CN107999918A - Reflow soldering apparatus - Google Patents
Reflow soldering apparatus Download PDFInfo
- Publication number
- CN107999918A CN107999918A CN201711009081.1A CN201711009081A CN107999918A CN 107999918 A CN107999918 A CN 107999918A CN 201711009081 A CN201711009081 A CN 201711009081A CN 107999918 A CN107999918 A CN 107999918A
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- China
- Prior art keywords
- heating
- region
- tablet
- heating object
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Abstract
The present invention relates to a kind of reflow soldering apparatus, it can prevent from the cooled region of reflow soldering apparatus solder flux spray film and drip to make the quality decline of heating object in heating object.The reflow soldering apparatus includes：Heating region, it has the furnace body welded to heating object；Cooled region, it cools down the heating object welded, heating object is set to pass through heating region and cooled region using conveying device, linking part between heating region and cooled region configures the blowout component that oriented heating object blows gas, and blowout component is variable relative to the angle of the conveying direction blow gas of conveying device.
Description
Technical field
The present invention relates to a kind of reflow soldering apparatus, and especially, being related to one kind can prevent liquefied solder flux from dropping to printing
Reflow soldering apparatus on the heating objects such as circuit substrate.
Background technology
Using there is following reflow soldering apparatus：Solder composition is supplied for electronic component or tellite in advance,
And tellite is conveyed in reflow soldering using conveyer belt.Reflow soldering apparatus include conveying heating object conveyer belt with
And the reflow soldering main body by conveyer belt supply heating object.Reflow soldering is for example along Zi feeding mouth to the conveying for sending out mouth
Path is divided into multiple regions in advance, these multiple regions are in that shape in upright arrangement arranges.Multiple regions have heating according to its function
The effect of region, cooled region etc..
Solder composition contains such as powder solder, solder flux.Solder flux contains the components such as rosin, can prevent from removing and welding
The oxide-film of the metal surface connect and when being welded due to being reoxidized caused by heating, have and reduce the surface tension of solder simultaneously
Make the effect that wetability is good.By heating, which gasifies and is full of in reflow soldering.The solder flux of gasification is known as solder flux
Mist.
By substrate self-heating region to cooled region convey when, solder flux mist and heating object are brought into cooled region together.
Solder flux mist is easy to be attached to the relatively low position of temperature, if solder flux mist is cooled down in cooled region, is attached to cooling tablet.Sometimes weld
Agent drips from the position adhered to and is attached to the upper surface of heating object, damages the quality (performance) of heating object.
Prior art literature
Patent document
Patent document 1：No. 3384584 publications of Japanese Patent Publication No.
The content of the invention
Problems to be solved by the invention
Describe in patent document 1 such as lower structure：In jet type welding apparatus, solder flux mist adheres to, is heavy in order to prevent
Product is in the indoor inner wall of chamber and is attached to heating object, and is arranged on blowout non-active gas in the backward chamber of jet flow welding
(such as N2Gas) suction inlet and suction outlet.However, patent document 1 is jet type welding apparatus, include heating for solution
In the reflow soldering apparatus of region and cooled region, the problem of being produced because of the attachment of the solder flux mist in cooled region, is not remembered
Carry or enlighten.
Therefore, it is an object of the invention to provide the solder flux in a kind of cooled region that can be prevented due to reflow soldering apparatus
The reflow soldering apparatus of the quality decline of heating object caused by the dripping of mist.
The solution used to solve the problem
The present invention is a kind of reflow soldering apparatus, it includes：Heating region, it has the stove welded to heating object
Body；And cooled region, it is used to cool down the heating object welded, heating object is passed through heating zone using conveying device
Domain and cooled region, wherein,
Linking part between heating region and cooled region configures the blowout component that oriented heating object blows gas,
It is variable that component, which is blown out, relative to the angle of the conveying direction blow gas of conveying device.
The present invention is a kind of reflow soldering apparatus, it includes：Heating region, its have by heating object is blowed hot wind come
The furnace body welded；And cooled region, it cools down the heating object welded, leads to heating object using conveying device
Heating region and cooled region are crossed, wherein,
Heating region becomes the structure for making hot wind pass through multiple apertures of the 1st tablet to blow to heating object, cooling zone
Domain become make cooling with gas by multiple apertures of the 2nd tablet and the structure that is blowed to heating object,
The angle for the plane that 2nd tablet is formed relative to the conveying direction by conveying device and the direction orthogonal with conveying direction
Degree is variable.
The present invention is a kind of reflow soldering apparatus, it includes：Heating region, its have by heating object blow hot wind come
The furnace body welded；And cooled region, it cools down the heating object welded, leads to heating object using conveying device
Heating region and cooled region are crossed, wherein,
Heating region becomes the structure for making hot wind pass through multiple apertures of the 1st tablet to blow to heating object, cooling zone
Domain become make cooling with gas by multiple apertures of the 2nd tablet and the structure that is blowed to heating object,
The angle for the plane that 1st tablet is formed relative to the conveying direction by conveying device and the direction orthogonal with conveying direction
Degree is variable.
The present invention is a kind of reflow soldering apparatus, it includes：Heating region, its have by heating object blow hot wind come
The furnace body welded；And cooled region, it cools down the heating object welded, leads to heating object using conveying device
Heating region and cooled region are crossed, wherein,
Heating region becomes the structure for making hot wind pass through multiple apertures of the 1st tablet to blow to heating object, cooling zone
Domain become make cooling with gas by multiple apertures of the 2nd tablet and the structure that is blowed to heating object,
Linking part between heating region and cooled region configures the blowout component that oriented heating object blows gas,
Blow out component relative to the angle of the conveying direction blow gas of conveying device be it is variable,
The angle for the plane that 1st tablet is formed relative to the conveying direction by conveying device and the direction orthogonal with conveying direction
Degree be it is variable,
The angle for the plane that 2nd tablet is formed relative to the conveying direction by conveying device and the direction orthogonal with conveying direction
Degree is variable.
The effect of invention
Using at least one embodiment, can utilize the cooling that the 2nd tablet by cooled region is blown out with gas come
Prevent movement of the solder flux mist self-heating region to cooled region.Therefore, it is suppressed that the liquefaction of the solder flux mist in cooled region.Separately
Outside, the effect recorded here or any effect described in the disclosure are not necessarily limited to.In addition, it cannot utilize
The effect exemplified in illustrating below is defined and explains to present context.
Brief description of the drawings
Fig. 1 is the schematic diagram for representing to be applicable in the outline of the conventional reflow soldering apparatus of the present invention.
Fig. 2 is the curve map of the example of temperature curve when representing reflow soldering.
Fig. 3 is the sectional view of an example of the structure for a heating region for representing reflow soldering apparatus.
Fig. 4 is the schematic diagram of the outline of the section for the reflow soldering apparatus for representing the 1st embodiment for illustrating the present invention.
Fig. 5 is the top view for an example for heating tablet, the top view of an example for cooling down tablet, gas discharge pipe
And the amplification view of gas discharge pipe.
Fig. 6 is the front view of an example of plate angular changeable mechanism.
Fig. 7 is the schematic diagram for illustrating the 2nd embodiment of the present invention.
Fig. 8 is the schematic diagram for illustrating the 3rd embodiment of the present invention.
Fig. 9 is the schematic diagram for illustrating the 4th embodiment of the present invention.
Figure 10 is the schematic diagram for illustrating the 5th embodiment of the present invention.
Description of reference numerals
11 are sent into mouth；12 send out mouth；14 force cooling unit；15 upper furnace bodies；16th, 26 air blower；18th, 28 heater；
19th, 29, P heating tablet；31 conveyer belts；35 lower volumes；Q cools down tablet；R gas discharge pipes.
Embodiment
Hereinafter, the present invention is illustrated for embodiment.In addition, illustrated according to following order.
One example ＞ of 1. reflow soldering apparatus of ＜
The 1st embodiment ＞ of ＜ 2.
The 2nd embodiment ＞ of ＜ 3.
The 3rd embodiment ＞ of ＜ 4.
The 4th embodiment ＞ of ＜ 5.
The 5th embodiment ＞ of ＜ 6.
7. variation ＞ of ＜
In addition, an embodiment described below is currently preferred concrete example, addition of technically preferable each
Kind limits, still, in the following description, as long as no the record for the purport for especially limiting the present invention, the scope of the present invention
Just it is not limited to these embodiments.
One example ＞ of 1. reflow soldering apparatus of ＜
Fig. 1 shows the schematic configuration for the conventional reflow soldering apparatus 101 that can be applicable in the present invention.In Fig. 1, for the ease of
Illustrate, eliminate the diagram for the flux collection system being configured at outside reflow soldering.It will be equipped with the two sides of tellite
Surface installation is placed on conveyer belt with the heating object of electronic component, is sent from mouth 11 is sent into the furnace body of reflow soldering apparatus
Enter.Conveyer belt conveys heating object with fixing speed along the direction of arrow (direction in Fig. 1 from left to right), and heating object is sent certainly
Take out outlet 12.The conveying direction of conveyer belt is set to horizontal direction.
Along Zi mouth 11 is sent into the transport path for sending out mouth 12, reflow soldering is divided into for example from Z1 to Z9 successively
Nine regions, these regions Z1~region Z9 are in that shape in upright arrangement arranges.This seven regions of region Z1~region Z7 from entrance side
For heating region, the two regions of region Z8 and region Z9 by outlet side are cooled region.With cooled region Z8 and cooling zone
Domain Z9 is provided with association forces cooling unit 14.
Temperature curve when above-mentioned multiple regions Z1~region Z9 is according to reflow soldering controls the temperature of heating object.
Fig. 2 represents the outline of an example of temperature curve.Transverse axis represents the time, and the longitudinal axis represents that heating object is for example provided with electronics member
The surface temperature of the tellite of part.Initial section is the heating portion R1 risen by heating and temperature, next area
Between be temperature constant preheating (preheating) portion R2, next section is main heating part R3, and last section is cooling end
R4。
Heating portion R1 is during substrate is heated to preheating portion R2 (such as 150 DEG C~170 DEG C) from room temperature.Preheating
Portion R2 is for carrying out isothermal heating, the oxide-film for making flux activity, removing electrode and solder powder surface, in addition eliminating printing
The heating non-uniform period of circuit substrate.Main heating part R3 (such as maximum temperature is 220 DEG C~240 DEG C) be melt solder simultaneously
During completing engagement., it is necessary to heat up untill temperature exceedes the melting temperature of solder in main heating part R3.Even if
By preheating portion R2, there is also the non-uniform problem of temperature rising by main heating part R3, it is therefore desirable to is heated until temperature
Untill melting temperature more than solder.Last cooling end R4 is rapid cooling tellite to form the phase of solder composition
Between.
In fig. 2, curve 1 represents the temperature curve of lead-free solder.Temperature curve in the case of Sn-Pb eutectic solders by
Curve 2 represents.The fusing point of lead-free solder is higher than the fusing point of eutectic solder, therefore the design temperature in preheating portion R2 is welded than eutectic
The fusing point of material is high.
In reflow soldering apparatus, the temperature control of the heating portion R1 in Fig. 2 is mainly responsible for by region Z1 and region Z2.Pre-add
The temperature control of hot portion R2 is mainly responsible for by region Z3, region Z4 and region Z5.The temperature control of main heating part R3 is by region
Z6 and region Z7 are responsible for.The temperature control of cooling end R4 is responsible for by region Z8 and region Z9.
Heating region Z1~region Z7 has upper furnace body 15 and a lower volume 35 respectively, the upper furnace body 15 and under
Portion's furnace body 35 has air blower respectively.Such as from the upper furnace body 15 of region Z1 and lower volume 35 to the heating object of conveying
Blow hot wind.
Illustrate heating unit example with reference to Fig. 3.Figure 3 illustrates for example utilize the face orthogonal with conveying direction
By section obtained by the Z6 cuttings of region., will be in tellite in the relative gap of upper furnace body 15 and lower volume 35
Two sides be equipped with surface installation and be placed on conveyer belt 31 and carried out defeated with the heating object of electronic component (also referred to as workpiece) W
Send.Such as nitrogen (the N as atmosphere gas is full of in upper furnace body 15 and in lower volume 352).Upper furnace body 15 and
Lower volume 35 sprays hot wind (the atmosphere gas after heating) to be heated to heating object W relative to heating object W.Separately
Outside, infrared ray can also be irradiated while hot wind is blowed.
Upper furnace body 15 includes：Air blower 16, it is the structure of such as turbofan；Heater 18, it is by repeatedly rolling over
Return heater wire and form；And heating tablet (accumulation of heat component) 19, its multiple aperture passed through with hot wind supply, has passed through heating
The hot wind of the aperture of tablet 19 is blowed from upside relative to heating object W.It is the shape for example on the metallic plate of aluminium to heat tablet 19
Into the structure for thering are multiple apertures to form.
Lower volume 35 also has the structure same with above-mentioned upper furnace body 15.That is, including：Air blower 26, it is example
Such as the structure of turbofan；Heater 28, it is formed by repeatedly turning back heater wire；And heating tablet (accumulation of heat component)
29, its multiple aperture passed through with hot wind supply.The hot wind of the aperture of heating tablet 29 will have been passed through from downside relative to being added
Hot thing W is blowed.
For upper furnace body 15, flux collection system 41 is set.Flux collection system 41 is for example in the space surrounded by outside plate
Inside it is arranged at the rear side of upper furnace body 15.For lower volume 35, flux collection system 61 is set.Flux collection system 61
The rear side of lower volume 35 is such as arranged in the space surrounded by outside plate.Flux collection system 41 includes：Radiator portion 42,
It is used to make from atmosphere gas cooling derived from upper furnace body 15；Returnable 43, it is used to recycle by cooling down and liquefied
Solder flux.Similarly, flux collection system 61 includes：Radiator portion 62, it is used to make from atmosphere gas derived from lower volume 35
Cooling；Returnable 63, it is used to recycle by cooling down and liquefied solder flux.
It is provided with and is used as atmosphere gas to be filled to flux restoring in the path for making hot air circulation by air blower 16
Put the hole of export mouth derived from 41.Hole is arranged at the higher position of furnace pressure.Be provided with the relatively low position of pressure as with
In the hole for the introducing port for importing the gas from flux collection system 41 into upper furnace body 15.In fact, this some holes and company
Connect corresponding with the opening of 55 respective one end of pipe 54 and connecting pipe.Using the hose of illustration omitted respectively by each connection
It is connected with pipe 54,55 with the connecting pipe of flux collection system 41.In lower volume 35, atmosphere gas is also set to be arranged on stove certainly
The hole at the higher position of interior pressure is exported to flux collection system 61, and reduces the flux constituent from flux collection system 61
Gas from be arranged at the relatively low position of furnace pressure hole import.
In addition, the pollution that flux collection system 41,61 is arranged at the atmosphere gas in each region of reflow soldering apparatus is larger
Region.But it is also possible to flux collection system 41,61 is configured to the whole region of reflow soldering apparatus.
Cooled region Z8, Z9 are different from heating region, are the structures without heater 18 and heater 28, and form
For：By air blower setting up and down by cooling gas (N2The non-active gas such as gas or air) via cooling tablet to
Heating object W is blowed.It is the structure formed on the metallic plate of aluminium etc. formed with multiple apertures to cool down tablet.
In the case of flux collection system 41 and flux collection system 61 is provided with, can not fully it remove
Flux constituent, solder flux mist are moved to cooled region Z8, Z9, and solder flux mist is cooled and liquefies in cooled region Z8, Z9, no
The problem of solder flux is attached on heating object due to dripping reasons such as (drippages) can be eliminated.The present invention can effectively prevent
Only solder flux is attached to heating object.
The 1st embodiment ＞ of ＜ 2.
Illustrate the 1st embodiment of the present invention with reference to Fig. 4.It is provided as between heating region Z7 and cooled region Z8
The connecting area Z78 of linking part.Fig. 4 is to utilize the face parallel with the conveying direction of conveyer belt 31 by heating region Z7, link area
Sectional view obtained by domain Z78 and cooled region Z8 cuttings, and outline the structure in each region.
In heating region Z7, hot wind is by heating the aperture of tablet P1 (the heating tablet 19 in Fig. 3) and heating tablet
The aperture of P2 (the heating tablet 29 in Fig. 3) (the referred to as heating tablet P in the case of without the need to distinguish each heating tablet)
And blowed as shown in oblique line arrow to the upper surface and lower surface of heating object W.In the conveying direction by conveyer belt 31 and
The plane that the direction orthogonal with conveying direction is formed (that is, represents the face parallel with conveyor surface.It is same as below) put down with heating tablet P
In the case of row, hot wind is blown out along the direction (normal direction) vertical with heating tablet.
In cooled region Z8, cooling gas is by cooling down tablet Q1 and cooling tablet Q2 (without the need to distinguish each
Cool down tablet in the case of referred to as cooling tablet Q) aperture and as shown by arrows to the upper surface of heating object W and following table
Face blows, and heating object W is cooled down.In the plane that the conveying direction by conveyer belt 31 and the direction orthogonal with conveying direction are formed
In the case of parallel with cooling tablet Q, cooling gas is blown out along the direction (normal direction) vertical with cooling tablet Q.
It is configured with connecting area Z78 and (is being not required as gas discharge pipe R11, R12, R21, R22 of blowout component
Gas discharge pipe R is referred to as in the case of distinguishing each gas discharge pipe).For gas discharge pipe R, along with conveying
Along extending direction formed with multiple apertures on side face with the extended tubular element in the orthogonal direction of 31 conveying direction.
Gas discharge pipe R is supported to rotate freely relative to fixed base portion, makes the blowout of the gas from aperture blowout
Variable-angle.Gas can use air, the N as non-active gas2(nitrogen) etc., more preferably using non-active gas.
In the example in fig. 4, gas discharge pipe R11 and gas discharge pipe R21 are oppositely disposed across conveyer belt 31, gas discharge pipe R12
And gas discharge pipe R22 is oppositely disposed across conveyer belt 31.Also, respective blow-off outlet is set to be in opposite rotation position.
In this case, gas is blown out along perpendicular to the direction of conveyer belt 31 to conveyer belt 31 as shown by arrows from gas discharge pipe R.
Illustrate in Figure 5 by cooling tablet Q (A of Fig. 5), heating tablet P (B of Fig. 5) and gas discharge pipe R (Fig. 5
C) form reflow soldering apparatus a part configuration example.Arrow represents the conveying direction of conveyer belt 31.Cool down tablet Q and add
Flat plate heat P is the structure on a metal plate formed with multiple apertures respectively.D amplifications such as Fig. 5 represent, gas discharge pipe R
It is the tubular form of metal, arranges aperture r on side face and formed.Gas is blown out by aperture r.Alternatively, it is also possible in week
Form the aperture r of the two row above on face, while from the aperture r at two positions with different blowout angle blow gas.
Fig. 6 illustrates an example of the angle variable mechanism of heating tablet P.It is fixed with the one end of heating tablet P
Mounting portion 71.In fixed base portion 72 formed with two slot hole 73a and slot hole 73b.Slot hole 73a and 73b is to form the one of circular arc
Partial mode is formed as arcuation.Inserted with the stop pin 74a being fixed together with mounting portion 71 in slot hole 73a, in length
Inserted with the stop pin 74b being fixed together with mounting portion 71 in the 73b of hole.
As shown in the figure, in the state of stop pin 74a, 74b are located at the lower end of slot hole 73a, 73b, heating tablet P is held in
Horizontal level.If stop pin 74a, 74b relax from the state and heating tablet P is lifted upward, such as the dotted line in Fig. 6
Shown, the end for being not provided with mounting portion 71 of heating tablet P rotates upward, and heating tablet P is tilted.By in desired position
Put and fasten stop pin 74a, 74b, so as to keep the position of heating tablet P.If in addition, make the slot hole shown in Fig. 6
The length of 73a, 73b and stop pin 73a, 73b can further displacement downwards, then can make heating tablet P rotate to
Than the position of horizontal level on the lower.What Fig. 6 was represented is the angle of inclination mechanism for heating tablet P, but for cooling down tablet Q
It is also equipped with same angle of inclination mechanism.
The inclination for heating tablet P is with relative to the conveying direction by conveyer belt 31 and the direction shape orthogonal with conveying direction
Into the angle of plane limit.Such as limit inclining for heating tablet P to heat the anglecs of rotation of tablet P with respect to the horizontal plane
Tiltedly.For heating the front and rear end of tablet P, if the end that will be close to be sent into mouth 11 will be far from being sent into mouth 11 as front end
End as rear end, then the state of the dotted line shown in Fig. 6 be the direction of arrow as conveying direction when the front end state higher than rear end.
The state is defined as rising.On the contrary the front end for the heating tablet P state lower than rear end is defined as declining.It is flat for cooling down
Plate Q similarly defines inclination.
In the 1st embodiment, gas discharge pipe R can be utilized to make the blow-off direction of gas variable.If such as by gas
Blow out relative to inclined vertically, then can suppress together with heating object W by self-heating area towards heating region Z7 sides
Domain Z7 bring into as cooled region Z8, the entrance of solder flux mist, reduce the amount into the solder flux mist of cooled region Z8, reduce
The amount of liquefied solder flux in cooled region Z8.Therefore, it is possible to prevent liquefied solder flux is attached in cooled region Z8 from being added
The problem of on hot thing W.
The 2nd embodiment ＞ of ＜ 3.
Illustrate the 2nd embodiment of the present invention with reference to Fig. 7.As shown in fig. 7, in heating region Z7, tablet P1 is heated
Front end rise, the front end of heating tablet P2 declines.In addition, as described above, front end is defined as to the entrance of heating object W arrivals
Rear end, is defined as the end for the outlet side that heating object W goes out by the end of side.This definition for cooling tablet Q1, Q2 be also
Same.Therefore, the hot wind blowed by heating tablet P1, P2 to heating object W relative to inclined vertically towards plus
The entrance side of thermal region Z7 blows.As a result, it is possible to suppress solder flux mist to move to connecting area Z78.
In addition, in connecting area Z78, gas discharge pipe R obliquely blows gas to the export direction of heating region Z7
Go out.As a result, it is possible to suppress solder flux mist to move to connecting area Z78, while solder flux mist can be suppressed and moved to cooled region Z8.
In addition, in cooled region Z8, cooling tablet Q1 rises, and cooling tablet Q2 declines.Therefore, by cooling down tablet
The cooling gas phase that Q1, Q2 are blowed to heating object W is side-blown for inclined vertically towards the entrance of connecting area Z8
Send.As a result, it is possible to suppress solder flux mist to move to connecting area Z8.Like this, using the 2nd embodiment, heating tablet P,
Gas discharge pipe R and cooling tablet Q carries out cooperation and is moved so as to suppress solder flux mist to cooled region Z8, therefore can prevent from welding
Agent mist is liquefied in cooled region Z8 so as to be attached to heating object W.
The 3rd embodiment ＞ of ＜ 4.
Illustrate the 3rd embodiment of the present invention with reference to Fig. 8.As shown in figure 8, in heating region Z7, tablet P1 is heated
Decline, heating tablet P2 rises.Therefore, the hot wind blowed by heating tablet P1, P2 to heating object W is relative to vertical direction
Obliquely blowed towards the outlet side of heating region Z7.As a result, it is possible to promote solder flux mist to be moved to connecting area Z78.
In addition, in connecting area Z78, gas discharge pipe R obliquely blows gas to the Way in of cooled region Z8
Go out.As a result, it is possible to promote solder flux mist to be moved to cooled region Z8.
In addition, in cooled region Z8, cooling tablet Q1 declines, and cooling tablet Q2 rises.Therefore, by cooling down tablet
The cooling gas phase that Q1, Q2 are blowed to heating object W is side-blown for inclined vertically towards the outlet of cooled region Z8
Send.As a result, it is possible to promote solder flux mist to be moved to cooled region Z8.Like this, using the 3rd embodiment, heating tablet P,
Gas discharge pipe R and cooling tablet Q carry out cooperation so as to promote solder flux mist by connecting area Z78 and cooled region Z8,
Therefore exhaust system movement of the solder flux mist promptly to outside the solder flux removing device or stove of final stage can be made, can be prevented
The influence as caused by solder flux mist.
The 4th embodiment ＞ of ＜ 5.
Illustrate the 4th embodiment of the present invention with reference to Fig. 9.As shown in figure 9, in heating region Z7, tablet P1 is heated
Rise, heating tablet P2 rises.Therefore, inclined by heating tablet P1 to the heating object W hot winds blowed relative to vertical direction
Tiltedly blowed towards the entrance side of heating region Z7, the hot wind blowed to heating object W by heating tablet P2 is relative to vertical
Direction is obliquely blowed towards the outlet side of heating region Z7.
In addition, in connecting area Z78, gas discharge pipe R11, R12 is by the gas obliquely outlet to heating region Z7
Direction is blown out, and gas discharge pipe R21, R22 obliquely blows out gas to the Way in of cooled region Z8.
In addition, in cooled region Z8, cooling tablet Q1 rises, and cooling tablet Q2 rises.Therefore, by cooling down tablet Q1
Blowed for inclined vertically, led to towards the entrance side of cooled region Z8 with gas phase to the cooling that heating object W is blowed
The cooling gas phase that supercooling tablet Q2 is blowed to heating object W going out towards cooled region Z8 for inclined vertically
Mouth is side-blown to be sent.
The 5th embodiment ＞ of ＜ 6.
Illustrate the 5th embodiment of the present invention with reference to Figure 10.As shown in Figure 10, in heating region Z7, tablet is heated
P1 rises, and heating tablet P2 declines.Therefore, the hot wind blowed by heating tablet P1, P2 to heating object W is relative to Vertical Square
To obliquely being blowed towards the entrance side of heating region Z7.As a result, it is possible to suppress solder flux mist to move to connecting area Z78.
In addition, in connecting area Z78, opposite gas discharge pipe R11, R21 is by outlet of the gas to heating region Z7
Direction is obliquely blown out.As a result, it is possible to suppress solder flux mist to move to connecting area Z78, while solder flux mist can be suppressed to cold
But region Z8 is moved.In addition, opposite gas discharge pipe R12, R22 blows out gas direction.
In addition, in cooled region Z8, cooling tablet Q1 rises, and cooling tablet Q2 declines.Therefore, by cooling down tablet
The cooling gas phase that Q1, Q2 are blowed to heating object W is side-blown for inclined vertically towards the entrance of cooled region Z8
Send.As a result, it is possible to suppress solder flux mist to move to cooled region Z8.Like this, using the 5th embodiment, heating tablet P,
Gas discharge pipe R and cooling tablet Q carries out cooperation and is moved so as to suppress solder flux mist to cooled region Z8, therefore can prevent from welding
Agent mist is liquefied in cooled region Z8 so as to be attached to heating object W.In addition, the gas shape blown out by gas discharge pipe R12, R22
Into air curtain, therefore it can prevent solder flux mist from being moved to cooled region Z8.
7. variation ＞ of ＜
More than, specifically understand embodiments of the present invention, but the present invention is not limited to above-mentioned each embodiment,
Various modifications can be carried out based on technological thought of the invention.Such as can as the angle of inclination of heating tablet P and cooling tablet Q
Become mechanism, can be that the central part in tablet in addition to the mechanism shown in Fig. 6 sets other structures such as structure of rotation axis.
In addition, the heating region of the front side as cooled region, is not limited to the region to heating object W heating, it is right to set
The region that heating object W after welding is heated and conveyed, and above-mentioned heating tablet is set in the region.In addition,
Gas discharge pipe is not limited to be configured at the situation of the above-below direction of conveyor surface, can also be configured at the left and right sides of conveyor surface.
In this case, can also be from two prescriptions in above-below direction and left and right sides direction to blow gas.In addition, in above-mentioned reality
Apply the only example such as the structure enumerated in mode, method, process, shape, material and numerical value, can also in requisition for and
Use structure, method, process, shape, material and numerical value being different from etc..In addition, the structure of above-mentioned embodiment, side
Method, process, shape, material and numerical value etc. can be just combined with each other without departing from the purport of the present invention.
Claims (8)
1. a kind of reflow soldering apparatus, it includes：Heating region, it has the furnace body welded to heating object；And cooling
Region, it is used to cool down the heating object welded, heating object is passed through the heating region using conveying device
And the cooled region, wherein,
Linking part between the heating region and the cooled region configures the oriented heating object and blows gas
Blow out component,
The blowout component is variable relative to the angle that the conveying direction of the conveying device blows out the gas.
2. reflow soldering apparatus according to claim 1, wherein,
The blowout component is extended along the direction orthogonal with the conveying direction of the conveying device and on side face along prolonging
Tubular element of the length direction formed with multiple apertures.
3. reflow soldering apparatus according to claim 2, wherein,
The tubular element includes the 1st tubular element and the 2nd tubular element, the 1st tubular element and the 2nd tubular element
Plane is formed across the conveying direction by the conveying device and the direction orthogonal with the conveying direction to be arranged as opposed to.
4. reflow soldering apparatus according to claim 3, wherein,
The reflow soldering apparatus includes multiple 1st tubular elements and multiple 2nd tubular elements, the 1st tubulose structure
Part and the respective blowout angle of the 2nd tubular element are variable.
5. a kind of reflow soldering apparatus, it includes：Heating region, it has by heating object blowing hot wind to be welded
Furnace body；And cooled region, it cools down the heating object welded, passes through the heating object using conveying device
The heating region and the cooled region, wherein,
The heating region becomes the structure for making hot wind pass through multiple apertures of the 1st tablet to blow to the heating object, institute
State cooled region become make cooling with gas by multiple apertures of the 2nd tablet and the structure that is blowed to the heating object,
What the 2nd tablet was formed relative to the conveying direction by the conveying device and the direction orthogonal with the conveying direction
The angle of plane is variable.
6. a kind of reflow soldering apparatus, it includes：Heating region, it has by heating object blowing hot wind to be welded
Furnace body；And cooled region, it cools down the heating object welded, passes through the heating object using conveying device
The heating region and the cooled region, wherein,
The heating region becomes the structure for making hot wind pass through multiple apertures of the 1st tablet to blow to the heating object, institute
State cooled region become make cooling with gas by multiple apertures of the 2nd tablet and the structure that is blowed to the heating object,
What the 1st tablet was formed relative to the conveying direction by the conveying device and the direction orthogonal with the conveying direction
The angle of plane is variable.
7. a kind of reflow soldering apparatus, it includes：Heating region, it has by heating object blowing hot wind to be welded
Furnace body；And cooled region, it cools down the heating object welded, passes through the heating object using conveying device
The heating region and the cooled region, wherein,
The heating region becomes the structure for making hot wind pass through multiple apertures of the 1st tablet to blow to the heating object, institute
State cooled region become make cooling with gas by multiple apertures of the 2nd tablet and the structure that is blowed to the heating object,
Linking part between the heating region and the cooled region configures the oriented heating object and blows gas
Blow out component,
The blowout component relative to the conveying direction of the conveying device blow out the gas angle be it is variable,
What the 1st tablet was formed relative to the conveying direction by the conveying device and the direction orthogonal with the conveying direction
The angle of plane be it is variable,
What the 2nd tablet was formed relative to the conveying direction by the conveying device and the direction orthogonal with the conveying direction
The angle of plane is variable.
8. the reflow soldering apparatus according to claim 1 or 7, wherein, the gas is non-active gas.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-211698 | 2016-10-28 | ||
| JP2016211698A JP6502910B2 (en) | 2016-10-28 | 2016-10-28 | Reflow device |
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| Publication Number | Publication Date |
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| CN107999918A true CN107999918A (en) | 2018-05-08 |
| CN107999918B CN107999918B (en) | 2022-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711009081.1A Active CN107999918B (en) | 2016-10-28 | 2017-10-25 | Reflow soldering device |
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| CN (1) | CN107999918B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023200611A1 (en) * | 2022-04-12 | 2023-10-19 | Illinois Tool Works Inc. | Furnace chamber |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7241286B2 (en) | 2018-06-27 | 2023-03-17 | パナソニックＩｐマネジメント株式会社 | Reflow oven and soldering method |
| JP7066655B2 (en) * | 2019-04-24 | 2022-05-13 | 株式会社タムラ製作所 | Transport heating device |
| JP2022024892A (en) * | 2020-07-28 | 2022-02-09 | 富士フイルムビジネスイノベーション株式会社 | Heating device and image formation device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107999918B (en) | 2022-01-11 |
| JP6502910B2 (en) | 2019-04-17 |
| JP2018069290A (en) | 2018-05-10 |
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