JP2018069290A - Reflow device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent occurrence of a problem such that a flux fume is liquified in a cooling zone of a reflow device and is dropped onto a heated product, whereby quality of the heated product is decreased.SOLUTION: A reflow device has a heating zone including a furnace body which performs soldering of a heated product, and a cooling zone in which the soldered heated product is cooled, and causes the heated product to pass the heating zone and the cooling zone by a transport device. In the reflow device, blowing means for blowing a gas onto the heated product is located at a connection part between the heating zone and the cooling zone, and a gas blowing angle of the blowing means with respect to the a transport direction of the transport device is so made as to be variable.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a reflow apparatus, and in particular, prevents a liquefied flux from dripping onto a heated object such as a printed circuit board.

  A reflow apparatus is used in which a solder composition is supplied in advance to an electronic component or a printed circuit board, and the printed circuit board is conveyed in a reflow furnace by a conveyor. The reflow apparatus includes a transport conveyor for transporting an object to be heated and a reflow furnace main body to which the object to be heated is supplied by the transport conveyor. For example, the reflow furnace is divided into a plurality of zones along a transfer path from a carry-in port to a carry-out port, and the plurality of zones are arranged in-line. The plurality of zones have roles such as a heating zone and a cooling zone depending on their functions.

  The solder composition includes, for example, powder solder and flux. The flux contains rosin as a component, removes the oxide film on the surface of the metal to be soldered, prevents reoxidation by heating during soldering, reduces the surface tension of the solder and improves wetting It works. This flux is vaporized by heating and fills the reflow furnace. The vaporized flux is called flux fume.

  When the substrate is transported from the heating zone to the cooling zone, flux fume is brought into the cooling zone together with the object to be heated. Flux fume easily adheres to a low temperature part, and adheres to the cooling panel when cooled in the cooling zone. The flux may drop from the adhering portion and adhere to the upper surface of the object to be heated, which impairs the quality (performance) of the object to be heated.

Japanese Patent No. 338484

  In Patent Document 1, in a jet-type soldering apparatus, an inert gas (for example, N2 gas) is used after jet soldering in order to prevent flux fumes from adhering to and accumulating on the inner wall of the chamber and adhering to an object to be heated. ) In the chamber is provided. However, Patent Document 1 is a jet-type soldering apparatus, and in a reflow apparatus including a heating zone and a cooling zone, there is no description or suggestion in solving a problem caused by adhesion of flux fume in the cooling zone.

  Therefore, the objective of this invention is providing the reflow apparatus which can prevent the quality fall of the to-be-heated material by dripping of the flux fume in the cooling zone of a reflow apparatus.

The present invention has a heating zone having a furnace body for soldering an object to be heated, and a cooling zone for cooling the object to be heated that has been soldered, and the heating zone and the cooling zone are heated by a transport device. In a reflow device that passes objects,
At the connecting part between the heating zone and the cooling zone, a blowing means for blowing gas to the object to be heated is arranged,
This is a reflow apparatus in which the blowing angle of the blowing means relative to the conveying direction of the gas conveying apparatus is variable.
The present invention has a heating zone having a furnace body for performing soldering by blowing hot air against an object to be heated, and a cooling zone for cooling the object to be heated that has been soldered. In the reflow device that passes the object to be heated by the transport device,
The heating zone is configured to blow hot air to the object to be heated through the plurality of small holes of the first panel, and the cooling zone is configured to spray the cooling gas to the object to be heated through the plurality of small holes of the second panel.
This is a reflow device in which the angle of the second panel with respect to the plane formed by the transport direction of the transport device and the direction orthogonal to the transport direction is variable.
The present invention has a heating zone having a furnace body for performing soldering by blowing hot air against an object to be heated, and a cooling zone for cooling the object to be heated that has been soldered. In the reflow device that passes the object to be heated by the transport device,
The heating zone is configured to blow hot air to the object to be heated through the plurality of small holes of the first panel, and the cooling zone is configured to spray the cooling gas to the object to be heated through the plurality of small holes of the second panel.
This is a reflow device in which the angle of the first panel with respect to a plane formed by a transport direction of the transport device and a direction orthogonal to the transport direction is variable.
The present invention has a heating zone having a furnace body for performing soldering by blowing hot air against an object to be heated, and a cooling zone for cooling the object to be heated that has been soldered. In the reflow device that passes the object to be heated by the transport device,
The heating zone is configured to blow hot air to the object to be heated through the plurality of small holes of the first panel, and the cooling zone is configured to spray the cooling gas to the object to be heated through the plurality of small holes of the second panel.
At the connecting part between the heating zone and the cooling zone, a blowing means for blowing gas to the object to be heated is arranged,
The blowing angle with respect to the conveying direction of the gas conveying device of the blowing means is variable,
The angle of the first panel with respect to the plane formed by the transport direction of the transport device and the direction orthogonal to the transport direction is variable,
This is a reflow device in which the angle of the second panel with respect to the plane formed by the transport direction of the transport device and the direction orthogonal to the transport direction is variable.

  According to at least one embodiment, the cooling fumes blown through the second panel of the cooling zone prevent flux fumes from moving from the heating zone to the cooling zone. Therefore, liquefaction of flux fumes in the cooling zone is suppressed. Note that the effects described here are not necessarily limited, and may be any effects described in the present disclosure. In addition, the contents of the present disclosure are not construed as being limited by the exemplified effects in the following description.

It is a basic diagram which shows the outline of the conventional reflow apparatus which can apply this invention. It is a graph which shows the example of the temperature profile at the time of reflow. It is sectional drawing which shows an example of a structure of one heating zone of a reflow apparatus. It is a basic diagram which shows the outline of the cross section of the reflow apparatus used for description of the 1st Embodiment of this invention. It is a top view of an example of a heating panel, a top view of an example of a cooling panel, an expanded sectional view of a gas blowing pipe and a gas blowing pipe. It is a front view of an example of a panel angle variable mechanism. It is a basic diagram used for description of the 2nd Embodiment of this invention. It is a basic diagram used for description of the 3rd Embodiment of this invention. It is a basic diagram used for description of the 4th Embodiment of this invention. It is a basic diagram used for description of the 5th Embodiment of this invention.

Embodiments of the present invention will be described below. The description will be given in the following order.
<1. Example of reflow equipment>
<2. First Embodiment>
<3. Second Embodiment>
<4. Third Embodiment>
<5. Fourth Embodiment>
<6. Fifth embodiment>
<7. Modification>
Note that the embodiment described below is a preferred specific example of the present invention, and various technically preferable limitations are given. However, the scope of the present invention is specifically described in the following description. Unless otherwise stated, the present invention is not limited to these embodiments.

<1. Example of reflow equipment>
FIG. 1 shows a schematic configuration of a conventional reflow apparatus 101 to which the present invention can be applied. In FIG. 1, illustration of the flux collection | recovery apparatus arrange | positioned outside a reflow furnace for convenience of explanation is abbreviate | omitted. An object to be heated, on which electronic components for surface mounting are mounted on both sides of the printed circuit board, is placed on a conveyor, and is carried into the furnace body of the reflow apparatus from the carry-in entrance 11. The conveyor conveys the object to be heated in the direction of the arrow (from left to right as viewed in FIG. 1) at a predetermined speed, and the object to be heated is taken out from the carry-out port 12. The transport direction of the transport conveyor is the horizontal direction.

  A reflow furnace is sequentially divided into, for example, nine zones Z1 to Z9 along the conveyance path from the carry-in port 11 to the carry-out port 12, and these zones Z1 to Z9 are arranged in-line. Seven zones Z1 to Z7 from the inlet side are heating zones, and two zones Z8 and Z9 on the outlet side are cooling zones. A forced cooling unit 14 is provided in relation to the cooling zones Z8 and Z9.

  The plurality of zones Z1 to Z9 described above controls the temperature of the object to be heated according to the temperature profile during reflow. FIG. 2 shows an outline of an example of the temperature profile. The horizontal axis represents time, and the vertical axis represents the surface temperature of a printed circuit board on which an object to be heated, such as an electronic component, is mounted. The first section is the temperature raising portion R1 where the temperature rises due to heating, the next section is the preheating (preheating) portion R2 where the temperature is substantially constant, the next section is the main heating portion R3, and the last section is This is the cooling unit R4.

  The temperature raising portion R1 is a period in which the substrate is heated from room temperature to a preheating portion R2 (for example, 150 ° C. to 170 ° C.). The preheating portion R2 is a period for performing isothermal heating, activating the flux, removing oxide films on the surfaces of the electrodes and solder powder, and eliminating uneven heating of the printed circuit board. The main heating portion R3 (for example, 220 ° C. to 240 ° C. at the peak temperature) is a period in which the solder is melted and the joining is completed. In the main heating part R3, the temperature needs to be raised to a temperature exceeding the melting temperature of the solder. Even when the preheating portion R2 has passed, the main heating portion R3 needs to be heated to a temperature exceeding the melting temperature of the solder because there is uneven temperature rise. The last cooling section R4 is a period in which the printed circuit board is rapidly cooled to form a solder composition.

  In FIG. 2, curve 1 shows the temperature profile of lead-free solder. The temperature profile in the case of Sn—Pb eutectic solder is shown by curve 2. Since the melting point of lead-free solder is higher than the melting point of eutectic solder, the set temperature in the preheating portion R2 is higher than that of eutectic solder.

  In the reflow apparatus, the zones Z1 and Z2 are mainly responsible for the temperature control of the temperature raising portion R1 in FIG. The temperature control of the preheating part R2 is mainly handled by the zones Z3, Z4 and Z5. The temperature control of the main heating unit R3 is handled by the zones Z6 and Z7. The temperature control of the cooling unit R4 is handled by the zone Z8 and the zone Z9.

  Each of the heating zones Z1 to Z7 has an upper furnace body 15 and a lower furnace body 35 each including a blower. For example, hot air is blown against an object to be heated conveyed from the upper furnace body 15 and the lower furnace body 35 in the zone Z1.

  An example of the heating device will be described with reference to FIG. For example, FIG. 3 shows a cross section when the zone Z6 is cut along a plane orthogonal to the transport direction. Within a gap between the upper furnace body 15 and the lower furnace body 35, an object to be heated (also referred to as a workpiece) W on which surface mounting electronic components are mounted on both sides of the printed circuit board is placed on the conveyor 31. Are transported. The upper furnace body 15 and the lower furnace body 35 are filled with, for example, nitrogen (N2) gas, which is an atmospheric gas. The upper furnace body 15 and the lower furnace body 35 heat the article to be heated W by blowing hot air (heated atmospheric gas) onto the article to be heated W. In addition, you may irradiate infrared rays with a hot air.

  The upper furnace body 15 includes, for example, a blower 16 configured as a turbofan, and air guide plates 17a and 17b arranged to face each other in order to disperse the air from the blower 16 and to make the temperature distribution in the furnace body uniform. The heater 18 is formed by bending a plurality of heater wires, and a heating panel (heat storage member) 19 having a large number of small holes through which hot air passes, and the hot air that has passed through the small holes of the heating panel 19 is heated. Sprayed from above on W. The heating panel 19 is formed by forming a large number of small holes in, for example, an aluminum metal plate.

  The lower furnace body 35 has the same configuration as the upper furnace body 15 described above. That is, for example, a blower 26 having a turbofan structure, air guide plates 27a and 27b arranged to face each other in order to disperse the air from the blower 26 and make the temperature distribution in the furnace uniform, and heater wires It has a heater 28 configured by bending a plurality of times, and a heating panel (heat storage member) 29 having a large number of small holes through which hot air passes. Hot air that has passed through the small holes of the heating panel 29 is blown against the object to be heated W from below.

  A flux recovery device 41 is provided for the upper furnace body 15. The flux recovery device 41 is installed on the back side of the upper furnace body 15 in a space surrounded by an outer plate, for example. A flux recovery device 61 is provided for the lower furnace body 35. The flux collection device 61 is installed on the back side of the lower furnace body 35 in a space surrounded by an outer plate, for example. The flux recovery device 41 includes a radiator section 42 that cools the atmospheric gas derived from the upper furnace body 15 and a recovery container 43 that recovers the flux liquefied by cooling. Similarly, the flux recovery device 61 includes a radiator unit 62 that cools the atmospheric gas derived from the lower furnace body 35 and a recovery container 63 that recovers the flux liquefied by cooling.

  A hole 52 serving as an outlet for leading atmospheric gas to the flux recovery device 41 is provided in a path through which hot air circulates by the blower 16. The hole 52 is provided at a location where the pressure is high in the furnace. A hole 53 as an inlet for introducing the gas from the flux recovery device 41 into the upper furnace body 15 is provided at a location where the pressure is low. These holes 52 and 53 actually correspond to openings on one end sides of the connecting pipes 54 and 55, respectively. Each of the connection pipes 54 and 55 and the connection pipe of the flux recovery apparatus 41 are connected by a hose not shown. Also in the lower furnace body 35, the atmospheric gas is led out to the flux recovery device 61 from a hole provided at a high pressure in the furnace, and the gas having a reduced flux component from the flux recovery device 61 has a low pressure in the furnace. It is introduced from the hole provided in the place.

  In addition, the flux collection | recovery apparatuses 41 and 61 are provided in the zone where dirt of atmospheric gas is large in each zone of a reflow apparatus. However, you may arrange | position the flux collection | recovery apparatuses 41 and 61 in all the zones of a reflow apparatus.

  Unlike the heating zone, the cooling zones Z8 and Z9 are configured not to have the heaters 18 and 28, and the cooling gas (inert gas such as N2 gas or air) is passed through the cooling panel by the blowers provided above and below. Thus, it is configured to be sprayed onto the object to be heated W. The cooling panel is formed by forming a large number of small holes in a metal plate such as aluminum.

  Even when the flux recovery devices 41 and 61 are installed, the flux component cannot be completely removed, the flux fumes move to the cooling zones Z8 and Z9, and the flux fumes are liquefied by being cooled in the cooling zones Z8 and Z9. The problem that the flux adheres to the object to be heated by dripping (dripping) cannot be eliminated. The present invention effectively prevents the flux from adhering to the object to be heated.

<2. First Embodiment>
A first embodiment of the present invention will be described with reference to FIG. A connecting zone Z78 as a connecting portion is provided between the heating zone Z7 and the cooling zone Z8. FIG. 4 is a cross-sectional view of the heating zone Z7, the connection zone Z78, and the cooling zone Z8 cut along a plane parallel to the transport direction of the transport conveyor 31, and shows a simplified configuration of each zone.

  In the heating zone Z7, the heating panel P1 (the heating panel 19 in FIG. 3) and the heating panel P2 (the heating panel 29 in FIG. 3) (simply referred to as the heating panel P when it is not necessary to distinguish the individual heating panels) are small. Hot air is blown through the holes on the upper and lower surfaces of the article to be heated W as indicated by the hatched arrows. When the plane formed by the conveyance direction of the conveyor 31 and the direction orthogonal to the conveyance direction (that is, a plane parallel to the conveyance surface; the same applies hereinafter) and the heating panel P are parallel, the direction perpendicular to the heating panel ( Hot air is blown out in the normal direction).

  In the cooling zone Z8, the upper surface of the object W to be heated is such that the cooling gas is indicated by an arrow through the small holes of the cooling panels Q1 and Q2 (referred to simply as the cooling panel Q when there is no need to distinguish between the individual cooling panels). And the to-be-heated material W is cooled by spraying on a lower surface. When the plane formed by the conveyance direction of the conveyance conveyor 31 and the direction orthogonal to the conveyance direction is parallel to the cooling panel Q, the cooling gas is blown out in a direction (normal direction) perpendicular to the cooling panel Q.

  In the connection zone Z78, gas blowing pipes R11, R12, R13 and R14 (referred to simply as gas blowing pipes R when there is no need to distinguish individual gas blowing pipes) are arranged as blowing means. The gas blowing pipe R is formed by forming a plurality of small holes in the extending direction on the peripheral surface of a tubular member extending in a direction orthogonal to the conveying direction of the conveying conveyor 31.

  The gas blowing pipe R is rotatably supported with respect to the fixed base part, and the blowing angle of the gas blown out from the small hole is variable. As the gas, air, N2 (nitrogen), which is an inert gas, or the like can be used, and it is more preferable to use an inert gas. In the example of FIG. 4, the gas blowing pipes R <b> 11 and R <b> 21 are opposed to each other with the conveyance conveyor 31 interposed therebetween, and the gas blowing pipes R <b> 12 and R <b> 22 are opposed to each other with the conveyance conveyor 31 interposed therebetween. And it is set as the rotation position where each blowing outlet faces. In this case, gas blows out from the gas blowing pipe R in the vertical direction with respect to the conveyor 31 as indicated by arrows.

  FIG. 5 shows a configuration example of a part of a reflow apparatus including a cooling panel Q (FIG. 5A), a heating panel P (FIG. 5B), and a gas blowing pipe R (FIG. 5C). Arrows indicate the transport direction of the transport conveyor 31. Each of the cooling panel Q and the heating panel P has a configuration in which a large number of small holes are formed in a metal plate. As shown in an enlarged view in FIG. 5D, the gas blowing pipe R has a metal tubular shape and is formed by arranging small holes r on the peripheral surface. Gas is blown out through the small holes r. Note that two or more rows of the small holes r may be formed on the peripheral surface, and gas may be blown out from the two small holes r at different blowing angles at the same time.

  FIG. 6 shows an example of an angle variable mechanism of the heating panel P. An attachment portion 71 is fixed to one end side of the heating panel P. Two elongated holes 73 a and 73 b are formed in the fixed base portion 72. The long holes 73a and 73b are formed in an arc shape so as to form a part of an arc. The lock pin 74a fixed to the attachment portion 71 is inserted into the elongated hole 73a, and the lock pin 74b fixed to the attachment portion 71 is inserted into the elongated hole 73b.

  As shown in the drawing, in the state where the lock pins 74a and 74b are positioned at the lower ends of the long holes 73a and 73b, the heating panel P is held in the horizontal position. If the lock pins 74a and 74b are loosened from this state and the heating panel P is raised upward, the end of the heating panel P where the mounting portion 71 is not provided rotates upward as shown by the phantom line in FIG. The heating panel P is inclined. The position of the heating panel P can be maintained by tightening the lock pins 74a and 74b at desired positions. If the length of the long holes 73a and 73b shown in FIG. 6 is increased so that the lock pins 73a and 73b can be displaced downward, the heating panel P can be rotated from the horizontal position to the lower side. . FIG. 6 shows a variable tilt angle mechanism of the heating panel P, but a similar tilt angle variable mechanism is provided for the cooling panel Q as well.

  The inclination of the heating panel P is defined by an angle with respect to a plane formed by the transport direction of the transport conveyor 31 and the direction orthogonal to the transport direction. For example, the inclination of the heating panel P is defined by the rotation angle of the heating panel P with respect to the horizontal plane. With respect to the front and rear end portions of the heating panel P, assuming that the end portion close to the carry-in port 11 is the front end and the end portion far from the carry-in port 11 is the rear end, the state of the phantom line shown in FIG. The front end is higher than the rear end. This state is defined as rising. Conversely, a state in which the front end of the heating panel P is lower than the rear end is defined as descending. The inclination is similarly defined for the cooling panel Q.

  In the first embodiment, the gas blowing direction can be changed by the gas blowing pipe R. For example, if the gas is blown obliquely so as to go to the heating zone Z7 side with respect to the vertical direction, the flux fume entering the cooling zone Z8 together with the article to be heated W from the heating zone Z7 is allowed to enter. The amount of flux fumes entering the cooling zone Z8 can be reduced, and the amount of flux liquefied in the cooling zone Z8 can be reduced. Therefore, the problem that the liquefied flux adheres to the article to be heated W in the cooling zone Z8 can be prevented.

<3. Second Embodiment>
A second embodiment of the present invention will be described with reference to FIG. As shown in FIG. 7, in the heating zone Z7, the front end of the heating panel P1 rises and the front end of the heating panel P2 falls. As described above, the front end is defined as the end on the inlet side where the article to be heated W arrives, and the rear end is defined as the end on the outlet side from which the article to be heated W leaves. This definition is the same for the cooling panels Q1 and Q2. Accordingly, the hot air blown to the article to be heated W through the heating panels P1 and P2 is inclined so as to be directed toward the inlet side of the heating zone Z7 with respect to the vertical direction. As a result, it is possible to suppress the flux fume from moving to the connection zone Z78.

  Further, in the connection zone Z78, the gas blowing pipe R blows gas obliquely toward the outlet of the heating zone Z7. As a result, it is possible to suppress the flux fume from moving to the connection zone Z78 and to suppress the flux fume from moving to the cooling zone Z8.

  Further, in the cooling zone Z8, the cooling panel Q1 rises and the cooling panel Q2 falls. Therefore, the cooling gas blown to the article to be heated W through the cooling panels Q1 and Q2 is inclined so as to be directed toward the inlet side of the connection zone Z8 with respect to the vertical direction. As a result, it is possible to suppress the flux fume from moving to the connection zone Z8. As described above, according to the second embodiment, the heating panel P, the gas blowing pipe R, and the cooling panel Q cooperate to suppress the flux fume from moving to the cooling zone Z8. It is possible to prevent liquefaction with Z8 and adhesion to the article to be heated W.

<4. Third Embodiment>
A third embodiment of the present invention will be described with reference to FIG. As shown in FIG. 8, in the heating zone Z7, the heating panel P1 is lowered and the heating panel P2 is raised. Therefore, the hot air blown to the article to be heated W through the heating panels P1 and P2 is inclined so as to be directed toward the outlet side of the heating zone Z7 with respect to the vertical direction. As a result, the flux fume can be promoted to move to the connection zone Z78.

  Further, in the connection zone Z78, the gas blowing pipe R blows gas obliquely toward the inlet of the cooling zone Z8. As a result, the flux fumes can be promoted to move to the cooling zone Z8.

  Further, in the cooling zone Z8, the cooling panel Q1 is lowered and the cooling panel Q2 is raised. Therefore, the cooling gas blown to the article to be heated W through the cooling panels Q1 and Q2 is inclined so as to be directed toward the outlet side of the cooling zone Z8 with respect to the vertical direction. As a result, the flux fumes can be promoted to move to the cooling zone Z8. As described above, according to the third embodiment, the heating panel P, the gas blowing pipe R, and the cooling panel Q cooperate to promote the passage of flux fumes through the connection zone Z78 and the cooling zone Z8. The flux fume can be quickly moved to the final stage flux removal apparatus or the exhaust system outside the furnace, and the influence of the flux fume can be prevented.

<5. Fourth Embodiment>
A fourth embodiment of the present invention will be described with reference to FIG. As shown in FIG. 9, in the heating zone Z7, the heating panel P1 rises and the heating panel P2 rises. Accordingly, the hot air blown to the object to be heated W through the heating panel P1 is inclined to the exit side of the heating zone Z7 with respect to the vertical direction, and the hot air blown to the object to be heated W through the heating panel P2 is vertical. With respect to the heating zone Z7, it is inclined toward the inlet side.

  In the connection zone Z78, the gas blowing pipes R11 and R12 blow the gas obliquely toward the outlet of the heating zone Z7, and the gas blowing pipes R21 and R22 blow the gas obliquely toward the inlet of the cooling zone Z8.

  Further, in the cooling zone Z8, the cooling panel Q1 rises and the cooling panel Q2 rises. Accordingly, the cooling gas blown to the heated object W through the cooling panel Q1 is inclined so as to be directed toward the inlet side of the cooling zone Z8 with respect to the vertical direction, and the cooling gas blown to the heated object W through the cooling panel Q2. The gas is inclined so as to be directed toward the outlet side of the cooling zone Z8 with respect to the vertical direction.

<6. Fifth embodiment>
A fifth embodiment of the present invention will be described with reference to FIG. As shown in FIG. 10, in the heating zone Z7, the heating panel P1 rises and the heating panel P2 falls. Accordingly, the hot air blown to the article to be heated W through the heating panels P1 and P2 is inclined so as to be directed toward the inlet side of the heating zone Z7 with respect to the vertical direction. As a result, it is possible to suppress the flux fume from moving to the connection zone Z78.

  Further, in the connection zone Z78, the opposed gas blowing pipes R11 and R21 blow the gas obliquely in the direction of the outlet of the heating zone Z7. As a result, it is possible to suppress the flux fume from moving to the connection zone Z78 and to suppress the flux fume from moving to the cooling zone Z8. Further, the opposing gas blowing pipes R12 and R22 blow out the gas in the vertical direction.

  Further, in the cooling zone Z8, the cooling panel Q1 rises and the cooling panel Q2 falls. Therefore, the cooling gas blown to the article to be heated W through the cooling panels Q1 and Q2 is inclined so as to be directed toward the inlet side of the cooling zone Z8 with respect to the vertical direction. As a result, it is possible to suppress the flux fume from moving to the cooling zone Z8. As described above, according to the fifth embodiment, the heating panel P, the gas blowing pipe R, and the cooling panel Q cooperate to suppress the flux fume from moving to the cooling zone Z8. It is possible to prevent liquefaction with Z8 and adhesion to the article to be heated W. Furthermore, since the air curtain is formed by the gas blown out from the gas blowing pipes R12 and R22, it is possible to suppress the flux fume from moving to the cooling zone Z8.

<7. Modification>
Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above-described embodiments, and various modifications based on the technical idea of the present invention are possible. For example, as the mechanism for varying the tilt angle of the heating panel P and the cooling panel Q, other configurations such as a configuration in which a rotation shaft is provided at the center of the panel other than the mechanism shown in FIG. Further, the heating zone on the front side of the cooling zone is not limited to the zone for heating the heated object W, but a zone for conveying the soldered heated object W without heating is provided, and the heating panel described above is provided in this zone. You may do it. Further, the gas blowing pipes are not limited to being arranged in the vertical direction of the conveyance surface, but may be arranged on both the left and right sides of the conveyance surface. In this case, the gas may be blown out from both the up-down direction and the left-right direction. Note that the configurations, methods, steps, shapes, materials, numerical values, and the like given in the above-described embodiments are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, etc. are used as necessary. May be. The configurations, methods, processes, shapes, materials, numerical values, and the like of the above-described embodiments can be combined with each other without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 11 ... Carry-in port 12 ... Carry-out port 14 ... Forced cooling unit 15 ... Upper furnace body 16, 26 ... Blower 18, 28 ... Heater 19, 29, P ... Heating panel 31 ... Conveyor 35 ... Lower furnace body Q ... Cooling panel R ... Gas blowing pipe

Claims (8)

A heating zone having a furnace body for soldering the object to be heated; and a cooling zone for cooling the soldered object to be heated; and the heating zone and the cooling zone are conveyed by a conveying device. In the reflow device that passes
A blowing means for blowing gas to the object to be heated is disposed at the connection between the heating zone and the cooling zone,
The reflow apparatus in which the blowing angle of the gas with respect to the conveying direction of the conveying device is variable.   The reflow apparatus according to claim 1, wherein the blowing means is a tubular member that extends in a direction orthogonal to the conveying direction of the conveying apparatus and has a plurality of small holes formed in the extending direction on the peripheral surface.   The reflow device according to claim 2, wherein the first tubular member and the second tubular member are arranged to face each other across a plane formed by a conveyance direction of the conveyance device and a direction orthogonal to the conveyance direction.   The reflow apparatus according to claim 3, comprising a plurality of the first tubular members and a plurality of the second tubular members, each of which has a variable blowing angle. A heating zone having a furnace body for performing soldering by blowing hot air on the object to be heated; and a cooling zone for cooling the soldered object to be heated, and conveying the heating zone and the cooling zone. In the reflow apparatus for passing the object to be heated by
The heating zone is configured to blow hot air to the object to be heated through a plurality of small holes in the first panel, and the cooling zone sprays a cooling gas to the object to be heated through the plurality of small holes in the second panel. With the configuration,
A reflow apparatus in which an angle of the second panel with respect to a plane formed by a transport direction of the transport apparatus and a direction orthogonal to the transport direction is variable. A heating zone having a furnace body for performing soldering by blowing hot air on the object to be heated; and a cooling zone for cooling the soldered object to be heated, and conveying the heating zone and the cooling zone. In the reflow apparatus for passing the object to be heated by
The heating zone is configured to blow hot air to the object to be heated through a plurality of small holes in the first panel, and the cooling zone sprays a cooling gas to the object to be heated through the plurality of small holes in the second panel. With the configuration,
A reflow apparatus in which an angle of the first panel with respect to a plane formed by a transport direction of the transport apparatus and a direction orthogonal to the transport direction is variable. A heating zone having a furnace body for performing soldering by blowing hot air on the object to be heated; and a cooling zone for cooling the soldered object to be heated, and conveying the heating zone and the cooling zone. In the reflow apparatus for passing the object to be heated by
The heating zone is configured to blow hot air to the object to be heated through a plurality of small holes in the first panel, and the cooling zone sprays a cooling gas to the object to be heated through the plurality of small holes in the second panel. With the configuration,
A blowing means for blowing gas to the object to be heated is disposed at the connection between the heating zone and the cooling zone,
The blowing angle of the blowing means with respect to the conveying direction of the conveying device is variable,
An angle of the first panel with respect to a plane formed by a transport direction of the transport device and a direction orthogonal to the transport direction is variable,
A reflow apparatus in which an angle of the second panel with respect to a plane formed by a transport direction of the transport apparatus and a direction orthogonal to the transport direction is variable.   The reflow apparatus according to claim 1 or 7, wherein the gas is an inert gas.

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