JPH0645274Y2 - 電子部品の測定装置 - Google Patents

電子部品の測定装置

Info

Publication number
JPH0645274Y2
JPH0645274Y2 JP12875787U JP12875787U JPH0645274Y2 JP H0645274 Y2 JPH0645274 Y2 JP H0645274Y2 JP 12875787 U JP12875787 U JP 12875787U JP 12875787 U JP12875787 U JP 12875787U JP H0645274 Y2 JPH0645274 Y2 JP H0645274Y2
Authority
JP
Japan
Prior art keywords
lead
resin
recess
electronic component
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12875787U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6433082U (enrdf_load_html_response
Inventor
和生 秋山
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP12875787U priority Critical patent/JPH0645274Y2/ja
Publication of JPS6433082U publication Critical patent/JPS6433082U/ja
Application granted granted Critical
Publication of JPH0645274Y2 publication Critical patent/JPH0645274Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
JP12875787U 1987-08-24 1987-08-24 電子部品の測定装置 Expired - Lifetime JPH0645274Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12875787U JPH0645274Y2 (ja) 1987-08-24 1987-08-24 電子部品の測定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12875787U JPH0645274Y2 (ja) 1987-08-24 1987-08-24 電子部品の測定装置

Publications (2)

Publication Number Publication Date
JPS6433082U JPS6433082U (enrdf_load_html_response) 1989-03-01
JPH0645274Y2 true JPH0645274Y2 (ja) 1994-11-16

Family

ID=31382393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12875787U Expired - Lifetime JPH0645274Y2 (ja) 1987-08-24 1987-08-24 電子部品の測定装置

Country Status (1)

Country Link
JP (1) JPH0645274Y2 (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS6433082U (enrdf_load_html_response) 1989-03-01

Similar Documents

Publication Publication Date Title
TWI222518B (en) Probe card
JP4721582B2 (ja) ソケット
US20110298487A1 (en) Semiconductor testing apparatus and testing method
JP2002303650A (ja) 半導体素子テストハンドラーのインデックスヘッド
JPH07239362A (ja) 浮動機構つき吸着ハンドおよび搬送接触機構
US20020036509A1 (en) Semiconductor test apparatus and test method using the same
JP4845304B2 (ja) ソケット及びこれを備えた電子部品装着装置
JP3270871B2 (ja) 半導体装置の測定用ソケット
JPH0645274Y2 (ja) 電子部品の測定装置
JPH0361997B2 (enrdf_load_html_response)
JPH10106706A (ja) 集積回路用テストソケット
JP4237191B2 (ja) プローブカード
KR101734990B1 (ko) 조립식 센서모듈
JP2003157939A (ja) 半導体試験用コンタクタ及びコンタクト方法
JP2001264383A (ja) Ｉｃ測定用ソケット
JP2545016Y2 (ja) Ｉｃソケット
KR100799135B1 (ko) 소켓 장치 및 전자 패키지를 착탈 가능하게 장착하는 방법
JP2533490Y2 (ja) Ｉｃソケット
JPS5943751Y2 (ja) 検出装置
JP2004138546A (ja) チップ部品測定用治具
JP3080040B2 (ja) 半導体装置の端子部接続方法及び端子部接続装置
US20020182916A1 (en) IC socket
JPH0236133Y2 (enrdf_load_html_response)
JPH0686293U (ja) Ｂｇａ型ｉｃパッケージ用のｉｃソケット
JPS5915501Y2 (ja) 外部リ−ドボンダ−の平行出し機構