JP3095291B2 - Soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device. More specifically, the present invention relates to a soldering device such as a flow soldering device for soldering an electronic component mounted on a printed board to the board.

[0002]

2. Description of the Related Art FIG. 7 is a schematic plan view showing a conventional flow soldering apparatus 71. Rail members 7 arranged in parallel
Between the 2A and 72B, a substrate transfer path provided with a fluxer 73, a preheater 74, a solder tank 75 and the like is formed below, and between sprockets 76A and 76B disposed at both ends of the rail members 72A and 72B. The chain 77 is wound around the inside and outside of the rail members 72A and 72B. The mounting substrate is held so as to be gripped from both sides by claws provided at the tip of a substrate holder fixed to the chain 77, and is transported along the substrate transport path as the chain travels.

[0003] While the mounting board carried into the flow soldering device 71 is conveyed along the board conveyance path, first, flux is applied to the leads of the electronic components mounted on the mounting board by the fluxer 73, and the preheater 74 applies the flux. After being preheated, it is flow soldered in the solder tank 75 and is carried out of the flow soldering device 71.

[0004] Further, since the width of the mounting substrate differs for each lot, for example, it is necessary to adjust the distance between the substrate holders according to the width of the mounting substrate. For this reason, conventionally, one rail member 72A is fixed on two or three horizontal members 78 arranged at right angles to the board transfer direction, and the other rail member 72B is fixed to the horizontal member 78. The rail member 72 on the movable side is installed movably along the length direction of the horizontal member 78 on the upper side.
By moving B along the horizontal member 78, the distance between the substrate holders can be adjusted.

[0005]

As described above, the rail member is made to have a thickness of two to three in order to make the distance between the substrate holders variable.
Only the points are fixed to the cross members, and the portions between the cross members are floating. On the other hand, the rail member is exposed to a high temperature due to heat radiation from the pre-heater and the solder bath (particularly, a cover is provided above the rail member at the pre-heater portion so as not to release heat). There is a problem that a portion between the fixed positions of the rail member heated by heat is deformed by thermal expansion. For example, when a portion between the fixed positions of the rail members is warped outward to increase the distance between the rail members, the mounting board held by the board holder may fall downward. Also, if the rail members are warped inward and the distance between the rail members is reduced, the mounting board will be pinched from both sides and will bend, resulting in uneven soldering of electronic components and commercialization with the mounting board deformed There has been a problem that the strength of the product is reduced. Further, when the rail member is deformed, there is a disadvantage that the transfer between the carry-in conveyor and the substrate holder of the soldering device is deteriorated.

[0006] In order to prevent such thermal deformation of the rail member, a conventional soldering device uses a rail member provided with heat-dissipating fins on the outer surface, but is provided on the outer surface of the rail member. Since the heat dissipating fin comes into contact with the high-temperature atmosphere, it rather acts as a heat absorber, and is likely to have an adverse effect.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has as its object to prevent thermal deformation of a rail member of a soldering device by a simple method.

[0008]

The soldering device of the present invention comprises:
A cavity for sending a cooling medium is formed inside a rail member for sending a mounting board on which electronic components are mounted, and a cooling device for sending the cooling medium into the cavity is provided. .

[0009] Further, radiating fins may be provided on the inner surface of the cavity for sending the cooling medium.

[0010]

In the soldering device of the present invention, the cooling medium can be fed into the cavity of the rail member by the cooling device, so that the rail member can be cooled by the cooling medium. Therefore, the rail member can be cooled by a simple method, and the rail member is heated and deformed by a heater or a solder tank in the soldering device,
Warpage can be prevented.

Furthermore, by providing the heat dissipating fins on the inner surface of the cavity of the rail member, the contact area between the rail member and the cooling medium can be increased, and the cooling effect of the cooling medium on the rail member can be further enhanced. .

[0012]

1 is a schematic plan view showing a flow soldering apparatus 1 according to one embodiment of the present invention. In this flow soldering apparatus 1, rail members 3A and 3B made of two aluminum extruded products along the conveying direction of the mounting board 2 are provided.
Is provided, and a board transport path for sending the mounting board 2 on which electronic components (not shown) are mounted is formed between the rail members 3A and 3B. A carry-in conveyor 4 and a carry-out conveyor 5 are provided on the entrance side and the exit side of the substrate transport path. Below the substrate transport path, a fluxer 6 and a preheating pre-heater are sequentially arranged in the substrate transport direction. Heater 7, 2
A tank type solder tank 8, a cooling fan 9, and the like are provided.

FIGS. 2A and 2B show rail members 3A and 3B.
It is the side view and sectional drawing which fractured partially. Rail member 3
A cavity 10A having a large cross section is formed at the center of A and 3B over the entire length, and a cavity 10B having a relatively small cross section is formed at both shoulders over the entire length. Also,
A chain rail 13 for guiding the chain 12 is provided in the skirt 11 below the cavity 10B. As shown in FIG. 1, sprockets 14A and 14B are disposed in front and rear of each of the rail members 3A and 3B so as to face both ends of the rail members 3A and 3B, and at least one of the sprockets 14A or 14B is a motor. (Not shown). Front and rear sprockets 14
A and a chain 12 are wound between the sprockets 14A and 14B.
Is running on the chain rail 13 of the rail members 3A and 3B as shown in FIG. In FIG. 2A, reference numeral 15 denotes a cut portion of the skirt 11, which is cut obliquely to smoothly guide the chain 12 into the chain rail 13. Reference numeral 16 in FIG. 1 denotes a cover that covers the sprockets 14A and 14B. It is. Further, on the lower surface of the chain 12,
As shown in FIG. 3, a substrate holder 18 provided with a substrate holding claw 17 at a tip thereof is attached to the front end at a constant pitch. When the chain 12 runs by the rotation of the sprockets 14A and 14B, the substrate holder 18 becomes a rail member. 3
A moves between A and 3B in the board transfer direction along the rail members 3A and 3B.

When the mounting board 2 on which the electronic components are mounted on the printed wiring board is sent to the carrying-in conveyor 4, the mounting board 2 sent by the carrying-in conveyor 4 is
As shown in FIG. 5, the right and left edges are grasped by the claws 17 of the substrate holder 18 running along the left and right rail members 3A and 3B. When the mounting board 2 is sent along the board transfer path by being gripped by the claws 17 of the board holder 18 in this manner, flux is applied to the leads of the electronic components projecting from the lower surface of the mounting board 2 by the fluxer 6, and then the flux is applied by the preheater 7 to the lower side. Then, preheating is performed by blowing hot air from above, and the leads on the lower surface of the solder bath 8 are soldered by touching the solder bath. The mounting board 2 to which the leads of the electronic components are soldered is cooled by the cooling fan 9, released from the board holder 18, and sent out to the unloading conveyor 5.

As described above, since the flow soldering apparatus 1 transports the mounting substrate 2 while holding it from both sides by the substrate holder 18, the distance between the rail members 3A and 3B can be adjusted according to the width of the mounting substrate 2. I have to. FIG. 5 shows a structure for adjusting the distance between the rail members 3A and 3B. Above and below the rail members 3A and 3B, an upper horizontal member 19 and a lower horizontal member 20 are disposed in parallel with each other so as to be orthogonal to the substrate transport direction. A rotatable screw shaft 21 is provided in parallel with the upper horizontal member 19. One of the rail members 3A is connected to the upper horizontal member 1 via support pieces 22A and 22B.
9 and the lower horizontal member 20. The other rail member 3B has a female screw hole 24 provided at the upper end of the upper support piece 23A screwed with the screw shaft 21, and a cylindrical slider provided at the lower end of the lower support piece 23B. The lower horizontal member 20 is slidably inserted into 25. Accordingly, when the screw shaft 21 is rotated, the movable side rail member 3B moves along the upper and lower horizontal members 19 and 20, and the left and right substrate holders 18 are adjusted to the width of the mounting substrate 2.
The distance between the claws 17 can be adjusted.

The flow soldering device 1 has a cooling device 42 for the rail members 3A and 3B. The structure of the cooling device 42 is shown in FIGS. At the ends of the two rail members 3A and 3B on the board introduction side, FIG.
(A) As shown in (b), three large and small cavities 10A,
A through hole 26 is opened so as to penetrate 10B.
As shown in FIG. 3, the cooling nozzle pipe 27
Through the screw holes 28 from the upper surfaces of the rail members 3A and 3B.
The nozzle pipe 27 is fixed by a bolt 29 inserted through the nozzle pipe 27. As shown in FIGS. 4A and 4B, the nozzle pipe 27 has one end of the copper pipe 30 closed by a blind member 31 and a nozzle hole 32 is drilled at a position facing the cavities 10A and 10B of the rail members 3A and 3B. And a screw portion 33 is formed at the other end. An air supply pipe 35 for sending a cooling medium through a joint fitting 34 is connected to the screw portion 33 of the nozzle pipe 27. The device for supplying the cooling medium includes a compressor 36 for pressurizing and sending air and a valve 3 for opening and closing a pipe.
7. Air filter 38 for removing dust and dust and supplying clean air, pressure reducing valve 3 for adjusting air pressure
9. Speed controller 4 for adjusting air flow
0, and the air sent from the speed controller 40 by operating the compressor 36 is:
Further, after being branched in two directions by the air branch fitting 41, it is sent from the joint fitting 34 into the nozzle pipe 27 through the air supply pipe 35. Therefore, the pressurized air sent into the nozzle pipe 27 flows from the nozzle hole 32 to each of the cavities 10A,
It is blown out into 10B. The nozzle hole 32 is provided in the cavity 10
A and 10B are arranged so as to blow air toward the substrate transfer direction, and the air blown from the nozzle holes 32 blows through the cavities 10A and 10B, and exchanges heat with the rail members 3A and 3B on the way. Then, the rail members 3A, 3B are cooled, and the heated air is diffused into the air from the other ends of the rail members 3A, 3B. Thus, the rail members 3A, 3
By cooling B from the inside, deformation and warpage of the rail members 3A and 3B can be prevented without lowering the temperature of the pre-heater 7 and the like, and the mounting board 2 held by the claws 17 of the board holder 18 may fall off. The deformation and the like of the mounting substrate 2 can be prevented, and the reliability of the flow solder device 1 can be improved.

In the embodiment shown in FIG. 1, the air filter 3
The air is branched by a branch fitting 43 inserted between the pressure reducing valve 8 and the pressure reducing valve 39, one of which is connected to the pressure reducing valve 39 for cooling, and the other is connected to the fluxer 6 side. this is,
The air for cooling the rail members 3A, 3B is branched off from the device for supplying the air to the fluxer 6, and is taken out. According to such a configuration, the compressor 36 and the air filter 38 can be shared. Therefore, the cost can be reduced. Also, the cavity 10
The end faces of the substrates A and 10B on the substrate introduction side may be closed with a lid, but may be opened.

In the above embodiment, air at room temperature was used as the cooling medium.
Alternatively, a cooler may be inserted into up to one of the pipelines and the cooled low-temperature air may be sent into the cavities 10A and 10B of the rail members 3A and 3B. In addition, the cooling medium may be an inert gas other than air, water, or the like.

FIG. 6 shows a rail member 46 used in a flow soldering apparatus according to another embodiment of the present invention.
It is sectional drawing which shows A and 46B. In this embodiment, heat radiation fins 47 are provided on the inner wall surface of the cavity 10A provided inside the rail members 46A and 46B. By providing the radiation fins 47 on the inner wall surface of the cavity 10A, the contact area between the rail members 46A, 46B and the cooling medium can be increased, and the rail members 46A, 46B
Of the rail members 46A, 46B can be further suppressed.

In the above embodiment, the flow soldering device has been described as an embodiment. However, the present invention is not limited to the flow soldering device, and it goes without saying that the present invention can be applied to a reflow soldering device and other soldering devices. Nor.

[0021]

According to the present invention, the rail member can be cooled by the cooling medium sent into the cavity of the rail member, and the rail member can be easily cooled. It can be prevented from being deformed or warped by being heated by a solder bath or the like.

Accordingly, it is possible to prevent the rail member from warping outward and the mounting substrate conveyed along the rail member from dropping. In addition, the rail member warps inward, the mounting board is pressed from both sides and deformed, and the mounting board is deformed to produce a product, resulting in a decrease in product strength, and inconsistent soldering of electronic components. Can also be avoided. Furthermore, since the rail members can be prevented from being thermally deformed, the transfer between the carrying conveyor and the board holder between the mounting board and the mounting board can be performed smoothly.

Further, if the heat dissipating fins are provided on the inner surface of the cavity of the rail member, the contact area between the rail member and the cooling medium can be increased, and the cooling effect of the cooling medium on the rail member can be further improved. Can be.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a flow soldering device according to one embodiment of the present invention.

2 (a) is a partially cutaway side view showing the same rail member, and FIG. 2 (b) is a sectional view taken along line XX of FIG. 2 (a).

FIG. 3 is a sectional view showing a rail member on which a cooling nozzle is mounted.

FIGS. 4A and 4B are a cross-sectional view and a front view showing a cooling nozzle of the above.

FIG. 5 is a sectional view showing a support structure of the rail member according to the first embodiment;

FIG. 6 is a sectional view showing a rail member according to another embodiment of the present invention.

FIG. 7 is a schematic plan view showing a conventional solder device.

[Explanation of symbols]

 2 mounting board 3A, 3B rail member 8 solder tank 10A, 10B cavity 18 substrate holder 27 nozzle pipe 36 compressor 42 cooling device 46A, 46B rail member 47 radiation fin

Claims (2)

(57) [Claims] A cavity for sending a cooling medium is formed inside a rail member for sending a mounting board on which electronic components are mounted, and a cooling device for sending the cooling medium into the cavity is provided. A soldering device characterized by the above-mentioned. 2. The soldering device according to claim 1, wherein a radiating fin is provided on an inner surface of the cavity for sending a cooling medium.