JPH065742A - 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法 - Google Patents

半導体装置、その封止に用いられる樹脂および半導体装置の製造方法

Info

Publication number
JPH065742A
JPH065742A JP4162804A JP16280492A JPH065742A JP H065742 A JPH065742 A JP H065742A JP 4162804 A JP4162804 A JP 4162804A JP 16280492 A JP16280492 A JP 16280492A JP H065742 A JPH065742 A JP H065742A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
curing
weight
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4162804A
Other languages
English (en)
Japanese (ja)
Inventor
Shinobu Takahama
忍 高浜
Akinobu Tamaoki
明信 玉置
Satoshi Hirakawa
聡 平川
Hitoshi Yamano
仁志 山野
Teruki Hiyougatani
輝喜 兵ヶ谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP4162804A priority Critical patent/JPH065742A/ja
Priority to EP93109684A priority patent/EP0575889A2/en
Priority to US08/077,762 priority patent/US5430330A/en
Publication of JPH065742A publication Critical patent/JPH065742A/ja
Priority to US08/406,058 priority patent/US5539218A/en
Pending legal-status Critical Current

Links

Classifications

    • H10W74/473—
    • H10W74/01—
    • H10W74/47—
    • H10W76/47—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP4162804A 1992-06-22 1992-06-22 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法 Pending JPH065742A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP4162804A JPH065742A (ja) 1992-06-22 1992-06-22 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法
EP93109684A EP0575889A2 (en) 1992-06-22 1993-06-17 Semiconductor device, resin for sealing same and method of fabricating same
US08/077,762 US5430330A (en) 1992-06-22 1993-06-18 Semiconductor device, resin for sealing same and method of fabricating same
US08/406,058 US5539218A (en) 1992-06-22 1995-03-17 Semiconductor device and resin for sealing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4162804A JPH065742A (ja) 1992-06-22 1992-06-22 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPH065742A true JPH065742A (ja) 1994-01-14

Family

ID=15761539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4162804A Pending JPH065742A (ja) 1992-06-22 1992-06-22 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法

Country Status (3)

Country Link
US (2) US5430330A (enExample)
EP (1) EP0575889A2 (enExample)
JP (1) JPH065742A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005320479A (ja) * 2004-05-11 2005-11-17 Kyocera Chemical Corp 液状エポキシ樹脂組成物
JP2006114716A (ja) * 2004-10-15 2006-04-27 Mitsubishi Electric Corp 電力用半導体装置
US8138904B2 (en) 2006-08-11 2012-03-20 Bridgestone Corporation Tire internal pressure alarm device
DE102011083927A1 (de) 2010-10-01 2012-07-05 Mitsubishi Electric Corporation Leistungsmodul und Verfahren zur Herstellung desselben
JP2014114426A (ja) * 2012-12-12 2014-06-26 Panasonic Corp 半導体封止用エポキシ樹脂組成物とそれを用いたパワーモジュール
US9548253B2 (en) 2013-09-06 2017-01-17 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing the same
US9917064B2 (en) 2014-10-16 2018-03-13 Mitsubishi Electric Corporation Semiconductor device with a plate-shaped lead terminal

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589714A (en) * 1992-06-08 1996-12-31 The Dow Chemical Company Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles
JPH07288320A (ja) * 1994-02-21 1995-10-31 Toshiba Corp 半導体装置
US5719225A (en) * 1994-06-13 1998-02-17 Sumitomo Chemical Company, Ltd. Filler-containing resin composition suitable for injection molding and transfer molding
US5601874A (en) * 1994-12-08 1997-02-11 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
DE19722355A1 (de) * 1997-05-28 1998-12-03 Bosch Gmbh Robert Verfahren zur Herstellung elektrischer Baugruppen und elektrische Baugruppe
US6201309B1 (en) * 1997-06-10 2001-03-13 Kabushiki Kaisha Toshiba Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same
US6168859B1 (en) 1998-01-29 2001-01-02 The Dow Chemical Company Filler powder comprising a partially coated alumina powder and process to make the filler powder
US6184464B1 (en) * 1998-04-27 2001-02-06 Square D Company Protective containment apparatus for potted electronic circuits
US6452265B1 (en) 2000-01-28 2002-09-17 International Business Machines Corporation Multi-chip module utilizing a nonconductive material surrounding the chips that has a similar coefficient of thermal expansion
US6500891B1 (en) * 2000-05-19 2002-12-31 Loctite Corporation Low viscosity thermally conductive compositions containing spherical thermally conductive particles
DE10038508A1 (de) 2000-08-08 2002-02-21 Bosch Gmbh Robert Elektrische Baugruppe und Verfahren zur Herstellung der elektrischen Baugruppe
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP2002314139A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
DE10121270A1 (de) 2001-04-30 2003-02-06 Epcos Ag Passivierungsmaterial für ein elektrisches Bauteil sowie piezoelektrisches Bauteil in Vielschichtbauweise
DE10162637C1 (de) * 2001-12-20 2003-08-21 Eupec Gmbh & Co Kg Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat
TW200833752A (en) 2006-10-23 2008-08-16 Lord Corp Highly filled polymer materials
EP2111651A4 (en) * 2007-02-13 2011-08-17 3M Innovative Properties Co LED WITH LENS AND METHOD FOR THEIR MANUFACTURE
WO2009017117A1 (ja) * 2007-07-30 2009-02-05 Sharp Kabushiki Kaisha 発光装置、照明装置及び照明装置を備えたクリーンルーム
JP5715747B2 (ja) * 2008-09-30 2015-05-13 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置およびその製造方法
CA2746161C (en) * 2008-12-09 2015-02-03 Bridgestone Corporation Device for acquiring information regarding the inside of a tire
CN103035587A (zh) * 2012-12-11 2013-04-10 国网智能电网研究院 一种大功率igbt模块封装结构
JP6320331B2 (ja) * 2015-03-16 2018-05-09 三菱電機株式会社 電力用半導体装置
EP3511977B1 (en) * 2018-01-16 2021-11-03 Infineon Technologies AG Semiconductor module and method for producing the same
EP3518278A1 (en) 2018-01-30 2019-07-31 Infineon Technologies AG Power semiconductor module and method for producing the same
JP7784974B2 (ja) * 2022-09-08 2025-12-12 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043969A (en) * 1973-04-23 1977-08-23 National Semiconductor Corporation Casting compound for semiconductor devices
JPH0622265B2 (ja) * 1985-02-20 1994-03-23 株式会社日立製作所 半導体装置
JPS61218151A (ja) * 1985-03-23 1986-09-27 Hitachi Ltd 半導体装置
JPS63108021A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd 樹脂封止型半導体装置
JPH03135039A (ja) * 1989-10-20 1991-06-10 Fuji Electric Co Ltd 半導体装置の製造方法
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005320479A (ja) * 2004-05-11 2005-11-17 Kyocera Chemical Corp 液状エポキシ樹脂組成物
JP2006114716A (ja) * 2004-10-15 2006-04-27 Mitsubishi Electric Corp 電力用半導体装置
US8138904B2 (en) 2006-08-11 2012-03-20 Bridgestone Corporation Tire internal pressure alarm device
DE102011083927A1 (de) 2010-10-01 2012-07-05 Mitsubishi Electric Corporation Leistungsmodul und Verfahren zur Herstellung desselben
JP2014114426A (ja) * 2012-12-12 2014-06-26 Panasonic Corp 半導体封止用エポキシ樹脂組成物とそれを用いたパワーモジュール
US9548253B2 (en) 2013-09-06 2017-01-17 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing the same
US9917064B2 (en) 2014-10-16 2018-03-13 Mitsubishi Electric Corporation Semiconductor device with a plate-shaped lead terminal

Also Published As

Publication number Publication date
US5539218A (en) 1996-07-23
US5430330A (en) 1995-07-04
EP0575889A2 (en) 1993-12-29
EP0575889A3 (enExample) 1994-04-06

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