JPH088586A - Thin substrate transferring device - Google Patents

Abstract

PURPOSE:To automatically transfer thin substrates on a working table to a carrying table, etc., while cracked substrates are removed from the working table. CONSTITUTION:Receiving and transferring bodies 13 and 14 are provided on both sides of a working table 12 so that the transferring bodies 13 and 14 can move forward and backward between the table 12 and a carrying table 15, etc., beside the table 12 and two fingers 13a and 13b and one finger 14a are respectively provided to the transferring bodies 13 and 14. In addition, an optical crack detecting sensor which is constituted to emit light toward one transferring body 13 or 14 from the other transferring body 14 or 13 side is provided between the transferring bodies 13 and 14 and a vacuum suction box 18 carrying a perforated plate 19 on its lower surface is provided above the working table 12 so that the box 18 can move forward and backward between the table 12 and its side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for transferring a thin substrate such as a ceramic substrate or a glass mask from one working table for the thin substrate to the next working table or a carrier. is there.

[0002]

2. Description of the Related Art Generally, a thin substrate such as a ceramic substrate is placed on an upper surface of a work table, and after a mask printing of a circuit pattern or the like is performed on the surface of the thin substrate, The work table is transferred and transferred to the next work table or a carrier.

A conventional transfer device in this case is shown in FIG.
As shown in FIG. 7, the thin board 1 is placed on the upper surface of the vertically movable work table 2, and in this state, mask printing of a circuit pattern or the like is performed on the surface of the thin board 1,
One of the left and right sides of the work table 2 is a receiving and transferring body 3 having a pair of vacuum suction type fingers 3a, and the other side is a receiving and transferring body 4 also having a pair of vacuum suction type fingers 4a. After the mask printing or the like on the upper surface of the thin substrate 1 is completed, the work table 2 is lowered to a position lower than the receiving transfer bodies 3 and 4 as shown in FIGS. 7 and 8. By moving, the thin plate substrate 1 on the upper surface of the work table 2 is moved from the work table 2 to the both receiving transfer bodies 3, 3.
4 to the upper surface, and then the two receiving transfer bodies 3,
4 moves horizontally to the upper part of the carrier 5 arranged on the side of the work table 2, and then either the receiving transfer bodies 3 and 4 are moved down or the carrier 5 is moved up. As a result, the thin substrate 1 on the upper surfaces of the receiving and transporting bodies 3 and 4 is transferred from the receiving and transporting bodies 3 and 4 to the carrier 5.

[0004]

However, when performing mask printing or the like on the thin substrate 1 on the upper surface of the work table 2, the thin substrate 1 may be cracked, and thus the thin substrate 1 is cracked. When the work table 2 is lowered, the broken thin substrate 1 is
As indicated by a chain double-dashed line in FIG. 3, the receiving table is left laid across one or both of the receiving and transferring bodies 3 and 4 and the work table 2, so that the receiving and transferring bodies 3 and 4 are kept.
Since it cannot be transferred to the upper surface side of No. 4, the broken thin plate substrate cannot be removed from the upper surface of the work table 2.

Therefore, in the above-described conventional transfer device, when the thin plate substrate 1 is cracked on the upper surface of the work table 2 as described above, the movement of both the receiving and transporting bodies 3 and 4 is stopped, and the thin substrate 1 is cracked. There is a problem that the operator has to remove all of the thin board from the upper surface of the work table 2. According to the present invention, when the thin plate substrate on the upper surface of the work table is cracked, the cracks are surely detected even in multiple directions, and all the broken thin plate substrates are automatically removed from the upper surface of the work table. It is a technical object to provide an apparatus capable of performing the above.

[0006]

In order to achieve this technical object, the present invention provides "a receiving transfer body on both left and right sides of a work table which moves up and down with a thin substrate placed on the upper surface thereof. In a transfer device in which a body is arranged so as to reciprocate between the work table and a carrier table or the like on the side thereof, in one of the receiving transfer bodies, the thin substrate is provided. At least two fingers for the other receiving and transporting body and one finger for the thin plate substrate, respectively, and further, between the two receiving and transporting bodies, the light is transferred from one receiving and transporting side to the other receiving and transporting body. An optical crack detection sensor that fires toward the side is provided, while a vacuum suction box formed by stretching a perforated plate on the lower surface is provided above the work table. Box has a configuration called the working table and the between the side disposed so as to reciprocate. ".

[0007]

[Operation] With this configuration, when work such as mask printing on the thin substrate placed on the upper surface of the work table is completed, the work table is lowered to a position lower than the upper surfaces of both receiving transfer bodies arranged on both sides of the work table. By moving, the thin substrate on the upper surface is transferred so as to be placed on the upper surface of each finger of the both receiving and transferring bodies.
Then, both the receiving and transferring bodies move toward the carrier and then descend, thereby transferring the thin plate substrate on the upper surface from the upper surface of the both receiving and transferring bodies to the upper surface of the carrier.

When the thin substrate is cracked in a work such as mask printing on the upper surface of the work table,
When the working table is lowered to a position lower than the upper surfaces of both receiving and transferring bodies, the broken thin plate substrate is placed so as to straddle one or both of the receiving and transferring bodies and the working table. Then, the light from the optical crack detection sensor provided between the two receiving and transporting bodies is blocked, so that it is possible to detect that the thin plate substrate is cracked.

Then, based on this crack detection, the work table moves up and down to a position higher than the upper surfaces of both receiving and transferring bodies, and then the vacuum suction box moves to the upper part of the work table. By vacuum suctioning in this state, all the broken thin plate substrates are brought into close contact with and suctioned to the perforated plate on the lower surface of the vacuum suction box, and the upper side of the work table moves laterally. All of the cracked thin substrate on the top surface can be removed from the top surface of the work table.

[0010]

As described above, according to the present invention, it is possible to automatically transfer the thin plate substrate on the upper surface of the work table to the carrier table or the like while removing all of the broken thin plate substrates from the upper surface of the work table. Therefore, the work efficiency can be significantly improved.

Further, according to the present invention, at least two fingers for the thin plate substrate are provided on one of the receiving and transferring bodies arranged on both the left and right sides of the work table.
The other receiving and transferring body is provided with one finger for the thin plate substrate, and the thin plate substrate is configured to be supported by the three fingers at three points. Since it is possible to detect cracks in multiple directions compared to the case where two thin boards are provided to support the thin board at four points, the accuracy of detecting the cracks in the thin board is high and the thin board is broken on the carrier table or the like. It also has an effect that it is possible to reliably reduce the delivery of the thin substrate.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to the drawings of FIGS. In this figure, reference numeral 12 indicates a work table configured to move up and down by a vertical movement mechanism 12a.
When a work such as mask printing is performed on the thin substrate 1 on the upper surface, the thin substrate 1 is configured to descend.

Reference numerals 13 and 14 denote the work table 12 described above.
The receiving and transferring bodies arranged on both the left and right sides of the work table 12 are shown in FIG.
It is configured so as to reciprocate in the horizontal direction between and, and to descend at the position of the carrier 15 toward the carrier 15.

One of the receiving transfer bodies 13 and 14 is provided with one of the two receiving transfer bodies 13 and 14 having two cutouts 12b and 12c formed on the work table 12 on the inner surface thereof.
Two vacuum suction type fingers 13a and 13b are provided so as to pass through the inside in the vertical direction, while the other receiving and transferring body 14 has one cutout portion provided on the working table 12 on the inner surface thereof. One vacuum suction type finger 14a is provided so as to pass through the inside of 12d in the vertical direction.

Further, the other receiving and transferring body 14 has
A light-emitting element 16 adapted to emit light toward one of the two receiving and transporting bodies 13 substantially parallel to the upper surface of the work table.
A light receiving element 17 for the light from the light emitting element 16 is provided on one of the receiving and transporting bodies 13. Further, reference numeral 18 denotes a vacuum suction box in which a perforated plate such as a wire mesh 19 is stretched on the lower surface, and the vacuum suction box 18 includes the work table 12 and a recovery box 2 arranged on the side thereof.
The vacuum suction box 18 is connected to a vacuum suction duct 21 to a vacuum blower (not shown).

In this structure, when the work such as the mask printing on the thin substrate 1 placed on the upper surface of the work table 12 is completed, the work table 12 is located above the both receiving transfer bodies 13 and 14 disposed on both sides thereof. By moving down to a lower part, the thin substrate 1 on its upper surface
Are transferred so as to be placed on the upper surfaces of the fingers 13a, 13b, 14a of the both receiving transfer bodies 13, 14. Then, the two receiving and transferring bodies 13, 14 move toward the carrier 15 and then descend, so that the thin substrate 1 on the upper surface of the receiving and transferring bodies 13, 14, is moved.
The upper surface of 14 is transferred to the upper surface of the carrier 15.

When the thin substrate 1 is cracked in the work such as mask printing on the upper surface of the work table 12, the work table 12 is received by both the transfer bodies 13, 1.
When the lower substrate 1 is moved to a position lower than the upper surface of 4, the broken thin plate substrate 1 and one or both of the receiving and transferring bodies 13 and 14 and the work table 12 as shown by a chain double-dashed line in FIG. Since the light is transmitted from the light emitting element 16 provided on both receiving and transporting bodies 13 and 14 to the light receiving element 17 in a state of being placed so as to straddle over,
It can be detected that the thin plate 1 is broken.

Then, based on this crack detection, the work table 12 is moved up and down to a position higher than the upper surfaces of the receiving and transferring bodies 13 and 14, and the vacuum suction box 18 is
By moving to the upper part of the work table 12 and vacuum suction in this state, all of the broken thin plate substrate 1 is
The vacuum suction box 18 is sucked so as to be in close contact with a perforated plate such as a wire mesh 19 on the lower surface of the vacuum suction box 18, and then the vacuum suction box 18 extends from above the work table 12 to above a recovery box 20 arranged on the side thereof. After moving,
By releasing the vacuum suction, the working table 12
It is possible to remove all of the thin plate substrate 1 cracked on the upper surface of the work table 12 from the upper surface of the work table 12 so as to be put in the recovery box 20.

The thin plate substrate handled by the present invention is not limited to a ceramic thin plate substrate, and may be a glass thin plate substrate. In the present invention, the thin plate substrate 1 is used as in the above embodiment. , Work table 12 to carrier 15
It is needless to say that the present invention can be applied not only to the case of transferring the thin substrate 1 to the work table 12 but also to the case of transferring the thin plate substrate 1 from the work table 12 to the work table in the next step.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a sectional view taken along line III-III of FIGS. 1 and 2.

FIG. 4 is a diagram showing a working state of an embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional device.

6 is a sectional view taken along line VI-VI of FIG.

FIG. 7 is a diagram showing an operating state in a conventional device.

8 is a sectional view taken along line VIII-VIII of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Thin plate substrate 12 Work table 13 One receiving and transferring body 13a, 13b Fingers on one receiving and transferring body 14 Other receiving and transferring body 14a Fingers on the other receiving and transferring body 15 Carrier table 16 Light emitting element 17 Light receiving element 18 Vacuum suction box 19 Wire mesh 20 Collection box 21 Vacuum suction duct

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/027 21/68 A

Claims (1)

[Claims] 1. A receiving transfer body is provided on both left and right sides of a work table which moves up and down with a thin substrate placed on the upper surface thereof, and both receiving transfer bodies are provided between the work table and a carrier table or the like on the side thereof. In a transfer device arranged so as to reciprocate, at least two fingers for the thin plate substrate are provided in one of the receiving transfer bodies, and the thin plate substrate is provided in the other receiving transfer body. One finger for each is further provided, and further, between the two receiving and transporting bodies, an optical crack detection sensor is provided which emits light from one receiving and transporting side toward the other receiving and transporting body, Above the work table, a vacuum suction box formed by stretching a perforated plate on the lower surface,
A transfer device for a thin plate substrate, wherein the vacuum suction box is arranged so as to reciprocate between the work table and the side thereof.