JPH0677300U - Circuit board support device - Google Patents
Circuit board support deviceInfo
- Publication number
- JPH0677300U JPH0677300U JP2015293U JP2015293U JPH0677300U JP H0677300 U JPH0677300 U JP H0677300U JP 2015293 U JP2015293 U JP 2015293U JP 2015293 U JP2015293 U JP 2015293U JP H0677300 U JPH0677300 U JP H0677300U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- main surface
- supporting
- circuit
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Abstract
(57)【要約】 （修正有）
【目的】 回路基板の印刷パターンに接触することな
く、その両側の下面両縁部を支承して保持する。
【構成】 回路基板１００を支持するテーブル１０は、
同基板１００の下側主面中央部に接触することなく対向
する主面１１と、主面の両側から上方へ突出した水平な
支持面１２、１２…とを備えている。このテーブル１０
の主面１１の略中央部に設けた貫通孔１５を通して空気
供給源から空気と送り出し、回路基板１００の下側側に
気流を形成する。この気流によりベルヌーイの定理によ
る差圧を生じさせ、この差圧を利用して回路基板１００
の下面両縁部を支持面１２、１２…上に押圧し、回路基
板１００を浮き上がることなく安定して支持する。
(57) [Summary] (Correction) [Purpose] To support and hold both edges of the lower surface on both sides of the printed circuit board without contacting the printed pattern. [Structure] The table 10 supporting the circuit board 100 is
The substrate 100 is provided with a main surface 11 that opposes the central portion of the lower main surface without contact, and horizontal support surfaces 12, 12 ... That protrude upward from both sides of the main surface. This table 10
The air is sent out from the air supply source through the through hole 15 provided in the substantially central portion of the main surface 11 of FIG. This air flow causes a differential pressure according to Bernoulli's theorem, and this differential pressure is used to make the circuit board 100.
Both edges of the lower surface of the circuit board are pressed onto the support surfaces 12, 12, ..., Thus, the circuit board 100 is stably supported without rising.
Description
【０００１】[0001]
本考案は回路基板の製造工程において使用される回路基板支持装置に関し、特 に、回路基板の下面に接触しないよう、基板の縁部で保持する非接触型の回路基 板支持装置に関する。 The present invention relates to a circuit board support device used in a process of manufacturing a circuit board, and more particularly to a non-contact type circuit board support device which is held by an edge portion of the circuit board so as not to contact the lower surface of the circuit board.
【０００２】[0002]
回路基板の製造工程においては、例えば画像処理による検査を行う場合など、 検査テーブル上に回路基板を載せ、主面の回路形成面に傷を付けずに、位置合わ せを行うと共に、回路基板を平行に固定して浮き上がらないようにする必要があ る。これは、回路基板がテーブル上で浮き上がると、検査装置の光学系の焦点位 置が外れてしまい、検出された回路基板表面の画像が歪み、正確な検査が出来な くなるためである。ところで、従来、かかる検査テーブルは、例えばテーブル面 に吸着用孔を形成し、この吸着用穴を負圧としながら、テーブル上面に配置され た回路基板を吸着、固定することが行われていた。また、このような回路基板支 持装置は、その構造から、一面だけに回路パターンを印刷した回路基板の固定に のみ適用することが可能であった。 In the circuit board manufacturing process, for example, when inspecting by image processing, place the circuit board on the inspection table, align it without damaging the circuit formation surface of the main surface, and align the circuit board. It must be fixed in parallel so that it does not rise. This is because when the circuit board floats up on the table, the focus position of the optical system of the inspection device is deviated, the detected image of the circuit board surface is distorted, and accurate inspection cannot be performed. By the way, conventionally, in such an inspection table, for example, a suction hole is formed on the table surface, and the circuit board arranged on the table upper surface is sucked and fixed while the suction hole is under a negative pressure. Further, such a circuit board supporting device can be applied only to fixing a circuit board having a circuit pattern printed on only one surface because of its structure.
【０００３】 しかしながら、近年の電子回路の高密度化に伴い、回路基板も一面だけでなく 、その両面に回路パターンを印刷した、いわゆる両面印刷基板が用いられるよう になっている。この両面印刷基板については、その下側主面の回路形成部に接触 して傷を付けることなく、如何にして支持するかが問題となっていた。However, with the recent increase in density of electronic circuits, so-called double-sided printed boards, in which circuit patterns are printed not only on one surface but also on both surfaces thereof, have come to be used. With respect to this double-sided printed board, there has been a problem of how to support the circuit forming part on the lower main surface without damaging it.
【０００４】 かかる従来技術の問題点を解決するため、両面印刷基板の回路パターンを形成 した部分の両側の両端縁部を利用して保持し、その両面に形成された回路パター ンに接触せずに支持する回路基板支持装置が知られている。例えば、図３に示す ように、テーブル１の両端部に突出した平行な支持面２、２…を形成し、この支 持面２、２…上に真空吸着用孔３、３…を形成している。そして、このテーブル １の支持面上に上記両面印刷基板のデッドスペースを載せ、真空により吸着固定 するものである。 また、これとは別の回路基板支持装置として、図４及び図５に示すようなもの も用いられている。この装置では、テーブル１の両端部に突出した平行な支持面 ２、２を形成し、上記テーブル１の主面上と、上記支持面２、２上に、それぞれ 突き当て板４、４とチャック板５、５とが設けられている。これら突き当て板４ とチャック板５の先端面に傾斜を付け、チャック板５、５を移動しながら両面印 刷基板を下方に押し付けながら、その下面両側部分を支持面２、２上に支持固定 する。In order to solve the above-mentioned problems of the prior art, the double-sided printed circuit board is held by using both edge portions on both sides of the circuit pattern formed portion without contacting the circuit patterns formed on both sides. There is known a circuit board supporting device that supports the circuit board. For example, as shown in FIG. 3, projecting parallel supporting surfaces 2, 2, ... Are formed at both ends of the table 1, and vacuum suction holes 3, 3, ... Are formed on the supporting surfaces 2, 2 ,. ing. Then, the dead space of the double-sided printed board is placed on the supporting surface of the table 1 and suction-fixed by vacuum. Further, as another circuit board supporting device, a device as shown in FIGS. 4 and 5 is also used. In this device, parallel supporting surfaces 2 and 2 are formed so as to project from both ends of the table 1, and the abutting plates 4 and 4 and the chuck are respectively provided on the main surface of the table 1 and the supporting surfaces 2 and 2. Plates 5 and 5 are provided. The tip surfaces of the abutting plate 4 and the chuck plate 5 are inclined, and while the chuck plates 5 and 5 are being moved, the double-sided printing substrate is pressed downward, while the lower surface both sides are supported and fixed on the supporting surfaces 2 and 2. To do.
【０００５】[0005]
しかしながら、上記の従来技術のうち、図３に示した前者の回路基板支持装置 においては、真空吸着用孔３、３…の径を大きくとれないために、吸引力が不足 し、吸着のための大きな真空源が必要となる。また、真空吸着用孔３、３…に埃 などが詰まって吸引力が減少し易いという問題点がある。他方、図４及び図５に 示した後者の従来技術では、その突き当て板やチャック板が基板のエッジ部分を 損傷し易いといった問題点などがあった。 However, in the former circuit board supporting device shown in FIG. 3 among the above-mentioned conventional techniques, the suction force is insufficient because the diameter of the vacuum suction holes 3, 3, ... A large vacuum source is needed. Further, there is a problem that the vacuum suction holes 3, 3, ... Are clogged with dust or the like and the suction force is easily reduced. On the other hand, the latter prior art shown in FIGS. 4 and 5 has a problem that the abutting plate and the chuck plate are likely to damage the edge portion of the substrate.
【０００６】 そこで、本考案では、上述の従来技術の問題点に鑑み、両面に回路パターンを 形成した両面印刷基板の回路パターンの無い両端縁部を利用し、基板の下側に形 成した回路形成面に接触して傷を付けることなく、確実に保持し、基板が浮き上 がることなく安定に支持することが可能な回路基板支持装置を提供することを目 的とする。In view of the above-mentioned problems of the prior art, the present invention utilizes a circuit pattern formed on the lower side of the board by utilizing both edge portions of the double-sided printed circuit board having circuit patterns formed on both sides without the circuit pattern. It is an object of the present invention to provide a circuit board supporting device capable of reliably holding the circuit board without coming into contact with the formation surface and damaging it and stably supporting the circuit board without floating.
【０００７】[0007]
上記の目的を達成するため、本考案により提案された回路基板支持装置は、回 路基板の下面の回路形成部分に接触せず、その両側の下面縁部で同回路基板を支 承する回路基板支持装置であって、回路基板の下面両側の下面縁部に当接して同 回路基板を支承する水平な支持面を備えたテーブルを有し、このテーブルの主面 から離れた回路基板の下面に沿って空気の流れを形成する気流発生手段を備えた ことを特徴とするものである。 In order to achieve the above-mentioned object, the circuit board supporting device proposed by the present invention does not contact the circuit forming portion of the lower surface of the circuit board, but supports the circuit board at the lower edge of both sides thereof. A supporting device having a table having horizontal supporting surfaces for supporting the circuit board by abutting both lower surface edges of the lower surface of the circuit board, the lower surface of the circuit board separated from the main surface of the table. It is characterized in that it is provided with an air flow generating means for forming a flow of air along it.
【０００８】[0008]
すなわち、上記の本考案の回路基板支持装置によれば、前記テーブルの主面か ら離れて支持された回路基板の下面に沿って気流を形成すると、ベルヌーイの定 理によって回路基板の下側の圧力が大気圧より低下し、大気圧との差圧が生じる 。従って、この生じた差圧により回路基板を下方に押し付けながら、その両端縁 部をテーブルの支持面上に支承し、回路基板が浮き上がらないように回路基板を 安定して支持することができる。 That is, according to the above-described circuit board supporting device of the present invention, when an airflow is formed along the lower surface of the circuit board supported away from the main surface of the table, the lower side of the circuit board is determined by Bernoulli's theorem. The pressure drops below atmospheric pressure, causing a pressure difference from atmospheric pressure. Therefore, while the circuit board is pressed downward by the generated differential pressure, both end edges thereof are supported on the support surface of the table, and the circuit board can be stably supported so that the circuit board does not float up.
【０００９】[0009]
以下、本考案の実施例について、添付の図面を参照しながら詳細に説明する。 図１に本考案の実施例である回路基板支持装置が示されており、この装置は、 例えば画像処理により回路基板１００の表面に形成された回路パターンを検査す るための検査装置の検査テーブルとして利用されたものである。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows a circuit board supporting device according to an embodiment of the present invention. This device is an inspection table of an inspection device for inspecting a circuit pattern formed on the surface of a circuit board 100 by image processing, for example. It was used as.
【００１０】 そして、この回路基板支持装置は、その上に検査対象である回路基板１００を 保持するためのテーブル１０と、保持した回路基板１００を位置決めするための 突き当てローラ２０、２０…と、クランプ装置３０、３０とから構成されている 。The circuit board supporting device has a table 10 for holding the circuit board 100 to be inspected thereon, and abutting rollers 20, 20, ... For positioning the held circuit board 100. It is composed of clamp devices 30 and 30.
【００１１】 まず、回路基板１００を保持するためのテーブル１０は、検査テーブルのベー ス４０上に載置されており、その表面の全体に方形状に広がる水平な主面１１を 有しており、その両側に上記主面１１から僅かに上方に上がった位置に水平に広 がった支持面１２、１２を有している。また、このテーブル１０の三つの辺にそ れぞれ切欠部１３、１３’、１３”が形成されている。そして、隣接する二つの 辺に形成された切欠部１３、１３’に上記のクランプ装置３０、３０の移動シリ ンダー３１、３１の先端に取り付けられて矢印方向に移動するローラ３２、３２ が配置されている。さらに、他の切欠部１３”が形成されたテーブル１０の辺に ２個の突き当てローラ２０、２０が、そして、テーブル１０の残りの辺に１個の 突き当てローラ２０が近接して設けられている。First, the table 10 for holding the circuit board 100 is placed on the base 40 of the inspection table, and has a horizontal main surface 11 that spreads in a rectangular shape over the entire surface thereof. On both sides thereof, there are horizontally extended support surfaces 12, 12 at a position slightly above the main surface 11. Further, notches 13, 13 ', 13 "are formed on the three sides of the table 10, respectively, and the clamps are formed on the notches 13, 13' formed on two adjacent sides. Rollers 32, 32 attached to the tips of the moving cylinders 31, 31 of the devices 30, 30 and moving in the direction of the arrow are arranged. Further, 2 is provided on the side of the table 10 in which another notch 13 ″ is formed. A single butting roller 20, 20 is provided, and one butting roller 20 is provided in proximity to the remaining side of the table 10.
【００１２】 本考案では、上記テーブル１０の主面１１の中央部に貫通孔１５が形成されて おり、この貫通孔１５に後に説明する気流発生手段が連結されている。また、こ の図において、回路基板１００は破線によって示されており、この回路基板１０ ０は、下側の回路形成面が上記テーブル１０の主面に接触することなく対向した 状態で、その下面縁部が支持面１２、１２の表面上に接触して支持されている。In the present invention, a through hole 15 is formed in the center of the main surface 11 of the table 10, and an air flow generating means described later is connected to the through hole 15. Further, in this figure, the circuit board 100 is indicated by a broken line, and the circuit board 100 has a lower surface on which the lower circuit forming surface faces the main surface of the table 10 without contacting the lower surface thereof. The edges are supported in contact with the surfaces of the support surfaces 12, 12.
【００１３】 次に、この回路基板支持装置の動作について説明する。 まず、検査テーブル上に配置された回路基板１００は、クランプ装置３０、３ ０の移動シリンダー３１、３１の先端に取り付けられて矢印方向に移動するロー ラ３２、３２を矢印方向に移動することにより、対向配置された突き当てローラ ２０、２０…との間に挟み込んで位置決めする。Next, the operation of this circuit board supporting device will be described. First, the circuit board 100 arranged on the inspection table is moved in the arrow direction by moving the rollers 32, 32 attached to the tips of the moving cylinders 31, 31 of the clamp device 30, 30 and moving in the arrow direction. , Is positioned between the abutting rollers 20, 20 ...
【００１４】 図２にこの位置決めした回路基板１００が示されており、この回路基板１００ は、その下面縁部を支持面１２、１２の表面上に載せられている。そして、本考 案によれば、この状態で、上記テーブル１０の主面１１の中央部に形成した貫通 孔１５から、それに連結された空気供給源５０から導びかれた空気が送り出され る。これにより、送り出された空気は、図中に矢印で示すように、回路基板１０ ０の下側主面の回路形成面とテーブル１０の主面１１との間に形成された空間内 を流れる。FIG. 2 shows this positioned circuit board 100, which has its lower edge mounted on the surface of the support surfaces 12, 12. Then, according to the present proposal, in this state, the air guided from the air supply source 50 connected to the through hole 15 formed in the central portion of the main surface 11 of the table 10 is sent out. As a result, the sent out air flows in the space formed between the circuit forming surface of the lower main surface of the circuit board 100 and the main surface 11 of the table 10, as indicated by the arrow in the figure.
【００１５】 この空気が、回路基板１００の回路形成面とテーブル１０の主面１１との間の 空間を流れると、いわゆるベルヌーイの定理によって、回路基板１００の下側の 圧力が低下して大気圧との差圧が生じる。この差圧により、回路基板１００を下 方に押し付ける力を発生し（図中の破線の矢印）、この押付力により回路基板１ ００の両端縁部をテーブル１０の支持面１２、１２…上に押圧して、浮き上がる ことのないように安定に支持する。When this air flows through the space between the circuit forming surface of the circuit board 100 and the main surface 11 of the table 10, the pressure under the circuit board 100 is reduced by the so-called Bernoulli's theorem, and the atmospheric pressure is reduced. The differential pressure between By this pressure difference, a force for pressing the circuit board 100 downward is generated (indicated by a broken line arrow in the figure), and the pressing force causes the both end edges of the circuit board 100 to be placed on the support surfaces 12, 12 ... Of the table 10. Stable support so that it does not lift when pressed.
【００１６】 なお、上記実施例では、上記テーブル１０の主面１１の中央部に形成した貫通 孔１５に連結された気流発生手段として、例えばポンプなどから構成される空気 供給源５０を説明したが、これに代えて、空気以外の窒素ガスなどを使用するこ とも出来る。さらに、真空ポンプなどで構成した真空機構を上記テーブル１０の 主面１１の貫通孔１５に連結してもよく、その場合、回路基板１００の回路形成 面とテーブル１０の主面１１との間の空間を流れる空気の流れの方向は図の矢印 とは反対になる。さらに、回路基板１００の側方からその下側に空気を送り込ん で回路基板１００の下側に空気の流れを形成することができる。その場合は、空 気供給源としてブロアから回路基板１００の下側にのみ空気を水平の送り込む。In the embodiment described above, the air supply source 50 including, for example, a pump is used as the air flow generating means connected to the through hole 15 formed in the central portion of the main surface 11 of the table 10. Alternatively, nitrogen gas other than air can be used instead. Further, a vacuum mechanism composed of a vacuum pump or the like may be connected to the through hole 15 of the main surface 11 of the table 10. In that case, a circuit between the circuit forming surface of the circuit board 100 and the main surface 11 of the table 10 may be connected. The direction of air flow in the space is opposite to the arrow in the figure. Furthermore, air can be sent from the side of the circuit board 100 to the lower side of the circuit board 100 to form a flow of air on the lower side of the circuit board 100. In that case, air is horizontally fed only from the blower to the lower side of the circuit board 100 as an air supply source.
【００１７】 これらの場合もやはりベルヌーイの定理によって、回路基板１００の下側の圧 力が低下して大気圧との差圧が生じ、押付力を発生して回路基板１００を、テー ブル１０の支持面１２、１２…上に、浮き上がることのないように安定に支持す ることは同様である。In these cases as well, the pressure on the lower side of the circuit board 100 is reduced by the Bernoulli's theorem to generate a pressure difference from the atmospheric pressure, and a pressing force is generated to move the circuit board 100 to the table 10. It is also the same as to stably support the support surfaces 12, 12 ... On the support surfaces 12 so as not to lift them.
【００１７】 また、上記テーブル１０の主面１１の中央部に形成した貫通孔１５についても 、上記の実施例のように、断面円形の貫通孔を上方に垂直に形成するだけでなく 、これを断面方形や多角形にしたり、あるいは、主面１１に対して傾斜させて形 成することも可能である。Further, as for the through hole 15 formed in the central portion of the main surface 11 of the table 10, not only the through hole having a circular cross section is formed vertically upward as in the above-described embodiment, but also the through hole 15 is formed. It is possible to have a rectangular cross section, a polygonal shape, or an inclination with respect to the main surface 11.
【００１８】 この本実施例の回路基板支持装置では、比較的簡単な構成により、回路基板１ ００を、その下面縁部のデッドスペースを支承しながら浮き上がることのないよ う、安定に支持することが出来ると共に、その保守に手間がかからず簡単であり 、得られる押し付け力も十分で安定している。また、このベルヌーイの定理によ る差圧を利用する方式によれば、上記従来技術のような回路基板１００の破損、 突当て、チャック板の摩耗の問題も解消される。In the circuit board supporting apparatus according to the present embodiment, the circuit board 100 is supported with a relatively simple structure so as to support the dead space at the lower edge of the circuit board 100 and prevent the circuit board 100 from rising. In addition, it is easy and maintenance-free, and the pressing force obtained is stable and stable. In addition, according to the method of utilizing the differential pressure according to Bernoulli's theorem, the problems of the circuit board 100, such as damage, butting, and abrasion of the chuck plate, as in the prior art described above are solved.
【００１９】 以下、本実施例の回路基板支持装置の具体例について説明すると、テーブル１ ０の主面１１と支持面１２との間は、１．０ｍｍであり、また、管通孔１５の径 は１０．０ｍｍであると共に、空気供給源５０から貫通孔１５に連結される空気 の供給路の径は、最小３．０ｍｍとなっている。空気供給源５０から空気（４〜 ６ｋｇ／ｃｍ2を）貫通孔１５から、テーブル１０の主面１１と回路基板１０と の間の空隙に送り出したところ、約１０〜３０グラム重の吸引力が得られた。Hereinafter, a specific example of the circuit board supporting device of this embodiment will be described. The distance between the main surface 11 and the supporting surface 12 of the table 10 is 1.0 mm, and the diameter of the pipe through hole 15 is small. Is 10.0 mm, and the diameter of the air supply path connected from the air supply source 50 to the through hole 15 is 3.0 mm at the minimum. When air (4 to 6 kg / cm 2 ) from the air supply source 50 was sent out from the through hole 15 to the gap between the main surface 11 of the table 10 and the circuit board 10, a suction force of about 10 to 30 grams was obtained. Was obtained.
【００２０】 なお、上記実施例では、支持する回路基板として、両面に回路パターンを印刷 した、いわゆる両面印刷基板を例示したが、本考案は両面に回路パターンを形成 した両面印刷基板だけでなく、片面印刷基板の支持にも使用できることは、明か であろう。In addition, in the above embodiment, the so-called double-sided printed board having the circuit patterns printed on both sides is illustrated as the supporting circuit board, but the present invention is not limited to the double-sided printed board having the circuit patterns formed on both sides. Obviously, it can also be used to support single-sided printed circuit boards.
【００２１】[0021]
上記の本考案の詳細な説明からも明かな様に、本考案の回路基板支持装置によ れば、回路基板の下側に気流を形成し、ベルヌーイの定理による差圧を発生して テーブルの支持面上に押し付けて固定支持することから、十分な押圧力で回路基 板を浮き上がることなく安定して支持することが出来ると共に、基板の破損の心 配もなく、その保守も簡単である。 As is clear from the above detailed description of the present invention, according to the circuit board supporting device of the present invention, an air flow is formed below the circuit board, and a differential pressure according to Bernoulli's theorem is generated to generate a table pressure. Since it is pressed against the support surface and fixedly supported, the circuit board can be supported stably with sufficient pressing force without floating, and there is no risk of damage to the board, and its maintenance is easy.
【図１】本考案の実施例である回路基板支持装置の構成
を示す斜視図である。FIG. 1 is a perspective view showing a configuration of a circuit board supporting device according to an embodiment of the present invention.
【図２】上記回路基板支持装置の基板支持原理を説明す
る拡大断面図である。FIG. 2 is an enlarged cross-sectional view illustrating a substrate supporting principle of the circuit board supporting device.
【図３】従来技術の回路基板支持装置の一例を示す斜視
図である。FIG. 3 is a perspective view showing an example of a conventional circuit board supporting device.
【図４】従来技術の回路基板支持装置の他の一例を示す
斜視図である。FIG. 4 is a perspective view showing another example of a conventional circuit board supporting device.
【図５】上記図４に示した回路基板支持装置のＡ−Ａ断
面図である。5 is a cross-sectional view taken along the line AA of the circuit board supporting device shown in FIG.
１０ テーブル １１ 主面 １２ 支持面 １５ 貫通孔 １００ 回路基板 10 table 11 main surface 12 support surface 15 through hole 100 circuit board
Claims (1)
ず、その両側の下面縁部で同回路基板を支承する回路基
板支持装置であって、回路基板の下面両側の下面縁部に
当接して同回路基板を支承する水平な支持面を備えたテ
ーブルを有し、このテーブルの主面から離れた回路基板
の下面に沿って空気の流れを形成する気流発生手段を備
えたことを特徴とする回路基板支持装置。1. A circuit board supporting device for supporting the circuit board on both sides of the lower surface of the circuit board without contacting the circuit forming portion on the lower surface of the circuit board, the circuit board supporting device supporting the lower surface edges on both sides of the lower surface of the circuit board. A table having a horizontal supporting surface that contacts and supports the circuit board, and an air flow generating means that forms an air flow along the lower surface of the circuit board away from the main surface of the table. And a circuit board support device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993020152U JP2575580Y2 (en) | 1993-03-27 | 1993-03-27 | Circuit board support device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993020152U JP2575580Y2 (en) | 1993-03-27 | 1993-03-27 | Circuit board support device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677300U true JPH0677300U (en) | 1994-10-28 |
| JP2575580Y2 JP2575580Y2 (en) | 1998-07-02 |
Family
ID=12019188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1993020152U Expired - Lifetime JP2575580Y2 (en) | 1993-03-27 | 1993-03-27 | Circuit board support device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2575580Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011249477A (en) * | 2010-05-25 | 2011-12-08 | Fujitsu Ltd | Support device of printed substrate |
| JP2012103161A (en) * | 2010-11-11 | 2012-05-31 | Shindengen Electric Mfg Co Ltd | Positioning device and positioning method |
| JP2013134248A (en) * | 2011-12-22 | 2013-07-08 | Samsung Electro-Mechanics Co Ltd | Substrate fixation module and substrate inspection device having the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51134861A (en) * | 1975-05-19 | 1976-11-22 | Sony Corp | Device for determining position of circular members |
| JPS631647A (en) * | 1986-06-23 | 1988-01-06 | Taiyo Tekko Kk | Noncontact adsorbing device |
| JPS63147238U (en) * | 1987-03-16 | 1988-09-28 |
-
1993
- 1993-03-27 JP JP1993020152U patent/JP2575580Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51134861A (en) * | 1975-05-19 | 1976-11-22 | Sony Corp | Device for determining position of circular members |
| JPS631647A (en) * | 1986-06-23 | 1988-01-06 | Taiyo Tekko Kk | Noncontact adsorbing device |
| JPS63147238U (en) * | 1987-03-16 | 1988-09-28 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011249477A (en) * | 2010-05-25 | 2011-12-08 | Fujitsu Ltd | Support device of printed substrate |
| JP2012103161A (en) * | 2010-11-11 | 2012-05-31 | Shindengen Electric Mfg Co Ltd | Positioning device and positioning method |
| JP2013134248A (en) * | 2011-12-22 | 2013-07-08 | Samsung Electro-Mechanics Co Ltd | Substrate fixation module and substrate inspection device having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2575580Y2 (en) | 1998-07-02 |
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