JPH0669416A - マルチチップモジュール - Google Patents

マルチチップモジュール

Info

Publication number
JPH0669416A
JPH0669416A JP5160302A JP16030293A JPH0669416A JP H0669416 A JPH0669416 A JP H0669416A JP 5160302 A JP5160302 A JP 5160302A JP 16030293 A JP16030293 A JP 16030293A JP H0669416 A JPH0669416 A JP H0669416A
Authority
JP
Japan
Prior art keywords
carrier
capacitor
conductive layer
substrate
chip module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5160302A
Other languages
English (en)
Japanese (ja)
Inventor
Wolfgang Hoenlein
ヘーンライン ウオルフガング
Volker Lehmann
レーマン フオルカー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPH0669416A publication Critical patent/JPH0669416A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W20/496—
    • H10W44/601—
    • H10W70/26—
    • H10W70/698—
    • H10W90/754—

Landscapes

  • Semiconductor Integrated Circuits (AREA)
JP5160302A 1992-06-10 1993-06-04 マルチチップモジュール Pending JPH0669416A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4219031.2 1992-06-10
DE4219031A DE4219031C2 (de) 1992-06-10 1992-06-10 Multi-Chip-Modul mit Kondensator, der auf dem Träger aus Silizium (monokristalines Substrat) realisiert ist

Publications (1)

Publication Number Publication Date
JPH0669416A true JPH0669416A (ja) 1994-03-11

Family

ID=6460735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5160302A Pending JPH0669416A (ja) 1992-06-10 1993-06-04 マルチチップモジュール

Country Status (4)

Country Link
US (1) US5365405A (cg-RX-API-DMAC10.html)
EP (1) EP0573838B1 (cg-RX-API-DMAC10.html)
JP (1) JPH0669416A (cg-RX-API-DMAC10.html)
DE (2) DE4219031C2 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299462A (ja) * 2001-01-26 2002-10-11 Nokia Mobile Phones Ltd 半導体装置
US6710426B2 (en) 2002-03-26 2004-03-23 Murata Manufacturing Co., Ltd. Semiconductor device and transceiver apparatus

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0645621A3 (de) * 1993-09-28 1995-11-08 Siemens Ag Sensoranordnung.
GB9414362D0 (en) * 1994-07-15 1994-09-07 Plessey Semiconductors Ltd Trimmable capacitor
DE4429289A1 (de) * 1994-08-18 1996-02-22 Telefunken Microelectron Integrierte Schaltungsanordnung
US5534465A (en) * 1995-01-10 1996-07-09 At&T Corp. Method for making multichip circuits using active semiconductor substrates
US6462976B1 (en) 1997-02-21 2002-10-08 University Of Arkansas Conversion of electrical energy from one form to another, and its management through multichip module structures
DE19708970B4 (de) * 1997-03-05 2009-09-24 Reinz-Dichtungs-Gmbh Metallische Flachdichtung
US7169272B2 (en) * 1997-04-30 2007-01-30 Board Of Trustees Of The University Of Arkansas Microfabricated recessed disk microelectrodes: characterization in static and convective solutions
US7144486B1 (en) 1997-04-30 2006-12-05 Board Of Trustees Of The University Of Arkansas Multilayer microcavity devices and methods
DE19928733A1 (de) 1999-06-23 2001-01-04 Giesecke & Devrient Gmbh Halbleiterspeicher-Chipmodul
DE19943251A1 (de) * 1999-09-10 2001-04-05 Bosch Gmbh Robert Kondensatorbauelement
US7456028B2 (en) 2000-10-16 2008-11-25 Board Of Trustees Of The University Of Arkansas, N.A. Electrochemical method for detecting water born pathogens
US6887714B2 (en) 2000-10-16 2005-05-03 Board Of Trustees Of The University Of Arkansas, N.A. Microvolume immunoabsorbant assays with amplified electrochemical detection
US7348183B2 (en) * 2000-10-16 2008-03-25 Board Of Trustees Of The University Of Arkansas Self-contained microelectrochemical bioassay platforms and methods
DE102008035993B4 (de) * 2008-08-01 2018-10-11 Infineon Technologies Ag Leistungshalbleitermodul

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3962713A (en) * 1972-06-02 1976-06-08 Texas Instruments Incorporated Large value capacitor
US4153988A (en) * 1977-07-15 1979-05-15 International Business Machines Corporation High performance integrated circuit semiconductor package and method of making
JP2520419B2 (ja) * 1987-04-17 1996-07-31 日本電気株式会社 資源アクセス方式
DE3879771D1 (de) * 1987-05-27 1993-05-06 Siemens Ag Aetzverfahren zum erzeugen von lochoeffnungen oder graeben in n-dotiertem silizium.
JPH01251778A (ja) * 1988-03-31 1989-10-06 Toshiba Corp Ｉｃカード
JPH0635462Y2 (ja) * 1988-08-11 1994-09-14 株式会社村田製作所 積層型コンデンサ
RU2082258C1 (ru) * 1991-08-14 1997-06-20 Сименс АГ Схемная структура с по меньшей мере одним конденсатором и способ ее изготовления

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299462A (ja) * 2001-01-26 2002-10-11 Nokia Mobile Phones Ltd 半導体装置
US6710426B2 (en) 2002-03-26 2004-03-23 Murata Manufacturing Co., Ltd. Semiconductor device and transceiver apparatus

Also Published As

Publication number Publication date
EP0573838B1 (de) 1997-03-05
DE59305563D1 (de) 1997-04-10
US5365405A (en) 1994-11-15
EP0573838A3 (cg-RX-API-DMAC10.html) 1994-08-31
DE4219031C2 (de) 1994-11-10
DE4219031A1 (de) 1993-12-16
EP0573838A2 (de) 1993-12-15

Similar Documents

Publication Publication Date Title
JPH0669416A (ja) マルチチップモジュール
US6709978B2 (en) Method for forming integrated circuits using high aspect ratio vias through a semiconductor wafer
US5529950A (en) Method for manufacturing a cubically integrated circuit arrangement
US5759903A (en) Circuit structure having at least one capacitor and a method for the manufacture thereof
US10050320B2 (en) Integrated circuit with shared electrode energy storage devices
CN115472439A (zh) 电容器以及复合电子部件
US4023197A (en) Integrated circuit chip carrier and method for forming the same
Roozeboom et al. High-value MOS capacitor arrays in ultradeep trenches in silicon
CN109801892A (zh) 多管芯封装及方法
JPH05267557A (ja) 半導体装置
US4672415A (en) Power thyristor on a substrate
EP3496137B1 (en) Semiconductor capacitor
JPH0969636A (ja) 複合ダイオードチップ及びブリッジ整流器
US3280382A (en) Semiconductor diode comprising caustic-resistant surface coating
JPS63199454A (ja) 半導体装置
WO2022224669A1 (ja) キャパシタ
JP2705237B2 (ja) Ｍｉｍキャパシタを具備した半導体装置
JPS63108763A (ja) 半導体集積回路
US20240203962A1 (en) Electronic device
JPS58106848A (ja) 低寄生容量半導体装置およびその製造方法
EP4383324A1 (en) Semiconductor structure and manufacturing method thereof
CN117393553A (zh) 包括去耦电容器的半导体器件及制造方法
JPH04357841A (ja) バイポーラ・トランジスタの構造および製造方法
JP3040808B2 (ja) 固体電解コンデンサ
CN117012752A (zh) 电容器及其形成方法

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20020404