CN107999918B

CN107999918B - Reflow soldering device

Info

Publication number: CN107999918B
Application number: CN201711009081.1A
Authority: CN
Inventors: 田森信章; 齐藤浩司; 宇野徹
Original assignee: Tamura Corp
Current assignee: Tamura Corp
Priority date: 2016-10-28
Filing date: 2017-10-25
Publication date: 2022-01-11
Anticipated expiration: 2037-10-25
Also published as: JP6502910B2; CN107999918A; JP2018069290A

Abstract

The invention relates to a reflow soldering device, which can prevent flux fog from liquefying in a cooling area of the reflow soldering device and dripping on an object to be heated to prevent the quality of the object to be heated from being reduced. This reflow soldering device includes: a heating region having a furnace body for welding an object to be heated; and a cooling region for cooling the welded object, wherein the object is passed through the heating region and the cooling region by the conveyor, a blowout member for blowing gas to the object is disposed at a connection portion between the heating region and the cooling region, and an angle of the blowout member with respect to a conveying direction of the conveyor is variable.

Description

Reflow soldering device

Technical Field

The present invention relates to a reflow soldering apparatus, and more particularly, to a reflow soldering apparatus capable of preventing liquefied flux from dripping onto an object to be heated such as a printed circuit board.

Background

The following reflow apparatus was used: a solder composition is supplied to an electronic component or a printed circuit board in advance, and the printed circuit board is conveyed in a reflow furnace by a conveyor belt. The reflow soldering apparatus includes a conveyor belt for conveying an object to be heated and a reflow soldering furnace main body for supplying the object to be heated from the conveyor belt. The reflow furnace is divided into a plurality of regions in advance along a conveyance path from the inlet to the outlet, for example, and these plurality of regions are arranged in series. The plurality of regions function as a heating region, a cooling region, and the like, depending on their functions.

The solder composition contains, for example, powdered solder and flux. The flux contains a component such as rosin, and has an effect of preventing re-oxidation by heating when removing an oxide film on the surface of a metal to be soldered and soldering, reducing the surface tension of the solder and improving wettability. Upon heating, the flux is vaporized and filled in the reflow furnace. The vaporized flux is referred to as flux mist.

When the substrate is transported from the heating area to the cooling area, the flux mist is carried into the cooling area together with the object to be heated. The flux mist is liable to adhere to a portion having a low temperature, and adheres to the cooling plate when cooled in the cooling region. The flux may drip from the portion to which the flux is attached and adhere to the upper surface of the object to be heated, and the quality (performance) of the object to be heated may be impaired.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 3384584

Disclosure of Invention

Problems to be solved by the invention

Patent document 1 describes the following structure: in the jet welding apparatus, in order to prevent the flux mist from adhering to the inner wall of the chamber and depositing on the object to be heated, the inert gas (e.g., N) is blown into the chamber after the jet welding₂Gas) suction inlet and suction outlet. However, patent document 1 is a jet soldering apparatus, and does not describe or suggest a solution to the problem caused by adhesion of flux mist in a cooling region in a reflow soldering apparatus including a heating region and a cooling region.

Accordingly, an object of the present invention is to provide a reflow soldering apparatus capable of preventing quality of an object to be heated from being degraded due to dropping of flux mist in a cooling region of the reflow soldering apparatus.

Means for solving the problems

The invention is a reflow soldering apparatus, comprising: a heating region having a furnace body for welding an object to be heated; and a cooling region for cooling the welded object to be heated, wherein the object to be heated is passed through the heating region and the cooling region by a conveyor,

a blowing member for blowing gas to the object to be heated is disposed at a connecting portion between the heating zone and the cooling zone,

the angle of the blow-out member with respect to the conveying direction of the conveying device at which the gas is blown out is variable.

The invention is a reflow soldering apparatus, comprising: a heating zone having a furnace body for welding by blowing hot air to an object to be heated; and a cooling region for cooling the welded object to be heated, and allowing the object to be heated to pass through the heating region and the cooling region by a conveyor,

the heating area is configured to blow hot air to the object to be heated through the plurality of small holes of the 1 st plate, the cooling area is configured to blow cooling gas to the object to be heated through the plurality of small holes of the 2 nd plate,

the angle of the 2 nd plate with respect to a plane formed by the conveying direction of the conveying device and a direction orthogonal to the conveying direction is variable.

the angle of the 1 st plate with respect to a plane formed by the conveying direction of the conveying device and a direction orthogonal to the conveying direction is variable.

the angle of the blow-off elements with respect to the conveying direction of the conveying device at which the gas is blown off is variable,

the angle of the 1 st plate with respect to the plane formed by the conveying direction of the conveying device and the direction orthogonal to the conveying direction is variable,

ADVANTAGEOUS EFFECTS OF INVENTION

In at least one embodiment, the movement of the flux mist from the heating region to the cooling region can be prevented by the cooling gas blown off through the 2 nd plate of the cooling region. Thus, liquefaction of the flux mist in the cooling region is suppressed. The present invention is not limited to the effects described herein, and any of the effects described in the present disclosure may be used. The present application is not limited to the effects exemplified in the following description, and the contents thereof cannot be explained.

Drawings

Fig. 1 is a schematic view showing a conventional reflow apparatus to which the present invention can be applied.

Fig. 2 is a graph showing an example of a temperature profile at the time of reflow soldering.

Fig. 3 is a sectional view showing an example of the structure of one heating region of the reflow apparatus.

Fig. 4 is a schematic diagram showing a cross section of a reflow apparatus according to embodiment 1 of the present invention.

Fig. 5 is a plan view of an example of the heating flat plate, a plan view of an example of the cooling flat plate, and an enlarged cross-sectional view of the gas blowing pipe and the gas blowing pipe.

Fig. 6 is a front view of an example of the plate angle variable mechanism.

Fig. 7 is a schematic diagram for explaining embodiment 2 of the present invention.

Fig. 8 is a schematic diagram for explaining embodiment 3 of the present invention.

Fig. 9 is a schematic diagram for explaining embodiment 4 of the present invention.

Fig. 10 is a schematic diagram for explaining embodiment 5 of the present invention.

Description of the reference numerals

11 a feed port; 12 a delivery port; 14 a forced cooling unit; 15 an upper furnace body; 16. a blower 26; 18. 28 a heater; 19. 29, P heating the flat plate; 31 a conveyor belt; 35 a lower furnace body; q cooling the flat plate; and R gas is blown out of the pipe.

Detailed Description

The present invention will be described below with reference to embodiments. The following procedure is described.

< 1. an example of reflow soldering apparatus >

< 2 > embodiment 1

< 3 > embodiment 2

< 4 > embodiment 3

< 5 > embodiment 4

< 6 > embodiment 5

< 7. modification

In the following description, the scope of the present invention is not limited to the embodiments described below unless the gist of the present invention is particularly limited.

< 1. an example of reflow soldering apparatus >

Fig. 1 shows a schematic configuration of a conventional reflow soldering apparatus 101 to which the present invention can be applied. In fig. 1, a flux recovery device disposed outside the reflow furnace is not shown for convenience of explanation. An object to be heated having surface-mount electronic components mounted on both surfaces of a printed circuit board is placed on a conveyor belt and fed from a feed port 11 into a furnace body of a reflow soldering apparatus. The conveyor belt conveys the object to be heated in the direction of the arrow (left to right in fig. 1) at a predetermined speed, and the object to be heated is taken out from the outlet 12. The conveying direction of the conveyor belt is set to be a horizontal direction.

The reflow furnace is sequentially divided into nine zones from Z1 to Z9, for example, along a conveyance path from the inlet 11 to the outlet 12, and these zones Z1 to Z9 are arranged in series. Seven regions from the region Z1 to the region Z7 on the inlet side are heating regions, and two regions from the region Z8 and the region Z9 on the outlet side are cooling regions. The forced cooling unit 14 is provided in association with the cooling zone Z8 and the cooling zone Z9.

The plurality of zones Z1 to Z9 control the temperature of the object to be heated in accordance with the temperature profile during reflow soldering. Fig. 2 is a schematic diagram showing an example of a temperature curve. The horizontal axis represents time, and the vertical axis represents the surface temperature of an object to be heated, for example, a printed circuit board on which electronic components are mounted. The first section is the temperature increasing section R1 in which the temperature rises by heating, the next section is the preheating (preheating) section R2 in which the temperature is substantially constant, the next section is the main heating section R3, and the last section is the cooling section R4.

The temperature raising section R1 is a period of time during which the substrate is heated from room temperature to the preheating section R2 (e.g., 150 ℃ C. to 170 ℃ C.). The preheating section R2 is a period for isothermal heating, activating the flux, removing the oxide film on the surface of the electrode and the solder powder, and eliminating uneven heating of the printed circuit board. The main heating portion R3 (for example, the maximum temperature is 220 to 240 ℃) is a period during which the solder is melted and the joining is completed. In the main heating unit R3, the temperature needs to be raised until the temperature exceeds the melting temperature of the solder. Even if the solder passes through the preheating section R2, the main heating section R3 has a problem of uneven temperature rise, and therefore, the solder needs to be heated until the temperature exceeds the melting temperature of the solder. The final cooling portion R4 is a period during which the printed circuit board is rapidly cooled to form a solder composition.

In fig. 2, curve 1 represents the temperature profile of the lead-free solder. The temperature profile in the case of Sn — Pb eutectic solder is represented by curve 2. Since the melting point of the lead-free solder is higher than that of the eutectic solder, the set temperature in the preheating section R2 is higher than that of the eutectic solder.

In the reflow apparatus, the temperature control of the temperature raising section R1 in fig. 2 is mainly performed by the zone Z1 and the zone Z2. The temperature control of the preheating section R2 is mainly responsible for the zone Z3, the zone Z4, and the zone Z5. The temperature control of the main heating portion R3 is performed by the zone Z6 and the zone Z7. The temperature control of the cooling portion R4 is performed by the zone Z8 and the zone Z9.

Each of the heating zones Z1 to Z7 includes an upper furnace body 15 and a lower furnace body 35, and the upper furnace body 15 and the lower furnace body 35 include blowers. For example, hot air is blown from the upper furnace body 15 and the lower furnace body 35 in the zone Z1 to the object to be heated being conveyed.

An example of the heating device is described with reference to fig. 3. Fig. 3 shows a cross section obtained by cutting the region Z6 with a plane orthogonal to the conveyance direction, for example. In the opposing gap between the upper furnace body 15 and the lower furnace body 35, an object to be heated (also referred to as a workpiece) W having surface-mount electronic components mounted on both surfaces of a printed circuit board is placed on the conveyor 31 and conveyed. The upper furnace body 15 and the lower furnace body 35 are filled with, for example, nitrogen (N) as an atmosphere gas₂). The upper furnace body 15 and the lower furnace body 35 heat the object W by blowing hot air (heated atmosphere) to the object W. Further, infrared rays may be irradiated while hot air is blown.

The upper furnace body 15 includes: a blower 16, which is a structure such as a turbo fan; a heater 18 configured by folding a heating wire back a plurality of times; and a heating flat plate (heat storage member) 19 having a plurality of small holes through which hot air passes, the hot air passing through the small holes of the heating flat plate 19 being blown from above against the object W to be heated. The heating flat plate 19 is formed of, for example, an aluminum metal plate having a plurality of small holes formed therein.

The lower furnace body 35 also has the same structure as the upper furnace body 15 described above. Namely, comprising: a blower 26, which is a structure such as a turbo fan; a heater 28 configured by folding a heating line a plurality of times; and a heating flat plate (heat storage member) 29 having a plurality of small holes through which hot air passes. The hot air having passed through the small holes of the heating flat plate 29 is blown from below to the object W to be heated.

A flux recovery device 41 is provided for the upper furnace body 15. The flux recovery device 41 is provided on the back side of the upper furnace body 15 in a space surrounded by an outer plate, for example. A flux recovery device 61 is provided for the lower furnace body 35. The flux recovery device 61 is provided on the back side of the lower furnace body 35 in a space surrounded by the outer plate, for example. The flux recovery apparatus 41 includes: a radiator unit 42 for cooling the atmosphere gas led out from the upper furnace body 15; and a recovery container 43 for recovering the flux liquefied by cooling. Likewise, the flux recovery apparatus 61 includes: a radiator unit 62 for cooling the atmosphere gas led out from the lower furnace body 35; and a recovery container 63 for recovering the flux liquefied by cooling.

A hole serving as a lead-out port for leading out the atmosphere to the flux collection device 41 is provided in a path through which the hot air is circulated by the blower 16. The holes are arranged at the position with higher pressure in the furnace. A hole serving as an inlet for introducing the gas from the flux recovery unit 41 into the upper furnace body 15 is provided at a portion having a low pressure. In practice, these holes correspond to openings at one end of the

connection tubes

54 and 55. The

connection pipes

54 and 55 are connected to the connection pipe of the flux recovery apparatus 41 by hoses, not shown. In the lower furnace body 35, the atmosphere gas is also led out to the flux collection device 61 from a hole provided at a portion having a high pressure in the furnace, and the gas in which the flux component is reduced from the flux collection device 61 is led in from a hole provided at a portion having a low pressure in the furnace.

The

flux recovery devices

41 and 61 are provided in areas of the reflow apparatus where contamination of the atmosphere is large. However, the

flux recovery devices

41 and 61 may be disposed over the entire area of the reflow soldering apparatus.

The cooling zones Z8 and Z9 are different from the heating zones, have no heater 18 or heater 28, and are configured such that: cooling gas (N) is supplied by vertically arranged blowers₂Inert gas such as gas or air) is blown to the object W via the cooling plate. The cooling flat plate has a structure in which a plurality of small holes are formed in a metal plate such as aluminum.

Even when the flux collection device 41 and the flux collection device 61 are provided, the flux component cannot be completely removed, the flux mist moves to the cooling zones Z8 and Z9, the flux mist is cooled and liquefied in the cooling zones Z8 and Z9, and the problem that the flux adheres to the object to be heated due to dripping (dripping) or the like cannot be solved. The invention can effectively prevent the flux from adhering to the heated object.

< 2 > embodiment 1

Embodiment 1 of the present invention will be described with reference to fig. 4. A connection region Z78 as a connection portion is provided between the heating region Z7 and the cooling region Z8. Fig. 4 is a cross-sectional view obtained by cutting the heating zone Z7, the coupling zone Z78, and the cooling zone Z8 with a plane parallel to the conveying direction of the conveyor belt 31, and schematically shows the configuration of each zone.

In the heating zone Z7, hot air is blown to the upper surface and the lower surface of the object W to be heated as indicated by oblique arrows through the small holes of the heating plate P1 (the heating plate 19 in fig. 3) and the small holes of the heating plate P2 (the heating plate 29 in fig. 3) (simply referred to as the heating plate P when it is not necessary to distinguish between the heating plates). In the case where a plane formed by the conveying direction of the conveyor belt 31 and the direction orthogonal to the conveying direction (i.e., a plane parallel to the conveying surface is indicated hereinafter the same) is parallel to the heating plate P, the hot air is blown out in the direction (normal direction) perpendicular to the heating plate.

In cooling zone Z8, the cooling gas is blown toward the upper and lower surfaces of object W as indicated by arrows through the small holes of cooling plate Q1 and cooling plate Q2 (simply referred to as cooling plate Q when it is not necessary to distinguish the cooling plates), thereby cooling object W. When a plane formed by the conveying direction of the conveyor belt 31 and a direction orthogonal to the conveying direction is parallel to the cooling plate Q, the cooling gas is blown out in a direction (normal direction) perpendicular to the cooling plate Q.

In the coupling region Z78, gas blowing pipes R11, R12, R21, and R22 (simply referred to as gas blowing pipes R when there is no need to distinguish the respective gas blowing pipes) are arranged as blowing means. The gas blow-off pipe R has a plurality of small holes formed in an extending direction on a circumferential surface of a tubular member extending in a direction orthogonal to the conveying direction of the conveyor belt 31.

The gas discharge pipe R is supported to be rotatable with respect to the fixed base, and the discharge angle of the gas discharged from the orifice is variable. The gas can be air, N as an inert gas₂(nitrogen element), etc., and more preferably, an inert gas is used. In the example of fig. 4, the gas blowing pipes R11 and R21 are disposed to face each other with the conveyor belt 31 interposed therebetween, and the gas blowing pipes R12 and R22 are disposed to face each other with the conveyor belt 31 interposed therebetween. The respective outlets are set at relative rotational positions. In this case, the gas is blown out from the gas blow-out pipe R toward the conveyor belt 31 in a direction perpendicular to the conveyor belt 31 as indicated by an arrow.

Fig. 5 shows a configuration example of a part of a reflow soldering apparatus including a cooling plate Q (a in fig. 5), a heating plate P (B in fig. 5), and a gas blowing pipe R (C in fig. 5). The arrow indicates the conveying direction of the conveyor belt 31. The cooling plate Q and the heating plate P are each configured such that a plurality of small holes are formed in a metal plate. As shown in fig. 5D in an enlarged manner, the gas blowing pipe R has a metal tubular shape and is formed by arranging small holes R on the peripheral surface. The gas is blown out through the small hole r. Further, two or more rows of the small holes r may be formed in the peripheral surface, and the gas may be blown out from the two small holes r at different blowing angles.

Fig. 6 shows an example of the angle varying mechanism for heating the flat plate P. A mounting portion 71 is fixed to one end side of the heating plate P. Two

long holes

73a and 73b are formed in the fixed base portion 72. The

elongated holes

73a and 73b are formed in an arc shape so as to form a part of an arc. A lock pin 74a fixed to the mounting portion 71 is inserted into the elongated hole 73a, and a lock pin 74b fixed to the mounting portion 71 is inserted into the elongated hole 73 b.

As shown in the drawing, the heating plate P is held in a horizontal position in a state where the locking pins 74a, 74b are located at the lower ends of the

elongated holes

73a, 73 b. When the heating panel P is lifted upward by loosening the lock pins 74a and 74b from this state, the end of the heating panel P where the attachment portion 71 is not provided is rotated upward as shown by the broken line in fig. 6, and the heating panel P is tilted. The position of the heating panel P can be maintained by fastening the locking pins 74a, 74b at a desired position. Further, when the length of the

elongated holes

73a and 73b shown in fig. 6 is increased and the lock pins 73a and 73b can be displaced further downward, the heating plate P can be rotated to a position lower than the horizontal position. Fig. 6 shows the inclination angle varying mechanism of the heating plate P, but the same inclination angle varying mechanism is provided for the cooling plate Q.

The inclination of the heating plate P is defined at an angle with respect to a plane formed by the conveying direction of the conveyor belt 31 and a direction orthogonal to the conveying direction. The inclination of the heating plate P is defined, for example, in terms of the rotation angle of the heating plate P with respect to the horizontal plane. When the front and rear ends of the heating plate P are the front end close to the inlet port 11 and the rear end far from the inlet port 11, the state of the broken line shown in fig. 6 is a state where the front end is higher than the rear end when the arrow direction is the conveyance direction. The state is defined as rising. Conversely, a state in which the front end of the heating panel P is lower than the rear end is defined as descending. The tilt is defined similarly for the cooling plate Q.

In embodiment 1, the blowing direction of the gas can be changed by the gas blowing pipe R. For example, if the gas is blown toward the heating zone Z7 side obliquely with respect to the vertical direction, the flux mist can be suppressed from entering into the cooling zone Z8 together with the object W to be heated from the heating zone Z7, the amount of flux mist entering into the cooling zone Z8 can be reduced, and the amount of flux liquefied in the cooling zone Z8 can be reduced. Therefore, the flux liquefied in the cooling zone Z8 can be prevented from adhering to the object W.

< 3 > embodiment 2

Embodiment 2 of the present invention will be described with reference to fig. 7. As shown in fig. 7, in the heating zone Z7, the front end of the heating plate P1 rises and the front end of the heating plate P2 falls. As described above, the front end is defined as the end on the inlet side where the object W to be heated comes, and the rear end is defined as the end on the outlet side where the object W to be heated comes out. The same definition applies to the cooling plates Q1 and Q2. Therefore, the hot air blown to the object W by the heating flat plates P1 and P2 is blown toward the inlet side of the heating zone Z7 obliquely to the vertical direction. As a result, the flux mist can be suppressed from moving to the connection region Z78.

In the connection region Z78, the gas blowing pipe R blows the gas obliquely toward the outlet of the heating region Z7. As a result, the flux mist can be suppressed from moving to the connection region Z78, and the flux mist can be suppressed from moving to the cooling region Z8.

In the cooling zone Z8, the cooling plate Q1 is raised and the cooling plate Q2 is lowered. Therefore, the cooling gas blown to the object W through the cooling plates Q1, Q2 is blown toward the inlet side of the connecting region Z8 obliquely to the vertical direction. As a result, the flux mist can be suppressed from moving to the connection region Z8. In this way, according to embodiment 2, the heating flat plate P, the gas blow-off pipe R, and the cooling flat plate Q cooperate to suppress the flux mist from moving to the cooling zone Z8, and therefore the flux mist can be prevented from being liquefied in the cooling zone Z8 and adhering to the object W to be heated.

< 4 > embodiment 3

Embodiment 3 of the present invention will be described with reference to fig. 8. As shown in fig. 8, in heating zone Z7, heating plate P1 is lowered and heating plate P2 is raised. Therefore, the hot air blown to the object W to be heated by the heating flat plates P1, P2 is blown toward the outlet side of the heating zone Z7 obliquely to the vertical direction. As a result, the flux mist can be promoted to move to the connection region Z78.

In the coupling region Z78, the gas blowing pipe R blows the gas obliquely in the inlet direction of the cooling region Z8. As a result, the flux mist can be promoted to move to the cooling zone Z8.

In the cooling zone Z8, the cooling plate Q1 is lowered and the cooling plate Q2 is raised. Therefore, the cooling gas blown to the object W through the cooling plates Q1, Q2 is blown toward the outlet side of the cooling zone Z8 obliquely to the vertical direction. As a result, the flux mist can be promoted to move to the cooling zone Z8. In this manner, according to embodiment 3, the flux mist is promoted to pass through the connection region Z78 and the cooling region Z8 by the heating plate P, the gas-blowing pipe R, and the cooling plate Q cooperating with each other, so that the flux mist can be quickly moved to the flux removing device at the final stage or the exhaust system outside the furnace, and the influence of the flux mist can be prevented.

< 5 > embodiment 4

Embodiment 4 of the present invention will be described with reference to fig. 9. As shown in fig. 9, in heating zone Z7, heating plate P1 rises and heating plate P2 rises. Therefore, the hot air blown to the object W by the heating plate P1 is blown toward the inlet side of the heating zone Z7 obliquely with respect to the vertical direction, and the hot air blown to the object W by the heating plate P2 is blown toward the outlet side of the heating zone Z7 obliquely with respect to the vertical direction.

In the coupling region Z78, the gas blowing pipes R11 and R12 blow the gas obliquely toward the outlet of the heating region Z7, and the gas blowing pipes R21 and R22 blow the gas obliquely toward the inlet of the cooling region Z8.

In the cooling zone Z8, the cooling plate Q1 rises and the cooling plate Q2 rises. Therefore, the cooling gas blown toward the object W by the cooling plate Q1 is blown toward the inlet side of the cooling zone Z8 obliquely with respect to the vertical direction, and the cooling gas blown toward the object W by the cooling plate Q2 is blown toward the outlet side of the cooling zone Z8 obliquely with respect to the vertical direction.

< 6 > embodiment 5

Embodiment 5 of the present invention will be described with reference to fig. 10. As shown in fig. 10, in the heating zone Z7, the heating plate P1 rises and the heating plate P2 falls. Therefore, the hot air blown to the object W by the heating flat plates P1 and P2 is blown toward the inlet side of the heating zone Z7 obliquely to the vertical direction. As a result, the flux mist can be suppressed from moving to the connection region Z78.

In the connection region Z78, the gas blowing pipes R11 and R21 facing each other blow the gas obliquely toward the outlet of the heating region Z7. As a result, the flux mist can be suppressed from moving to the connection region Z78, and the flux mist can be suppressed from moving to the cooling region Z8. The gas blowing pipes R12 and R22 facing each other blow out the gas in the vertical direction.

In the cooling zone Z8, the cooling plate Q1 is raised and the cooling plate Q2 is lowered. Therefore, the cooling gas blown to the object W to be heated by the cooling flat plates Q1, Q2 is blown toward the inlet side of the cooling zone Z8 obliquely to the vertical direction. As a result, the flux mist can be suppressed from moving to the cooling zone Z8. In this manner, according to embodiment 5, the flux mist is prevented from moving to the cooling zone Z8 by the heating flat plate P, the gas blow-off pipe R, and the cooling flat plate Q cooperating with each other, and the flux mist is prevented from being liquefied in the cooling zone Z8 and adhering to the object W to be heated. Further, since the gas blown out from the gas blowing pipes R12 and R22 forms a gas curtain, the flux mist can be prevented from moving to the cooling zone Z8.

< 7. modification

While the embodiments of the present invention have been described above in detail, the present invention is not limited to the above embodiments, and various modifications can be made based on the technical idea of the present invention. For example, as the inclination angle varying mechanism of the heating plate P and the cooling plate Q, other mechanisms than the mechanism shown in fig. 6, such as a mechanism in which a rotary shaft is provided at the center of the plate, may be employed. The heating region on the front side of the cooling region is not limited to the region for heating the object W, and a region for conveying the object W after welding without heating the object W may be provided, and the above-described flat heating plate may be provided in this region. The gas blowing pipes are not limited to being disposed in the vertical direction of the conveyance surface, and may be disposed on both the left and right sides of the conveyance surface. In this case, the gas may be blown out from two sets of directions, i.e., the vertical direction and the left and right directions. The structures, methods, steps, shapes, materials, numerical values, and the like recited in the above embodiments are merely examples, and structures, methods, steps, shapes, materials, numerical values, and the like different from those described above may be used as necessary. The structures, methods, steps, shapes, materials, numerical values, and the like of the above embodiments can be combined with each other without departing from the spirit of the present invention.

Claims

1. A reflow soldering apparatus, comprising: a heating region having a furnace body for welding an object to be heated; and a cooling region for cooling the object to be heated after welding, the object to be heated being passed through the heating region and the cooling region by a conveyor,

a blow-off member for blowing gas to the object to be heated is disposed at a connecting portion between the heating zone and the cooling zone,

the angle at which the blowoff part blows off the gas with respect to the conveying direction of the conveying device is variable, and the blowoff part blows off the gas obliquely toward the inlet direction of the cooling area.

2. The reflow apparatus of claim 1,

the blowout part is a tubular member that is elongated in a direction orthogonal to the conveyance direction of the conveyance device and has a plurality of small holes formed in the circumferential surface in the elongated direction.

3. Reflow soldering apparatus in accordance with claim 2,

the tubular members include a 1 st tubular member and a 2 nd tubular member, and the 1 st tubular member and the 2 nd tubular member are disposed so as to face each other with a plane formed by a conveying direction of the conveying device and a direction orthogonal to the conveying direction interposed therebetween.

4. The reflow apparatus of claim 3,

the reflow soldering apparatus includes a plurality of the 1 st tubular member and a plurality of the 2 nd tubular member, and the blow-out angles of the 1 st tubular member and the 2 nd tubular member are variable.

5. A reflow soldering apparatus, comprising: a heating zone having a furnace body for welding by blowing hot air to an object to be heated; and a cooling region for cooling the welded object to be heated, and allowing the object to be heated to pass through the heating region and the cooling region by a conveyor,

the heating area is configured to blow hot air to the object to be heated through the plurality of small holes of the 1 st plate, the cooling area is configured to blow a cooling gas to the object to be heated through the plurality of small holes of the 2 nd plate,

an angle of the 1 st plate with respect to a plane formed by a conveying direction of the conveying device and a direction orthogonal to the conveying direction is variable, an angle of the 2 nd plate with respect to a plane formed by a conveying direction of the conveying device and a direction orthogonal to the conveying direction is variable,

the cooling gas blown by the 2 nd plate toward the object to be heated is blown toward the outlet side of the cooling area obliquely with respect to the vertical direction.

6. A reflow soldering apparatus, comprising: a heating zone having a furnace body for welding by blowing hot air to an object to be heated; and a cooling region for cooling the welded object to be heated, and allowing the object to be heated to pass through the heating region and the cooling region by a conveyor,

the angle at which the blow-out part blows out the gas with respect to the conveying direction of the conveying device is variable, and the gas is directed toward the heating region side obliquely with respect to the vertical direction,

7. Reflow apparatus in accordance with claim 1 or 6, wherein the gas is an inert gas.