JPH0648751B2 - Phenolic resin single-sided metal foil laminated board - Google Patents
Phenolic resin single-sided metal foil laminated boardInfo
- Publication number
- JPH0648751B2 JPH0648751B2 JP19543889A JP19543889A JPH0648751B2 JP H0648751 B2 JPH0648751 B2 JP H0648751B2 JP 19543889 A JP19543889 A JP 19543889A JP 19543889 A JP19543889 A JP 19543889A JP H0648751 B2 JPH0648751 B2 JP H0648751B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- sided metal
- clad laminate
- kraft paper
- phenol resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、印刷回路板用のフェノール樹脂片面金属箔張
り積層板に関する。殊に、印刷回路板の製造工程で加熱
処理を伴ない、回路板表面に絶縁のためのコートをもた
ないか、あってもその形成が加熱処理後に行なわれるよ
うな印刷回路板用に適した片面金属箔張り積層板に関す
る。Description: FIELD OF THE INVENTION The present invention relates to a phenolic resin single-sided metal foil-clad laminate for printed circuit boards. Especially suitable for printed circuit boards that do not have a coating for insulation on the surface of the circuit board due to heat treatment in the manufacturing process of the printed circuit board, or even if it is formed after the heat treatment. And a single-sided metal foil-clad laminate.
従来の技術 フェノール樹脂銅張積層板は、民生用電子機器分野に印
刷回路板用として広く用いられている。そして、近年の
電子部品の高機能化、高密度化が進むにつれ、回路板製
造工程中のそり、ねじれ抑制の要求が益々厳しくなって
いる。2. Description of the Related Art Phenolic resin copper-clad laminates are widely used for printed circuit boards in the field of consumer electronic devices. As the electronic parts have become highly functional and have a high density in recent years, demands for suppressing warpage and twist during the circuit board manufacturing process have become more and more severe.
特に、片面印刷回路板は、厚さ方向の構成が非対称であ
ることからそり、ねじれが発生し易い。例えば、スルー
ホールの形成を銀塗料の充填によって行なうような場合
には、そのための加熱処理により基板にそり、ねじれが
発生し、回路板製造工程、部品組立工程の際、支障をき
たす。さらに高密度化への対応が難かしい。In particular, a single-sided printed circuit board is liable to warp due to its asymmetrical structure in the thickness direction. For example, when the through hole is formed by filling with silver paint, the heat treatment for that causes warpage of the substrate and twist, which causes troubles in the circuit board manufacturing process and the component assembly process. It is difficult to deal with higher density.
従来、前記工程でそり、ねじれの発生を少なくする為
に、フェノール樹脂として加熱寸法収縮の小さい樹脂を
使用し、フェノール樹脂を含浸させる基材については、
クラフト紙とクラフト・リンター混抄紙等の組合せで、
対応している。Conventionally, in order to reduce the occurrence of warpage and twist in the above process, a resin with a small heating dimension shrinkage is used as the phenol resin, and for the base material impregnated with the phenol resin,
With a combination of kraft paper and craft / linter mixed paper,
It corresponds.
発明が解決しようとする課題 しかし、付加縮合型であるフェノール樹脂を用いる限
り、改質により低寸法収縮のフェノール樹脂を得ること
は難しい。また、寸法変化の挙動がクラフト紙とは全く
異なるクラフト・リンター混抄紙の組合せでは、逆にね
じれが多く発生し易い。However, as long as the addition-condensation type phenolic resin is used, it is difficult to obtain a phenolic resin having a low dimensional shrinkage by modification. On the other hand, in the case of the combination of the kraft and linter mixed paper, which has a dimensional change behavior which is completely different from that of the kraft paper, conversely, a large amount of twist is likely to occur.
本発明の課題は、印刷回路板としてのそり、ねじれの発
生を抑制できるフェノール樹脂片面金属箔張り積層板を
提供することである。殊に、印刷回路板の製造工程で加
熱処理を伴ない、回路板の表面に絶縁のためのコートを
もたないか、あってもその形成が加熱処理後に行なわれ
るような印刷回路板用に適した片面金属箔張り積層板を
提供することである。An object of the present invention is to provide a phenol resin single-sided metal foil-clad laminate capable of suppressing warpage and twisting as a printed circuit board. In particular, for printed circuit boards that are accompanied by heat treatment in the manufacturing process of the printed circuit board and have no coating for insulation on the surface of the circuit board, or even if it is formed after the heat treatment. It is to provide a suitable single-sided metal foil-clad laminate.
課題を解決するための手段 本発明に係るフェノール樹脂片面金属箔張り積層板は、
フェノール樹脂を含浸させる基材としてクラフト紙を使
用したものである。そして、第１図に示すように、金属
箔１がない側の最外層２のクラフト紙基材の伸び率を、
主層３である他のクラフト紙基材の伸び率より大きくし
たことを特徴とする。Means for Solving the Problems Phenolic resin single-sided metal foil-clad laminate according to the present invention,
Kraft paper is used as a base material impregnated with a phenol resin. Then, as shown in FIG. 1, the elongation of the kraft paper base material of the outermost layer 2 on the side without the metal foil 1 is
It is characterized in that it is made larger than the elongation rate of the other kraft paper base material which is the main layer 3.
また、主層３のクラフト紙基材は、坪量が 200〜 250ｇ
／m2のものを用い、所定の厚さの積層板とするための積
重ね枚数を少なくするようにしてもよい。さらに、最外
層２の伸び率が大きいクラフト紙基材の伸び率は、１．
２〜１．５％の範囲が好ましい。ここで、伸び率は、Ｊ
ＩＳ−Ｐ−8132-1976 に準じて測定したものである。The kraft paper base material of the main layer 3 has a basis weight of 200 to 250 g.
/ M 2 may be used to reduce the number of sheets to be stacked to form a laminate having a predetermined thickness. Further, the elongation rate of the kraft paper base material in which the elongation rate of the outermost layer 2 is large is 1.
The range of 2 to 1.5% is preferable. Here, the growth rate is J
It is measured according to IS-P-8132-1976.
作用 フェノール樹脂片面金属箔張り積層板を加工して得た片
面印刷回路板は、厚さ方向の構成が非対称であるため
に、加熱処理によってそり、ねじれが発生する。すなわ
ち、加熱処理でフェノール樹脂が熱収縮するが、回路面
側は金属箔の回路が一体に存在するために、前記収縮が
妨げられる。その結果、回路面と反対側の面が多く収縮
し、回路面側が凸となるそりを発生しているのである。
また、回路面側とその反対面側の収縮の差により、ねじ
れを発生しているのである。Action A single-sided printed circuit board obtained by processing a phenol resin single-sided metal foil-clad laminate has an asymmetric structure in the thickness direction, and therefore warps and twists due to heat treatment. That is, although the phenol resin is thermally shrunk by the heat treatment, the shrinkage is hindered because the circuit of the metal foil is integrally present on the circuit surface side. As a result, the surface on the side opposite to the circuit surface is largely shrunk, and a warp in which the circuit surface side is convex is generated.
In addition, twist is generated due to the difference in contraction between the circuit surface side and the opposite surface side.
本発明に係る片面金属箔張り積層板では、金属箔のない
側の最外層の伸び率の大きいクラフト紙基材が、フェノ
ール樹脂の加熱収縮を抑制し、回路面側の収縮量とバラ
ンスをとって、そり、ねじれを抑制する。伸び率が大き
いクラフト紙基材の伸び率が１．２％より小さくなって
いくと、そり、ねじれの抑制効果が小さくなり、１．５
％より大きくなっていくと反対のそり（回路面側が凹）
を招くことになる。In the single-sided metal foil-clad laminate according to the present invention, the kraft paper base material having a large elongation of the outermost layer on the side without the metal foil suppresses the heat shrinkage of the phenol resin and balances the shrinkage amount on the circuit side. And suppress warpage and twist. When the elongation rate of the kraft paper base material having a large elongation rate becomes smaller than 1.2%, the effect of suppressing warpage and twist becomes small, and
When it becomes larger than%, the opposite sledge (circuit side is concave)
Will be invited.
ねじれの要因として、積層板の成形時に基材層間に残っ
た歪があるが、高坪量の紙を使用することにより、同じ
厚さの積層板を得るのに積重ね数が少なくて済む。その
結果、層間の数が減るので成形時の残留歪の量が少なく
なり、ねじれを抑制することができる。As a factor of the twist, there is a strain remaining between the base layers during the forming of the laminated plate, but by using a paper having a high basis weight, the number of stacks can be small to obtain a laminated plate having the same thickness. As a result, since the number of layers is reduced, the amount of residual strain during molding is reduced, and twisting can be suppressed.
実施例 本発明実施例を説明する。Example An example of the present invention will be described.
実施例１ 坪量 135ｇ／m2、伸び率１．２％のクラフト紙基材に桐
油変性フェノール樹脂を含浸乾燥させ樹脂含量48％のプ
リプレグを得た（プリプレグＡ）。Example 1 A kraft paper substrate having a basis weight of 135 g / m 2 and an elongation of 1.2% was impregnated with a tung oil-modified phenol resin and dried to obtain a prepreg having a resin content of 48% (prepreg A).
坪量 135ｇ／m2、伸び率０．７％クラフト紙基材に桐油
変性フェノール樹脂を含浸乾燥させ樹脂含量48％のプリ
プレグを得た（プリプレグＢ）。A kraft paper substrate having a basis weight of 135 g / m 2 and an elongation of 0.7% was impregnated with tung oil-modified phenol resin and dried to obtain a prepreg having a resin content of 48% (prepreg B).
プリプレグＡを１プライ、プリプレグＢを４プライ、接
着剤を塗布した35μ厚の銅箔をこの順に積重ね構成し、
これを温度 160℃、圧力100kg／cm2にて60分間加熱加圧
成形して１．０mm厚さの片面銅張り積層板を得た。1 ply of prepreg A, 4 plies of prepreg B, and 35 μm thick copper foil coated with adhesive are stacked in this order,
This was heated and pressed at a temperature of 160 ° C. and a pressure of 100 kg / cm 2 for 60 minutes to obtain a 1.0 mm-thick single-sided copper-clad laminate.
実施例２ 坪量 250ｇ／m2、伸び率０．７％のクラフト紙基材に桐
油変性フェノール樹脂を含浸乾燥させ樹脂含量49％のプ
リプレグを得た（プリプレグＣ）。Example 2 A kraft paper substrate having a basis weight of 250 g / m 2 and an elongation of 0.7% was impregnated with a tung oil-modified phenol resin and dried to obtain a prepreg having a resin content of 49% (prepreg C).
実施例１のプリプレグＡを１プライ、プリプレグＣを２
プライ、接着剤を塗布した35μ厚の銅箔をこの順に積重
ね構成し、実施例１と同様の成形条件にて１．０mm厚さ
の片面銅張り積層板を得た。1 ply of prepreg A and 2 prepreg C of Example 1
A ply and an adhesive-coated 35 μm-thick copper foil were stacked in this order to obtain a 1.0 mm-thick single-sided copper-clad laminate under the same molding conditions as in Example 1.
比較例１ 実施例１で得たプリプレグＡを５プライに、接着剤を塗
布した35μ厚の銅箔を積重ね、実施例１と同様の成形条
件にて１．０mm厚さの片面銅張り積層板を得た。Comparative Example 1 Five plies of the prepreg A obtained in Example 1 were stacked with 35 μm-thick copper foil coated with an adhesive, and a 1.0 mm-thick single-sided copper-clad laminate was prepared under the same molding conditions as in Example 1. Got
比較例２ クラフト・リンター混抄紙基材（坪量 135ｇ／m2）に桐
油変性フェノール樹脂を含浸乾燥させ樹脂含量48％のプ
リプレグを得た（プリプレグＤ）。Comparative Example 2 A kraft / linter mixed paper base material (basis weight: 135 g / m 2 ) was impregnated with tung oil-modified phenol resin and dried to obtain a prepreg having a resin content of 48% (prepreg D).
プリプレグＢを４プライ、プリプレグＤを１プライ、接
着剤を塗布した35μ厚の銅箔をこの順に積重ね、実施例
１と同様の成形条件にて１．０mm厚さの片面銅張り積層
板を得た。4 plies of prepreg B, 1 ply of prepreg D, and 35 μm thick copper foil coated with an adhesive were stacked in this order to obtain a 1.0 mm thick single-sided copper-clad laminate under the same molding conditions as in Example 1. It was
上記各片面銅張り積層板を 300× 200mmの大きさでエッ
チングし（残銅率40％）、外形の打抜き加工、加熱処理
（Ｅ−3/160）をしたときのそりの経時変化を第３図に
示す。また、第４図に前記加熱処理後のねじれの比較を
示す。ねじれは、平な所で印刷回路板の一隅を押さえ、
他の縁の浮き上り量の最大値で示した。Each of the above single-sided copper-clad laminates was etched to a size of 300 x 200 mm (remaining copper rate 40%), punched out and heat-treated (E-3 / 160). Shown in the figure. Further, FIG. 4 shows a comparison of the twist after the heat treatment. Twist holds a corner of the printed circuit board in a flat place,
It is shown by the maximum value of the amount of lifting of other edges.
なお、回路面に絶縁のためのコートを施したものは、コ
ートをした後に加熱処理をすると、コートの熱収縮が起
こるので別途工夫を要する。本発明に係る片面金属箔張
り積層板は、回路面にコートを施さないか、加熱処理後
にコートを施すような片面印刷回路板の用途に有効であ
る。It should be noted that if the circuit surface is coated for insulation, heat treatment after coating causes thermal contraction of the coating, and therefore a separate device is required. The single-sided metal foil-clad laminate according to the present invention is effective for use in a single-sided printed circuit board in which the circuit surface is not coated or is coated after heat treatment.
発明の効果 上述のように、本発明に係るフェノール樹脂片面金属箔
張り積層板は、製造工程で加熱処理を伴う片面印刷回路
板用として、特に上記の用途でそり、ねじれを小さく抑
えることができる。そして、そり、ねじれの抑制により
回路の高密度ファインパターンに対応可能となる。EFFECTS OF THE INVENTION As described above, the phenol resin single-sided metal foil-clad laminate according to the present invention can be used as a single-sided printed circuit board accompanied by heat treatment in the manufacturing process, especially in the above-mentioned applications, it is possible to suppress warpage to a small degree. . Then, by suppressing the warpage and the twist, it becomes possible to cope with a high-density fine pattern of the circuit.
第１図、第２図は本発明に係るフェノール樹脂片面金属
箔張り積層板の断面説明図、第３図は印刷回路板製造工
程でのそりの経時変化を示す曲線図、第４図は加熱処理
後のねじれの比較図である。 １は金属箔、２は最外層、３は主層1 and 2 are cross-sectional explanatory views of a phenol resin single-sided metal foil-clad laminate according to the present invention, FIG. 3 is a curve diagram showing changes over time in warpage in a printed circuit board manufacturing process, and FIG. 4 is heating. It is a comparison figure of the twist after processing. 1 is a metal foil, 2 is an outermost layer, 3 is a main layer
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−248738（ＪＰ，Ａ) 特開 昭63−205224（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-60-248738 (JP, A) JP-A-63-205224 (JP, A)
Claims (3)
層の片側表面に金属箔を載置して一体に積層成形した片
面金属箔張り積層板において、 金属箔のない側の最外層のクラフト紙基材の伸び率が主
層である他のクラフト紙基材の伸び率より大きいことを
特徴とするフェノール樹脂片面金属箔張り積層板。1. A single-sided metal foil-clad laminate in which a metal foil is placed on one surface of a kraft paper base material layer impregnated with a phenol resin and integrally laminated, and the outermost layer of the kraft paper without the metal foil is formed. A phenol resin single-sided metal foil-clad laminate, wherein the elongation of the base material is higher than that of the other kraft paper base material as the main layer.
が 200〜 250ｇ／m2の高坪量である請求項１記載のフェ
ノール樹脂片面金属箔張り積層板。2. The phenol resin single-sided metal foil-clad laminate according to claim 1, wherein the kraft paper substrate not located in the outermost layer has a high basis weight of 200 to 250 g / m 2 .
が、１．２〜１．５％の範囲である請求項１または２に
記載のフェノール樹脂片面金属箔張り積層板。3. The phenol resin single-sided metal foil-clad laminate according to claim 1, wherein the kraft paper substrate having a large elongation has an elongation of 1.2 to 1.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19543889A JPH0648751B2 (en) | 1989-07-28 | 1989-07-28 | Phenolic resin single-sided metal foil laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19543889A JPH0648751B2 (en) | 1989-07-28 | 1989-07-28 | Phenolic resin single-sided metal foil laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0360189A JPH0360189A (en) | 1991-03-15 |
| JPH0648751B2 true JPH0648751B2 (en) | 1994-06-22 |
Family
ID=16341063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19543889A Expired - Lifetime JPH0648751B2 (en) | 1989-07-28 | 1989-07-28 | Phenolic resin single-sided metal foil laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648751B2 (en) |
-
1989
- 1989-07-28 JP JP19543889A patent/JPH0648751B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0360189A (en) | 1991-03-15 |
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