JPH066482Y2 - 熱感知素子 - Google Patents
熱感知素子Info
- Publication number
- JPH066482Y2 JPH066482Y2 JP7933587U JP7933587U JPH066482Y2 JP H066482 Y2 JPH066482 Y2 JP H066482Y2 JP 7933587 U JP7933587 U JP 7933587U JP 7933587 U JP7933587 U JP 7933587U JP H066482 Y2 JPH066482 Y2 JP H066482Y2
- Authority
- JP
- Japan
- Prior art keywords
- sensing element
- heat sensing
- circuit board
- printed circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012856 packing Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933587U JPH066482Y2 (ja) | 1987-05-26 | 1987-05-26 | 熱感知素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933587U JPH066482Y2 (ja) | 1987-05-26 | 1987-05-26 | 熱感知素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63187304U JPS63187304U (enExample) | 1988-11-30 |
| JPH066482Y2 true JPH066482Y2 (ja) | 1994-02-16 |
Family
ID=30929101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7933587U Expired - Lifetime JPH066482Y2 (ja) | 1987-05-26 | 1987-05-26 | 熱感知素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066482Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011132570A1 (ja) * | 2010-04-22 | 2011-10-27 | 矢崎総業株式会社 | 配線材の接続構造 |
-
1987
- 1987-05-26 JP JP7933587U patent/JPH066482Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011132570A1 (ja) * | 2010-04-22 | 2011-10-27 | 矢崎総業株式会社 | 配線材の接続構造 |
| JP2011227000A (ja) * | 2010-04-22 | 2011-11-10 | Yazaki Corp | 配線材の接続構造 |
| CN102472672A (zh) * | 2010-04-22 | 2012-05-23 | 矢崎总业株式会社 | 配线材料的连接结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63187304U (enExample) | 1988-11-30 |
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