌め込まれて該保持リング１０２に接着固定
されている。尚、保持リング１０２は非通気性の緻密セ
ラミック等で構成されている。2. Description of the Related Art FIG. 3 shows a conventional example of such a suction plate. That is, FIG. 3 is a vertical cross-sectional view of a conventional suction plate 101. In FIG. 3, 110 is a disc-shaped suction plate made of porous ceramic or the like having air permeability, and has an inorganic glass on its outer peripheral surface. The adhesive is applied to the holding ring 102 and fixed to the holding ring 102 by adhesion. The holding ring 102 is made of a non-breathable dense ceramic or the like.
【０００３】又、１１１は不図示の回転テーブル上に固
定された円板状のロータプレートであって、該ロータプ
レート１１１上には、間に非通気性緻密セラミック等か
ら成る円板状プレート１０３を介在させて、前記保持リ
ング１０２がボルト或いはボルトと接着剤によって結着
されている。尚、円板状プレート１０３及びロータプレ
ート１１１の各中心部には真空孔１０４が穿設されてお
り、吸着プレート１１０は真空孔１０４を介して不図示
の真空源に連結されている。Further, 111 is a disk-shaped rotor plate fixed on a rotary table (not shown), and on the rotor plate 111, there is a disk-shaped plate 103 made of non-breathable dense ceramic or the like. The holding ring 102 is bonded by a bolt or a bolt and an adhesive with the interposition of. A vacuum hole 104 is formed at the center of each of the disc-shaped plate 103 and the rotor plate 111, and the suction plate 110 is connected to a vacuum source (not shown) through the vacuum hole 104.
【０００４】而して、上記構成を有する吸着盤１０１に
おいては、吸着プレート１１０が前記真空孔１０４を介
して不図示の真空源によって真空引きされると、該吸着
プレート１１０上にはウエーハＷが真空吸着されて保持
される。In the suction plate 101 having the above structure, when the suction plate 110 is evacuated by the vacuum source (not shown) through the vacuum holes 104, the wafer W is placed on the suction plate 110. It is vacuum-adsorbed and held.
【０００５】[0005]
【発明が解決しようとする課題】ところが、上記従来の
吸着盤１０１は、保持リング１０２、円板状プレート１
０３及びロータプレート１１１を結着して成る三層構造
を有しているため、保持リング１０２と円板状プレート
１０３の合せ面ａ及び円板状プレート１０３とロータプ
レート１１１の合せ面ｂに密着不良に起因する僅かな隙
間が発生する。However, in the conventional suction plate 101, the holding ring 102 and the disk-shaped plate 1 are used.
03 and the rotor plate 111 are bonded to each other, so that the retaining ring 102 and the disc-shaped plate 103 are closely attached to each other, and the disc-shaped plate 103 and the rotor plate 111 are closely attached to each other. A slight gap is generated due to the defect.
【０００６】而して、ウエーハＷを真空吸着すると、該
ウエーハＷを介して吸着プレート１１０には約１Ｋｇ／
ｃｍ2 の大気圧が作用するため、該吸着プレート１１０
が前記合わせ面ａ，ｂに発生する隙間或いは自身の内部
変形によって０．１〜１μｍのオーダーで凹状に撓み変
形し、斯かる吸着プレート１１０に吸着保持されたウエ
ーハＷを高精度研削すると、吸着プレート１１０の凹状
に変形した部分でのウエーハＷの厚さは少なくとも吸着
プレート１１０の凹状変形量だけ厚くなり、ウエーハＷ
の平坦度（ＴＴＶ）を高く保つことができないという問
題が発生する。そして、この問題は特にウエーハＷの径
が大きいと顕著である。尚、従来はロータプレート１１
１はＳＵＳ等で構成され、これと円板状プレート１０３
との材質が異なっていたため、両者の熱膨張差に起因し
てこれらの合せ面ｂには密着不良が生じ易かった。Then, when the wafer W is vacuum-sucked, the suction plate 110 receives about 1 kg / g of the wafer W through the vacuum suction.
Since the atmospheric pressure of cm 2 acts, the adsorption plate 110
Is bent and deformed into a concave shape on the order of 0.1 to 1 μm due to a gap generated in the mating surfaces a and b or internal deformation of itself, and when the wafer W sucked and held by the suction plate 110 is highly accurately ground, The thickness of the wafer W at the concavely deformed portion of the plate 110 is increased by at least the amount of concave deformation of the suction plate 110.
The flatness (TTV) cannot be kept high. And this problem is remarkable especially when the diameter of the wafer W is large. Conventionally, the rotor plate 11
Reference numeral 1 is made of SUS or the like, and the disc-shaped plate 103
Since the materials are different from each other, poor adhesion is likely to occur on these mating surfaces b due to the difference in thermal expansion between the two.
【０００７】又、吸着プレート１１０は、無機ガラス接
着剤によってその外周部が保持リング１０２の内周部に
接着されるが、該吸着プレート１１０は前述のように通
気性を有するポーラスセラミック等で構成されるため、
吸着プレート１１０の外周部及び／又は保持リング１０
２の内周部に無機ガラス接着剤を塗布して該吸着プレー
ト１１０を接着せしめる際、同接着剤の一部は吸着プレ
ート１１０の外周部より径の中心方向に浸透するため、
塗布した無機ガラス接着剤の全てが吸着プレート１１０
の接着に寄与しない。このため、吸着プレート１１０と
保持リング１０２の間に接着不良による緩みが生じ、こ
の状態の吸着盤１０１を用いてウエーハＷを研削する
と、ウエーハＷが振れて高精度な研削ができなくなり、
ウエーハＷの平坦度が悪くなる。尚、研削中、ウエーハ
Ｗの周辺に印加される応力や発熱によって、吸着プレー
ト１１０の接着部が破壊される場合も上記と同様の問題
が発生することは言うまでもない。従って、例えば非耐
熱性の有機質接着剤を使用するのは問題がある。The outer circumference of the suction plate 110 is adhered to the inner circumference of the holding ring 102 with an inorganic glass adhesive. The suction plate 110 is made of porous ceramic having air permeability as described above. Because
The outer periphery of the suction plate 110 and / or the retaining ring 10
When the inorganic glass adhesive is applied to the inner peripheral portion of 2 to adhere the adsorption plate 110, part of the adhesive penetrates from the outer peripheral portion of the adsorption plate 110 in the direction of the center of the diameter.
All of the applied inorganic glass adhesive is the adsorption plate 110.
Does not contribute to adhesion. For this reason, loosening occurs due to defective adhesion between the suction plate 110 and the holding ring 102, and when the wafer W is ground using the suction plate 101 in this state, the wafer W swings and high-precision grinding cannot be performed.
The flatness of the wafer W deteriorates. Needless to say, the same problem as described above occurs when the adhesive portion of the suction plate 110 is broken by stress or heat generated around the wafer W during grinding. Therefore, it is problematic to use, for example, a non-heat resistant organic adhesive.
【０００８】又、吸着プレート１１０の外周部より径の
中心方向に浸透した無機ガラス接着は固化することによ
って非通気部を形成する。従って、吸着プレート１１０
の非通気部を除く通気部の外径がウエーハＷの外径より
も小さい場合には、ウエーハＷの外周部が吸着プレート
１１０の通気部から外方へはみ出てこの部分が十分吸着
されず、はみ出た部分がより多く研削され、ウエーハＷ
の外周部がリング状に薄くなって該ウエーハＷの平坦度
を高く保つことができないという問題が発生する。Further, the inorganic glass adhesive that has penetrated from the outer peripheral portion of the adsorption plate 110 toward the center of the diameter is solidified to form a non-venting portion. Therefore, the suction plate 110
When the outer diameter of the ventilation part excluding the non-ventilation part is smaller than the outer diameter of the wafer W, the outer peripheral part of the wafer W protrudes outward from the ventilation part of the suction plate 110 and this part is not sufficiently adsorbed, The protruding part is ground more and the wafer W
The outer peripheral portion of the wafer W becomes thin like a ring, and the flatness of the wafer W cannot be kept high.
【０００９】本発明は上記問題に鑑みてなされたもの
で、その目的とする処は、大口径のウエーハを吸着して
も微小変形を生じず、ウエーハの高平坦度な研削を可能
ならしめるウエーハ研削用吸着盤を提供することにあ
る。The present invention has been made in view of the above problems, and an object of the present invention is to make a wafer capable of high flatness grinding without causing microdeformation even if a large diameter wafer is adsorbed. It is to provide a suction cup for grinding.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成すべく本
発明は、中央部に円形凹部を有し、該円形凹部に複数の
環状溝と該環状溝を連通せしめる放射線状の溝を形成し
て成る非通気性の一体型ハウジングの前記円形凹部内
に、予めその外周部の一定幅に流動性の無機ガラス接着
剤を浸透せしめた後にこれを固化することによってガラ
ス浸透固化部を形成して成る、通気性を有する円板状吸
着プレートを、その外周部及び／又は前記一体型ハウジ
ングの内周部に無機ガラス接着剤を塗布した状態で嵌め
込んでこれを接着固定し、前記ハウジングをこれと同材
質の非通気性ロータプレート上に着脱自在に結着してウ
エーハ研削用吸着盤を構成したことを特徴とする。In order to achieve the above object, the present invention has a circular recess in the center, and a plurality of annular grooves and a radial groove for communicating the annular grooves are formed in the circular recess. In the circular recess of the non-air-permeable integral housing, a glass permeation and solidification portion is formed by preliminarily permeating a fluid inorganic glass adhesive to a constant width of its outer peripheral portion and then solidifying the same. The air-permeable disc-shaped adsorption plate is fitted into the outer peripheral portion and / or the inner peripheral portion of the integral housing in a state in which an inorganic glass adhesive is applied, and the adhesive is fixed to the housing. It is characterized in that a suction plate for wafer grinding is constructed by detachably binding to a non-breathable rotor plate made of the same material.
【００１１】又、本発明は、前記吸着プレートのガラス
浸透固化部を除く通気性部の外径Ｄｐを、ウエーハ外径
Ｄｗよりも大きく（Ｄｐ＞Ｄｗ）設定したことをその特
徴とする。Further, the present invention is characterized in that the outer diameter Dp of the gas permeable portion of the suction plate excluding the glass permeation and solidification portion is set to be larger than the outer diameter Dw of the wafer (Dp> Dw).
【００１２】[0012]
【作用】本発明に係る吸着盤は、一体型ハウジングとロ
ータプレートを結合して成る二層構造を構成し、従っ
て、合せ面としてはハウジングとロータプレートとの合
せ面の１つだけとなり、しかも、ハウジングとロータプ
レートとは同材質で構成されるため、両者の熱膨張差に
よる接着不良が発生せず、真空吸着時にウエーハを介し
て吸着プレートに約１Ｋｇ／ｃｍ2 の大気圧が作用して
も、吸着プレートの変形が防がれ、ウエーハはその表面
が均一に研削されてその平坦度が高く保たれる。The suction plate according to the present invention has a two-layer structure in which an integral housing and a rotor plate are connected to each other, and therefore, the mating surface is only one of the mating surfaces of the housing and the rotor plate. Since the housing and the rotor plate are made of the same material, there is no adhesion failure due to the difference in thermal expansion between the two, and an atmospheric pressure of about 1 kg / cm 2 acts on the adsorption plate via the wafer during vacuum adsorption. However, the suction plate is prevented from being deformed, and the surface of the wafer is evenly ground so that its flatness is kept high.
【００１３】又、吸着プレートの外周部には予めガラス
浸透固化部が形成されているため、該吸着プレートのハ
ウジングへの嵌め込み時に塗布された無機ガラス接着剤
の吸着プレートへの浸透がガラス浸透固化部によって阻
止され、吸着プレートの外周面部及び／又はハウジング
の内周部に塗布された無機ガラス接着剤はその全てが接
着に供される。従って、吸着プレートは、その外周がハ
ウジングの凹部に均一、且つ強固に接着され、これの経
時的な接着不良が防がれ、これによってもウエーハの平
担度が高く保たれる。Further, since the glass permeation and solidification portion is formed in advance on the outer peripheral portion of the adsorption plate, the permeation of the inorganic glass adhesive applied when the adsorption plate is fitted into the housing into the adsorption plate is glass permeation and solidification. All of the inorganic glass adhesive applied to the outer peripheral surface of the suction plate and / or the inner peripheral portion of the housing is blocked by the section and is used for bonding. Therefore, the outer periphery of the suction plate is evenly and firmly adhered to the concave portion of the housing, and it is possible to prevent defective adhesion over time, which also keeps the flatness of the wafer high.
【００１４】更に、吸着プレートの通気部の外径Ｄｐは
ウエーハ外径Ｄｗよりも大きく（Ｄｐ＞Ｄｗ）設定され
ているため、ウエーハはその全てが吸着プレートの通気
部に十分吸着され、該ウエーハは、たとえその直径が大
きくても、表面が均一に研削されて高い平坦度を保つこ
とができる。Further, since the outer diameter Dp of the ventilation portion of the suction plate is set to be larger than the outer diameter Dw of the wafer (Dp> Dw), all of the wafer is sufficiently adsorbed by the ventilation portion of the suction plate, , Even if its diameter is large, the surface can be uniformly ground to maintain high flatness.
【００１５】[0015]
【実施例】以下に本発明の一実施例を添付図面に基づい
て説明する。An embodiment of the present invention will be described below with reference to the accompanying drawings.
【００１６】図１は本発明に係るウエーハ研削用吸着盤
の縦断面図、図２は該吸着盤を構成するハウジングの平
面図である。FIG. 1 is a vertical sectional view of a suction plate for wafer grinding according to the present invention, and FIG. 2 is a plan view of a housing constituting the suction plate.
【００１７】図１に示す吸着盤１において、２はその中
央部に円形凹部３を形成して成る皿状の一体型ハウジン
グであって、該ハウジング２は例えばＡｌ2 Ｏ3 系緻密
セラミック等の非通気性材料で構成されている。そし
て、このハウジング２の中心部には真空孔４が穿設され
ており、凹部３の底面上には、図２に示すように、前記
真空孔４を中心とする同心円状の複数の環状溝５，６，
７と真空孔４から径方向外方に放射状に延びる複数の溝
８が形成されており、環状溝５，６，７は溝８によって
互いに連通せしめられている。又、ハウジング２の外周
部には、複数のボルト孔９が穿設されている。In the suction cup 1 shown in FIG. 1, reference numeral 2 denotes a dish-shaped integral housing having a circular recess 3 formed in the center thereof, and the housing 2 is made of, for example, Al 2 O 3 dense ceramic. Composed of non-breathable material. A vacuum hole 4 is formed in the center of the housing 2, and a plurality of concentric circular grooves centering on the vacuum hole 4 are formed on the bottom surface of the recess 3 as shown in FIG. 5, 6,
7 and a plurality of grooves 8 extending radially outward from the vacuum holes 4 are formed, and the annular grooves 5, 6, 7 are connected to each other by the grooves 8. A plurality of bolt holes 9 are formed in the outer peripheral portion of the housing 2.
【００１８】而して、上記ハウジング２の凹部３には、
例えばＡｌ2 Ｏ3 系ポーラスセラミック等の通気性材料
で構成された円板状の吸着プレート１０が嵌め込まれて
接着されているが、この吸着プレート１０の凹部３への
嵌め込み接着は次の要領でなされる。Thus, in the recess 3 of the housing 2,
For example, a disk-shaped suction plate 10 made of a breathable material such as Al 2 O 3 -based porous ceramic is fitted and adhered. The suction plate 10 is fitted and adhered to the recess 3 in the following manner. Done.
【００１９】即ち、吸着プレート１０の外周部には予め
無機ガラス接着剤が浸透固化されて非通気性のガラス浸
透固化部（非通気部）１０ａが形成されており、該吸着
プレート１０は、その外周部及び／又はハウジング２の
接合される内周部に流動性の無機ガラス接着剤を塗布し
た状態でハウジング２の凹部３内に嵌め込まれ、その後
加熱による焼結によって両部材は強固に接着される。
尚、吸着プレート１０において、その外周部に形成され
た前記ガラス浸透固化部１０ａを除く通気部１０ｂの外
径Ｄｐは、ウエーハ外径Ｄｗよりも大きく（Ｄｐ＞Ｄ
ｗ）設定されている（図１参照）。That is, an inorganic glass adhesive is preliminarily permeated and solidified on the outer peripheral portion of the adsorption plate 10 to form a non-permeable glass permeation and solidification portion (non-permeation portion) 10a. The outer peripheral portion and / or the inner peripheral portion to which the housing 2 is joined are fitted in the concave portion 3 of the housing 2 in a state in which a fluid inorganic glass adhesive is applied, and then both members are firmly adhered by sintering by heating. It
In the suction plate 10, the outer diameter Dp of the ventilation portion 10b formed on the outer peripheral portion thereof except the glass permeation and solidification portion 10a is larger than the wafer outer diameter Dw (Dp> D).
w) It is set (see FIG. 1).
【００２０】ここで、吸着プレート１０をハウジング２
に接着するための上記無機ガラス接着剤としては、下記
のものを使用し得る。 常温乃至は３００℃以下の比較的低温での接着が可能
な無機ガラス接着剤であって、無機バインダーに、必要
に応じて硬化剤や充填剤を添加して使用される。水ガラ
スを代表とする珪酸アルカリ系の他、リン酸塩系、シリ
カゾル系等の各種接着剤がある。 融点が４００〜５００℃程度の低融点ガラスで、Ｐｂ
Ｏを添加した低融点ガラスが代表例である。セラミック
界面ではセラミック粒界のガラス成分、金属界面ではそ
の金属酸化物の層が、低融点ガラスとそれぞれ化学結合
して良好な接着が得られる。 融点８００℃以上の高融点ガラスを接着剤とするもの
で、高融点酸化物ソルダーとも呼ばれる。該接着剤によ
る接着は、酸化物ガラスとセラミック結晶とが共融物若
しくはガラス結合を形成することによって果たされる。
高融点酸化ガラスの素材としては、ＳｉＯ2 やＣａＯ、
Ａｌ2 Ｏ3 を主成分とするものが用いられる。Here, the suction plate 10 is attached to the housing 2
The following may be used as the above-mentioned inorganic glass adhesive for adhering to. It is an inorganic glass adhesive capable of bonding at a relatively low temperature of room temperature to 300 ° C. or less, and is used by adding a curing agent and a filler to an inorganic binder, if necessary. In addition to alkali silicate typified by water glass, various adhesives such as phosphate and silica sol are available. A low melting point glass having a melting point of about 400 to 500 ° C., Pb
A typical example is a low melting point glass to which O is added. The glass component of the ceramic grain boundary at the ceramic interface and the layer of the metal oxide at the metal interface chemically bond with the low melting point glass, respectively, to obtain good adhesion. A high melting point glass having a melting point of 800 ° C. or higher is used as an adhesive and is also called a high melting point oxide solder. Bonding with the adhesive is accomplished by the oxide glass and ceramic crystals forming a eutectic or glass bond.
As materials for high melting point oxide glass, SiO 2 , CaO,
A material containing Al 2 O 3 as a main component is used.
【００２１】本実施例では、無機ガラス接着剤として、
ＳｉＯ2 約５０％とＡｌ2 Ｏ3 約１０％、その他ＣａＯ
とＢａＯを添加した高融点酸化物ガラス剤を水で混練
し、これをポーラスセラミックから成る円板状の吸着プ
レート１０の外周部に塗布して乾燥後、１０００℃以上
の温度で熱処理することによりガラス浸透固化部１０ａ
を形成させる第１段階の前処理と、該前処理を行なった
吸着プレート１０の外周部及び／又はハウジング２の内
周部に、同接着剤を塗布した後、ハウジング２内に吸着
プレート１０を嵌め込んだものを乾燥後に熱処理し、両
部材を強固に接合せしめる第２段階の工程によって、吸
着プレート１０がハウジング２に接着される。In this embodiment, as the inorganic glass adhesive,
SiO 2 about 50%, Al 2 O 3 about 10%, other CaO
A high-melting-point oxide glass agent added with and BaO is kneaded with water, applied to the outer peripheral portion of a disk-shaped adsorption plate 10 made of porous ceramic, dried, and then heat-treated at a temperature of 1000 ° C. or higher. Glass penetration solidification part 10a
Of the first step of forming the suction plate 10, and after applying the same adhesive to the outer peripheral portion of the suction plate 10 and / or the inner peripheral portion of the housing 2 which has been subjected to the pretreatment, the suction plate 10 is placed in the housing 2. The suction plate 10 is adhered to the housing 2 by a second stage process in which the fitted product is dried and then heat treated to firmly bond both members.
【００２２】一方、図１において、１１は回転テーブル
１２上に固定された円板状のロータプレートであって、
これは前記ハウジング２と同材質の非通気性材料（Ａｌ
2 Ｏ3 系緻密セラミック等）で構成されている。そし
て、このロータプレート１１の中心には、前記真空孔４
に連通する真空孔１３が穿設されており、又、該ロータ
プレート１１上の大小異径のピッチ円上には複数のネジ
孔１４，１５，１６が形成されている。On the other hand, in FIG. 1, 11 is a disk-shaped rotor plate fixed on the rotary table 12,
This is a non-breathable material (Al
2 O 3 dense ceramics). The vacuum hole 4 is formed at the center of the rotor plate 11.
Is formed with a vacuum hole 13 communicating therewith, and a plurality of screw holes 14, 15 and 16 are formed on a pitch circle of different sizes on the rotor plate 11.
【００２３】而して、上記ロータプレート１１上には、
前記ハウジング２がこれのボルト挿通孔９に挿通する複
数のボルト１７によって着脱可能に結着されており、こ
れによって本発明に係る吸着盤１が構成されている。Thus, on the rotor plate 11,
The housing 2 is detachably attached by a plurality of bolts 17 which are inserted into the bolt insertion holes 9 of the housing 2, and thereby the suction plate 1 according to the present invention is constructed.
【００２４】ところで、一体化されたハウジング２と吸
着プレート１０のユニットは、吸着すべきウエーハＷの
サイズによって数種類のサイズのものが用意されてお
り、ウエーハＷのサイズが変われば、そのサイズに応じ
たハウジング２と吸着プレート１０のユニットが選択さ
れてこれがロータプレート１１上に取り付けられる。こ
のとき、ボルト１７はロータプレート１１に形成された
前記ネジ孔１４，１５，１６の中の適切なもの（図示例
では、ネジ孔１４）に螺合する。By the way, as the unit of the housing 2 and the suction plate 10 which are integrated, several kinds of sizes are prepared depending on the size of the wafer W to be sucked, and if the size of the wafer W is changed, the size is changed. A unit of the housing 2 and the suction plate 10 is selected and mounted on the rotor plate 11. At this time, the bolt 17 is screwed into an appropriate one (the screw hole 14 in the illustrated example) of the screw holes 14, 15, 16 formed in the rotor plate 11.
【００２５】而して、本実施例に係る吸着盤１において
は、吸着プレート１０が真空孔４，１３を介して不図示
の真空源によって真空引きされると、該吸着プレート１
０上にはウエーハＷが真空吸着されて保持され、該ウエ
ーハＷはその上面が研削される。In the suction plate 1 according to this embodiment, when the suction plate 10 is evacuated by the vacuum source (not shown) through the vacuum holes 4 and 13, the suction plate 1 is evacuated.
The wafer W is vacuum-sucked and held on the wafer 0, and the upper surface of the wafer W is ground.
【００２６】以上において、本実施例に係る吸着盤１に
おいては、従来の保持リング１０２と円板状プレート１
０３（図３参照）を一体化してハウジング２を構成した
ため、該ハウジング２とロータプレート１１を結合して
成る二層構造を構成し、従って、合せ面としてはハウジ
ング２とロータプレート１１との合せ面Ａの１つだけと
なり、しかもハウジング２とロータプレート１１とは同
材質で構成されるため、両者の熱膨張差による接着不良
が発生せず、真空吸着時にウエーハＷを介して吸着プレ
ート１０に約１Ｋｇ／ｃｍ2 の大気圧が作用しても、吸
着プレート１０の変形が防がれ、ウエーハＷはその表面
が均一に研削されてその平坦度が高く保たれる。As described above, in the suction plate 1 according to this embodiment, the conventional holding ring 102 and the disc-shaped plate 1 are used.
No. 03 (see FIG. 3) is integrated to form the housing 2, so that a two-layer structure is formed by connecting the housing 2 and the rotor plate 11. Therefore, as a mating surface, the housing 2 and the rotor plate 11 are aligned with each other. Since there is only one surface A, and since the housing 2 and the rotor plate 11 are made of the same material, adhesion failure due to the difference in thermal expansion between the two does not occur, and the suction plate 10 is attached to the suction plate 10 via the wafer W during vacuum suction. Even if an atmospheric pressure of about 1 Kg / cm 2 is applied, the suction plate 10 is prevented from being deformed, and the surface of the wafer W is uniformly ground to keep its flatness high.
【００２７】又、吸着プレート１０の外周部には予めガ
ラス浸透固化部１０ａが形成されているため、該吸着プ
レート１０のハウジング２への嵌め込み時に塗布された
無機ガラス接着剤の吸着プレート１０への浸透がガラス
浸透固化部１０ａによって阻止され、接合面に塗布され
た無機ガラス接着剤はその全てが接着に供される。従っ
て、吸着プレート１０は、その外周部がハウジング２の
内周部に均一、且つ強固に接着され、これの経時的な接
着不良が防がれ、これによってもウエーハＷの平担度が
高く保たれる。Further, since the glass permeation and solidification portion 10a is formed in advance on the outer peripheral portion of the adsorption plate 10, the inorganic glass adhesive applied when the adsorption plate 10 is fitted into the housing 2 is applied to the adsorption plate 10. Permeation is blocked by the glass permeation and solidification section 10a, and all of the inorganic glass adhesive applied to the joint surface is used for adhesion. Therefore, the suction plate 10 has its outer peripheral portion uniformly and strongly adhered to the inner peripheral portion of the housing 2 to prevent defective adhesion over time, which also keeps the flatness of the wafer W high. Be drunk
【００２８】更に、前述のように、吸着プレート１０の
通気部１０ｂの外径Ｄｐはウエーハ外径Ｄｗよりも大き
く（Ｄｐ＞Ｄｗ）設定されているため、ウエーハＷはそ
の全てが吸着プレート１０の通気部１０ｂに十分吸着さ
れ、該ウエーハＷは、たとえその直径が大きくても、表
面が均一に研削されて高い平坦度を保つことができる。Further, as described above, since the outer diameter Dp of the ventilation portion 10b of the suction plate 10 is set to be larger than the wafer outer diameter Dw (Dp> Dw), all of the wafer W is of the suction plate 10. Even if the diameter of the wafer W is large, the surface of the wafer W is evenly adsorbed to the ventilation portion 10b, and the surface can be uniformly ground to maintain high flatness.
【００２９】[0029]
【発明の効果】以上の説明で明らかな如く、本発明によ
れば、中央部に円形凹部を有し、該円形凹部に複数の環
状溝と該環状溝を連通せしめる放射線状の溝を形成して
成る非通気性の一体型ハウジングの前記円形凹部内に、
予めその外周部の一定幅に流動性の無機ガラス接着剤を
浸透せしめた後にこれを固化することによってガラス浸
透固化部を形成して成る、通気性を有する円板状吸着プ
レートを、その外周部及び／又は前記一体型ハウジング
の内周部に無機ガラス接着剤を塗布した状態で嵌め込ん
でこれを接着固定し、前記ハウジングをこれと同材質の
非通気性ロータプレート上に着脱自在に結着してウエー
ハ研削用吸着盤を構成したため、大口径のウエーハを吸
着しても吸着盤に微小変形が生じず、ウエーハの高平坦
度な研削が可能になるという効果が得られる。As is apparent from the above description, according to the present invention, a circular recess is formed in the central portion, and a plurality of annular grooves and a radial groove for communicating the annular grooves are formed in the circular recess. In the circular recess of the non-breathable one-piece housing
A disc-shaped adsorption plate having air permeability, which is formed by preliminarily infiltrating a fluid inorganic glass adhesive to a constant width of its outer peripheral portion and then solidifying the same to form a glass-permeated and solidified portion, having an outer peripheral portion thereof. And / or the inorganic glass adhesive is applied to the inner peripheral portion of the integral housing in a state of being adhered and fixed, and the housing is detachably attached to a non-breathable rotor plate made of the same material as the housing. Since the suction plate for wafer grinding is configured in this manner, even if a large-diameter wafer is sucked, the suction plate is not slightly deformed, and the wafer can be ground with high flatness.
【図１】本発明に係るウエーハ研削用吸着盤の縦断面図
である。FIG. 1 is a vertical cross-sectional view of a suction plate for wafer grinding according to the present invention.
【図２】ハウジングの平面図である。FIG. 2 is a plan view of a housing.
【図３】従来のウエーハ研削用吸着盤の縦断面図であ
る。FIG. 3 is a vertical sectional view of a conventional suction plate for wafer grinding.
１ ウエーハ研削用吸着盤 ２ ハウジング ３ 凹部 ５〜７ 環状溝 ８ 溝 １０ 吸着プレート １０ａ ガラス浸透固化部（非通気部） １０ｂ 通気部 １１ ロータプレート Ｗ ウエーハ 1 Wafer Adsorption board for grinding 2 Housing 3 Recesses 5-7 Annular groove 8 Groove 10 Adsorption plate 10a Glass permeation and solidification part (non-vented part) 10b Vented part 11 Rotor plate W Wafer
Claims (4)
複数の環状溝と該環状溝を連通せしめる放射線状の溝を
形成して成る非通気性の一体型ハウジングの前記円形凹
部内に、予めその外周部の一定幅に流動性の無機ガラス
接着剤を浸透せしめた後にこれを固化することによって
ガラス浸透固化部（非通気性部）を形成して成る、通気
性を有する円板状吸着プレートを、その外周部及び／又
は前記一体型ハウジングの内周部に無機ガラス接着剤を
塗布した状態で嵌め込んでこれを接着固定し、前記ハウ
ジングをこれと同材質の非通気性ロータプレート上に着
脱自在に結着して構成されることを特徴とするウエーハ
研削用吸着盤。1. A circular recess of a non-air-permeable integral housing, which has a circular recess in the center, and a plurality of annular grooves and radial grooves connecting the annular grooves to each other are formed in the circular recess. A disc having air permeability, which is formed by previously infiltrating a fluid inorganic glass adhesive to a fixed width of the outer peripheral portion of the glass and then solidifying the same to form a glass permeation and solidification portion (impermeable portion). -Like suction plate is fitted into the outer peripheral portion and / or the inner peripheral portion of the integral housing in a state in which an inorganic glass adhesive is applied, and this is adhesively fixed, and the housing is made of the same material as the non-permeable rotor. A suction plate for wafer grinding, characterized by being detachably attached to a plate.
ラスセラミックで構成されることを特徴とする請求項１
記載のウエーハ研削用吸着盤。2. The adsorption plate is made of Al 2 O 3 based porous ceramics.
Adsorption disc for wafer grinding described.
Ａｌ2 Ｏ3 系緻密セラミックで構成されることを特徴と
する請求項１記載のウエーハ研削用吸着盤。3. The housing and rotor plate are
The suction plate for wafer grinding according to claim 1, which is composed of an Al 2 O 3 -based dense ceramic.
除く通気性部の外径Ｄｐは、ウエーハ外径Ｄｗよりも大
きく（Ｄｐ＞Ｄｗ）設定されていることを特徴とする請
求項１記載のウエーハ研削用吸着盤。4. The outer diameter Dp of the gas permeable portion of the adsorption plate excluding the glass permeation and solidification portion is set to be larger than the outer diameter Dw of the wafer (Dp> Dw). Adsorber for grinding wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16799792A JP2711424B2 (en) | 1992-06-25 | 1992-06-25 | Adsorption machine for wafer grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16799792A JP2711424B2 (en) | 1992-06-25 | 1992-06-25 | Adsorption machine for wafer grinding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH068087A true JPH068087A (en) | 1994-01-18 |
| JP2711424B2 JP2711424B2 (en) | 1998-02-10 |
Family
ID=15859890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16799792A Expired - Fee Related JP2711424B2 (en) | 1992-06-25 | 1992-06-25 | Adsorption machine for wafer grinding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2711424B2 (en) |
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| JP2000058631A (en) * | 1998-03-02 | 2000-02-25 | Sumitomo Electric Ind Ltd | Holder for manufacturing semiconductor and manufacture thereof |
| JP2001138228A (en) * | 1999-11-19 | 2001-05-22 | Disco Abrasive Syst Ltd | Sucking plate, and grinding apparatus provided with the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000058631A (en) * | 1998-03-02 | 2000-02-25 | Sumitomo Electric Ind Ltd | Holder for manufacturing semiconductor and manufacture thereof |
| JP2001138228A (en) * | 1999-11-19 | 2001-05-22 | Disco Abrasive Syst Ltd | Sucking plate, and grinding apparatus provided with the same |
| US10253361B2 (en) | 2002-07-30 | 2019-04-09 | Applied Biosystems, Llc | Sample block apparatus and method for maintaining a microcard on a sample block |
| US20130045883A1 (en) * | 2002-07-30 | 2013-02-21 | Life Technologies Corporation | Sample Block Apparatus and Method for Maintaining a Microcard on a Sample Block |
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| JP4731368B2 (en) * | 2006-03-23 | 2011-07-20 | 京セラ株式会社 | Vacuum chuck and vacuum suction device using the same |
| JP2008132562A (en) * | 2006-11-28 | 2008-06-12 | Kyocera Corp | Vacuum chuck and vacuum suction device using it |
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| JP2010283286A (en) * | 2009-06-08 | 2010-12-16 | Disco Abrasive Syst Ltd | Work holder |
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