JPH0653644A - Soldering apparatus - Google Patents

Abstract

PURPOSE:To prevent a board from falling out from a board holder which is moved along rail members and prevent the board from being deformed, by cooling the rail members for carrying the board. CONSTITUTION:A board holder is moved around rail members 3A, 3B which are provided on both sides of a board carrying way, and it carries a mounting board while grasping the board from both its sides. Cavities 10A, 10B are formed in each of the rail members 3A, 3B over the total length of each rail member respectively. Further, a nozzle pipe 27 is so inserted into the end part of each of the rail members 3A, 3B as to stick the cavities 10A, 10B. In the nozzle pipe 27, nozzle holes are bored while being opposed to the positions of the cavities 10A, 10B. Then, compressed air sent from a cooling equipment into the nozzle pipe 27 is jetted into the cavities 10A, 10B, and by subjecting air and each of the rail members 3A, 3B to heat exchanging, each of the rail members 3A, 3B is cooled.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a soldering device. More specifically, the present invention relates to a soldering device for flow soldering or the like for soldering electronic components mounted on a printed board to the board.

[0002]

2. Description of the Related Art FIG. 7 is a schematic plan view showing a conventional flow solder device 71. Rail members 7 arranged in parallel
Between the 2A and 72B, there is formed a substrate transfer path on which the fluxer 73, the preheater 74, the solder bath 75, etc. are installed below, and between the sprocket 76A and 76B arranged at both ends of the rail members 72A and 72B. The chain 77, which is wound around the rail, runs around the inside and outside of the rail members 72A and 72B. The mounting board is held by being grasped from both sides by the claws provided at the tip of the board holder fixed to the chain 77, and is carried on the board carrying path as the chain travels.

As a result, the mounting board carried into the flow soldering device 71 is first conveyed with flux on the leads of the electronic components mounted on the mounting board by the fluxer 73 while being conveyed through the board conveying path, and then by the preheater 74. After being preheated, it is flow-soldered in the solder bath 75 and is carried out from the flow-solder device 71.

Further, since the width of the mounting board differs for each lot, it is necessary to adjust the distance between the board holders according to the width of the mounting board. Therefore, conventionally, one rail member 72A is fixed on the two or three horizontal members 78 arranged at right angles to the substrate transport direction, and the other rail member 72B is fixed on the horizontal member 78. The movable rail member 72 is installed on the movable member 78 so as to be movable along the length of the horizontal member 78.
By moving B along the horizontal member 78, the distance between the substrate holders can be adjusted.

[0005]

As described above, the rail member is used in order to make the distance between the substrate holders variable, so that the rail member has a length of 2 to 3 mm.
Only the points are fixed to the horizontal members, and the parts between the horizontal members are floating. On the other hand, since the rail member is exposed to high temperature due to heat radiation from the preheater or the solder bath (especially, the preheater part is provided with a cover above the rail member to prevent heat from escaping), so There is a problem that the portion between the fixed positions of the rail member heated by heat is deformed by thermal expansion. For example, when the portion between the fixed positions of the rail member is bent outward and the distance between the rail members is increased, the mounting substrate held by the substrate holder may drop downward. Also, if the rail members warp inward and the distance between the rail members becomes shorter, the mounting board is pinched from both sides and bends, resulting in uneven soldering of electronic components, or commercialization with the mounting board deformed. Therefore, there is a problem that the strength of the product is lowered. Further, when the rail member is deformed, there is a drawback that transfer between the carry-in conveyor and the board holder of the soldering device becomes poor.

In order to prevent such thermal deformation of the rail member, there is a conventional soldering device that uses a rail member provided with a heat radiation fin on the outer surface, but it is provided on the outer surface of the rail member. Since the radiating fins come into contact with the high temperature atmosphere, they rather act as heat absorbers, and there is a high possibility that they will have an adverse effect.

The present invention has been made in view of the above-mentioned drawbacks of the conventional example, and an object thereof is to prevent thermal deformation occurring in a rail member of a soldering device by a simple method.

[0008]

The soldering device of the present invention comprises:
It is characterized in that a cavity for feeding a cooling medium is formed inside a rail member for feeding a mounting substrate on which electronic components are mounted, and a cooling device for feeding the cooling medium is provided in the cavity. .

Further, a fin for heat radiation may be provided on the inner surface of the cavity for feeding the cooling medium.

[0010]

In the solder device of the present invention, the cooling medium can be sent into the cavity of the rail member by the cooling device, so that the rail member can be cooled by the cooling medium. Therefore, the rail member can be cooled by a simple method, the rail member is heated by the heater or the solder bath in the solder device, and is deformed,
It is possible to prevent warping.

Further, by providing a heat radiation fin on the inner surface of the cavity of the rail member, the contact area between the rail member and the cooling medium can be increased, and the cooling effect of the rail member by the cooling medium can be further enhanced. .

[0012]

1 is a schematic plan view showing a flow soldering apparatus 1 according to an embodiment of the present invention. In this flow soldering apparatus 1, rail members 3A and 3B made of two aluminum extruded products along the transfer direction of the mounting board 2 are provided.
Is provided, and a board transfer path for sending the mounting board 2 on which electronic components (not shown) are mounted is formed between the rail members 3A and 3B. A carry-in conveyor 4 and a carry-out conveyor 5 are provided at the entrance side and the exit side of the substrate carrying path, and below the substrate carrying path are a fluxer 6 and a pre-heating pre-sequentially in sequence along the substrate carrying direction. Heaters 7, 2
A tank-type solder tank 8, a cooling fan 9 and the like are installed.

2A and 2B show rail members 3A and 3B.
FIG. 3 is a side view and a cross-sectional view in which a part of FIG. Rail member 3
A cavity 10A having a large cross section is formed over the entire length in the central portions of A and 3B, and a cavity 10B having a relatively small cross section is formed over the entire length on both shoulders. Also,
A chain rail 13 for guiding the chain 12 is provided in the skirt 11 below the cavity 10B. As shown in FIG. 1, sprockets 14A and 14B are arranged in front of and behind the rail members 3A and 3B so as to face both ends of the rail members 3A and 3B. At least one of the sprockets 14A or 14B is a motor. It is rotationally driven by (not shown). Front and rear sprockets 14
The chain 12 is hung between A and 14B, and the chain 12 is laid between the sprockets 14A and 14B.
Runs in the chain rail 13 of the rail members 3A and 3B as shown in FIG. Reference numeral 15 in FIG. 2A is a cut portion of the skirt 11 that is obliquely cut in order to smoothly guide the chain 12 into the chain rail 13, and 16 in FIG. 1 is a cover that covers the sprocket 14A and 14B portions. Is. Furthermore, on the lower surface of the chain 12,
As shown in FIG. 3, a board holder 18 having a board holding claw 17 is attached to the tip of the board at a constant pitch. When the chain 12 travels by the rotation of the sprockets 14A and 14B, the board holder 18 is a rail member. Three
It moves in the substrate transfer direction along the rail members 3A and 3B between A and 3B.

When the mounting board 2 on which electronic components are mounted on the printed wiring board is sent to the carry-in conveyor 4, the mount board 2 sent by the carry-in conveyor 4 becomes
As shown in FIG. 5, the left and right edges are gripped by the claws 17 of the substrate holder 18 which are run along the left and right rail members 3A and 3B. In this way, when the mounting substrate 2 is conveyed along the substrate transport path by being gripped by the claws 17 of the substrate holder 18, flux is applied to the leads of the electronic components projecting on the lower surface of the mounting substrate 2 by the fluxer 6, and then downward by the preheater 7. It is preheated by blowing warm air from it, and further, the leads on the lower surface of the solder bath 8 are soldered by touching the solder bath. In this way, the mounting board 2 to which the leads of the electronic component are soldered is cooled by the cooling fan 9, then released from the board holder 18 and sent to the carry-out conveyor 5.

As described above, since the flow solder apparatus 1 grasps the mounting substrate 2 from both sides by the substrate holder 18 and conveys it, the distance between the rail members 3A and 3B can be adjusted according to the width of the mounting substrate 2. I have to. FIG. 5 shows a structure for adjusting the distance between the rail members 3A and 3B. Above and below the rail members 3A and 3B, an upper horizontal member 19 and a lower horizontal member 20 are arranged in parallel with each other so as to be orthogonal to the substrate transport direction, and near the upper horizontal member 19. A rotatable screw shaft 21 is provided in parallel with the upper horizontal member 19. One rail member 3A has an upper horizontal member 1 via support pieces 22A and 22B.
It is being fixed to 9 and the lower horizontal member 20. The other rail member 3B has a female screw hole 24 provided at the upper end of the upper support piece 23A screwed into the screw shaft 21, and a cylindrical slider provided at the lower end of the lower support piece 23B. The lower horizontal member 20 is slidably inserted into the space 25. Therefore, when the screw shaft 21 is rotated, the movable-side rail member 3B moves along the upper and lower horizontal members 19 and 20, and the left and right substrate holders 18 are fitted to the width of the mounting substrate 2.
The distance between the claws 17 can be adjusted.

The flow solder apparatus 1 also includes a cooling device 42 for the rail members 3A and 3B. The structure of this cooling device 42 is represented in FIGS. The ends of both rail members 3A and 3B on the substrate introduction side are shown in FIG.
As shown in (a) and (b), cavities 10A at three large and small locations,
The through hole 26 is opened so as to penetrate 10B,
As shown in FIG. 3, the cooling nozzle pipe 27 is provided in the through hole 26.
The screw holes 28 from the upper surface of the rail members 3A, 3B.
The nozzle pipe 27 is fixed by the bolt 29 inserted in the. In the nozzle pipe 27, as shown in FIGS. 4A and 4B, one end of the copper pipe 30 is closed by a blind member 31, and a nozzle hole 32 is formed at a position facing the cavities 10A, 10B of the rail members 3A, 3B. The screw part 33 is formed at the other end. An air supply pipe 35 for sending a cooling medium is connected to the threaded portion 33 of the nozzle pipe 27 via a joint fitting 34. A device for supplying a cooling medium includes a compressor 36 for pressurizing and sending air, and a valve 3 for opening and closing a pipe line.
7. Air filter 38 for removing dust and dirt to supply clean air, pressure reducing valve 3 for adjusting air pressure
9. Speed controller 4 for adjusting the air flow rate
0, and the air sent out from the speed controller 40 by operating the compressor 36 is
Further, after being branched in two directions by the air branch fitting 41, it is sent from the joint fitting 34 into the nozzle pipe 27 through the air supply pipe 35. Therefore, the pressurized air sent into the nozzle pipe 27 is discharged from the nozzle hole 32 into each cavity 10A,
It is blown out into 10B. The nozzle hole 32 is formed in the cavity 10.
The air is arranged so as to eject the air inside the A and 10B toward the substrate transfer direction, and the air ejected from the nozzle hole 32 blows through the inside of the cavities 10A and 10B, and heat is exchanged with the rail members 3A and 3B on the way. Then, the rail members 3A and 3B are cooled, and the heated air is diffused into the air from the other ends of the rail members 3A and 3B. Thus, the rail members 3A, 3
By cooling B from the inside, the rail members 3A and 3B can be prevented from being deformed or warped without lowering the temperature of the preheater 7, etc., and the mounting substrate 2 held by the claws 17 of the substrate holder 18 can be prevented from falling off. It is possible to prevent the mounting board 2 from being deformed, and improve the reliability of the flow soldering device 1.

In the embodiment shown in FIG. 1, the air filter 3
The air is branched by a branch metal fitting 43 inserted between the pressure reducing valve 39 and the pressure reducing valve 39, one of which is connected to the pressure reducing valve 39 for cooling and the other of which is connected to the fluxer 6 side. this is,
The air for cooling the rail members 3A, 3B is branched from the device for supplying air to the fluxer 6 and taken out. According to such a configuration, the compressor 36 and the air filter 38 can be shared. Therefore, the cost can be reduced. Also, the cavity 10
The end faces of A and 10B on the substrate introduction side may be closed with a lid, but may be open.

In the above embodiment, air at room temperature is used as the cooling medium, but for example, the pressure reducing valve 39 to the air branching fitting 4 can be used.
A cooler may be inserted into the pipelines up to 1 to send the cooled low temperature air into the cavities 10A and 10B of the rail members 3A and 3B. Further, it goes without saying that an inert gas other than air, water, or the like may be used as the cooling medium.

FIG. 6 shows a rail member 46 used in a flow solder apparatus according to another embodiment of the present invention.
It is sectional drawing which shows A and 46B. In this embodiment, the fins 47 for heat radiation are provided on the inner wall surface of the cavity 10A provided inside the rail members 46A and 46B. By providing the heat radiation fins 47 on the inner wall surface of the cavity 10A, the contact area between the rail members 46A and 46B and the cooling medium can be increased, and the rail members 46A and 46B.
Of the rail members 46A and 46B can be further suppressed.

In the above embodiments, the flow soldering device is described as an embodiment, but the present invention is not limited to the flow soldering device and can be applied to a reflow soldering device and other soldering devices. Nor.

[0021]

According to the present invention, the rail member can be cooled by the cooling medium sent into the cavity of the rail member, and the rail member can be easily cooled. It can be prevented from being deformed or warped by being heated by a solder bath or the like.

Therefore, it is possible to prevent the rail member from warping to the outside and dropping the mounting board conveyed along the rail member. In addition, the rail member warps inward, the mounting board is pressed from both sides and deforms, the mounting board is deformed into a product and the product strength is reduced, and the soldering of electronic components is not uniform. Can also be avoided. Furthermore, since the rail member can be prevented from being thermally deformed, the transfer between the carrying-in conveyor and the substrate holder and the mounting substrate can be smoothly performed.

Further, by providing a heat radiation fin on the inner surface of the cavity of the rail member, the contact area between the rail member and the cooling medium can be increased, and the cooling effect of the rail member by the cooling medium can be further enhanced. You can

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a flow solder device according to an embodiment of the present invention.

FIG. 2A is a partially cutaway side view showing the same rail member, and FIG. 2B is a sectional view taken along line XX of FIG.

FIG. 3 is a cross-sectional view showing a rail member equipped with a cooling nozzle.

4 (a) and 4 (b) are a sectional view and a front view showing the same cooling nozzle.

FIG. 5 is a cross-sectional view showing a support structure for the rail member of the above.

FIG. 6 is a sectional view showing a rail member according to another embodiment of the present invention.

FIG. 7 is a schematic plan view showing a conventional solder device.

[Explanation of symbols]

 2 Mounting board 3A, 3B Rail member 8 Solder tank 10A, 10B Cavity 18 Board holder 27 Nozzle pipe 36 Compressor 42 Cooling device 46A, 46B Rail member 47 Radiating fin

Claims (2)

[Claims] 1. A cavity for feeding a cooling medium is formed inside a rail member for feeding a mounting substrate on which electronic components are mounted, and a cooling device for feeding the cooling medium is provided in the cavity. A soldering device characterized in that 2. The solder device according to claim 1, wherein a heat radiation fin is provided on an inner surface of the cavity for feeding a cooling medium.