JPH0644600B2 - 半導体組立ユニット - Google Patents

半導体組立ユニット

Info

Publication number
JPH0644600B2
JPH0644600B2 JP62319094A JP31909487A JPH0644600B2 JP H0644600 B2 JPH0644600 B2 JP H0644600B2 JP 62319094 A JP62319094 A JP 62319094A JP 31909487 A JP31909487 A JP 31909487A JP H0644600 B2 JPH0644600 B2 JP H0644600B2
Authority
JP
Japan
Prior art keywords
semiconductor
assembly unit
housing
current terminal
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62319094A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63240056A (ja
Inventor
ハイルブロナー ハインリッヒ
シールツ ヴィンフレッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEMIKURON ELECTRON GmbH
ZEMIKURON EREKUTORONIKU GmbH
Original Assignee
SEMIKURON ELECTRON GmbH
ZEMIKURON EREKUTORONIKU GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEMIKURON ELECTRON GmbH, ZEMIKURON EREKUTORONIKU GmbH filed Critical SEMIKURON ELECTRON GmbH
Publication of JPS63240056A publication Critical patent/JPS63240056A/ja
Publication of JPH0644600B2 publication Critical patent/JPH0644600B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0655—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP62319094A 1986-12-18 1987-12-18 半導体組立ユニット Expired - Lifetime JPH0644600B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3643288.1 1986-12-18
DE19863643288 DE3643288A1 (de) 1986-12-18 1986-12-18 Halbleiterbaueinheit

Publications (2)

Publication Number Publication Date
JPS63240056A JPS63240056A (ja) 1988-10-05
JPH0644600B2 true JPH0644600B2 (ja) 1994-06-08

Family

ID=6316501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62319094A Expired - Lifetime JPH0644600B2 (ja) 1986-12-18 1987-12-18 半導体組立ユニット

Country Status (2)

Country Link
JP (1) JPH0644600B2 (enrdf_load_stackoverflow)
DE (1) DE3643288A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013500555A (ja) * 2009-07-25 2013-01-07 ツェーデニック、イノベイティブ、メタル‐ウント、クンストシュトフテヒニック、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング 相互に連結されたセルの末端連結部に電気伝導体を連結するための装置

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3930858C2 (de) * 1988-09-20 2002-01-03 Peter H Maier Modulaufbau
DE3837974A1 (de) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh Elektronisches steuergeraet
DE4009289A1 (de) * 1990-03-22 1991-09-26 Siemens Ag Elektronisches einschubteil zum einschieben in den rahmen eines schaltschrankes
US5316831A (en) * 1991-05-08 1994-05-31 Fuji Electric Co., Ltd. Metallic printed board
DE4131200C2 (de) * 1991-09-19 1995-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
DE4237632A1 (de) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
DE19523010A1 (de) * 1995-04-25 1996-11-07 Duerrwaechter E Dr Doduco Schaltungsanordnung aus einem Leistungshalbleiter und einer Ansteuerschaltung dafür
DE19529237C1 (de) * 1995-08-09 1996-08-29 Semikron Elektronik Gmbh Schaltungsanordnung
DE19703329A1 (de) * 1997-01-30 1998-08-06 Asea Brown Boveri Leistungshalbleitermodul
US6020750A (en) * 1997-06-26 2000-02-01 International Business Machines Corporation Wafer test and burn-in platform using ceramic tile supports
DE19942770A1 (de) * 1999-09-08 2001-03-15 Ixys Semiconductor Gmbh Leistungshalbleiter-Modul
DE10024377B4 (de) * 2000-05-17 2006-08-17 Infineon Technologies Ag Gehäuseeinrichtung und darin zu verwendendes Kontaktelement
DE10142614A1 (de) 2001-08-31 2003-04-03 Siemens Ag Leistungselektronikeinheit
JP2004088989A (ja) * 2002-07-03 2004-03-18 Auto Network Gijutsu Kenkyusho:Kk 電力回路部の防水方法
WO2007025489A1 (de) 2005-08-26 2007-03-08 Siemens Aktiengesellschaft Leistungshalbleitermodul mit auf schaltungsträger aufgebrachten lastanschlusselementen
DE102006006175A1 (de) 2006-02-10 2007-08-23 Ecpe Engineering Center For Power Electronics Gmbh Leistungselektronikanordnung
DE102006006424B4 (de) * 2006-02-13 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren
DE102006037159B4 (de) * 2006-08-02 2012-03-29 Oechsler Ag Komponententräger und Verfahren zum Herstellen einer elektrischen Baugruppe durch Verdrahten ihrer Komponenten
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
EP2120263A4 (en) * 2007-11-30 2010-10-13 Panasonic Corp BASE PLATE FOR A HITZEABLEITENDE STRUCTURE, MODULE WITH THE BASE PLATE FOR THE HITZEABLEITENDE STRUCTURE AND METHOD FOR THE PRODUCTION OF THE BASE PLATE FOR THE HITZEABLEITENDE STRUCTURE
JP4798170B2 (ja) * 2008-05-13 2011-10-19 株式会社豊田自動織機 半導体装置
DE102009002191B4 (de) 2009-04-03 2012-07-12 Infineon Technologies Ag Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
DE102010010926A1 (de) 2010-03-10 2011-09-15 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Verbindungseinrichtung zum Verbinden einer elektronischen Komponente mit einem Gehäuseteil und elektronisches Steuergerät
JP5939041B2 (ja) * 2012-06-01 2016-06-22 住友電気工業株式会社 半導体モジュール及び半導体モジュールの製造方法
DE102014225270A1 (de) * 2014-12-09 2016-06-09 Gebr. Schmid Gmbh Kontaktrahmen für elektrochemische Substratbeschichtung
WO2018100600A1 (ja) * 2016-11-29 2018-06-07 三菱電機株式会社 半導体装置、制御装置および半導体装置の製造方法
JP7110599B2 (ja) * 2018-01-17 2022-08-02 沖電気工業株式会社 電子機器
JP7725396B2 (ja) 2022-03-15 2025-08-19 株式会社東芝 半導体装置
DE102023116462A1 (de) 2023-06-22 2024-12-24 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Leitungskörper und Verfahren zu seiner Herstellung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
DE3232184A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiterelement
JPS5968958A (ja) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ組立体
DE3426291A1 (de) * 1984-07-17 1986-01-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleitervorrichtung
DE3508456C2 (de) * 1985-03-09 1987-01-08 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul und Verfahren zur Herstellung eines solchen Moduls
JPS61218151A (ja) * 1985-03-23 1986-09-27 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013500555A (ja) * 2009-07-25 2013-01-07 ツェーデニック、イノベイティブ、メタル‐ウント、クンストシュトフテヒニック、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング 相互に連結されたセルの末端連結部に電気伝導体を連結するための装置

Also Published As

Publication number Publication date
DE3643288C2 (enrdf_load_stackoverflow) 1993-04-22
JPS63240056A (ja) 1988-10-05
DE3643288A1 (de) 1988-06-30

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