JPH0644117Y2 - ２色発光ダイオ−ド素子 - Google Patents

２色発光ダイオ−ド素子

Info

Publication number
JPH0644117Y2
JPH0644117Y2 JP1987101134U JP10113487U JPH0644117Y2 JP H0644117 Y2 JPH0644117 Y2 JP H0644117Y2 JP 1987101134 U JP1987101134 U JP 1987101134U JP 10113487 U JP10113487 U JP 10113487U JP H0644117 Y2 JPH0644117 Y2 JP H0644117Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
chip
led
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987101134U
Other languages
English (en)
Japanese (ja)
Other versions
JPS646054U (et
Inventor
治夫 小材
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1987101134U priority Critical patent/JPH0644117Y2/ja
Publication of JPS646054U publication Critical patent/JPS646054U/ja
Application granted granted Critical
Publication of JPH0644117Y2 publication Critical patent/JPH0644117Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1987101134U 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子 Expired - Lifetime JPH0644117Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987101134U JPH0644117Y2 (ja) 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987101134U JPH0644117Y2 (ja) 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子

Publications (2)

Publication Number Publication Date
JPS646054U JPS646054U (et) 1989-01-13
JPH0644117Y2 true JPH0644117Y2 (ja) 1994-11-14

Family

ID=31329850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987101134U Expired - Lifetime JPH0644117Y2 (ja) 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子

Country Status (1)

Country Link
JP (1) JPH0644117Y2 (et)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539270U (ja) * 1991-10-30 1993-05-28 ダイワ精工株式会社 覆面型魚釣用リ−ル

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS531196A (en) * 1976-06-25 1978-01-07 Hitachi Metals Ltd Static regenerating furnace for active carbon
JPS5891688A (ja) * 1981-11-26 1983-05-31 Toshiba Corp 二色発光ダイオ−ドおよびその製造方法
JPS61181176A (ja) * 1985-02-06 1986-08-13 Toshiba Corp 光半導体装置
JPS6255975A (ja) * 1985-09-05 1987-03-11 Mitaka Denshi Kagaku Kenkyusho:Kk Ｌｅｄ多色発光システム
JPS6247154U (et) * 1985-09-10 1987-03-23

Also Published As

Publication number Publication date
JPS646054U (et) 1989-01-13

Similar Documents

Publication Publication Date Title
JPH0864872A (ja) 半導体発光素子、およびその製造方法
JPH0644117Y2 (ja) ２色発光ダイオ−ド素子
JPH01173660A (ja) 二色発光ｌｅｄ
JPH01157577A (ja) 半導体発光装置
JPH10321915A (ja) 半導体発光素子
JP3985327B2 (ja) 半導体発光装置
JP2000012898A (ja) 半導体発光装置
JPH04137772A (ja) ３色発光素子及び表示装置
JP2506452Y2 (ja) 側面発光表示装置
JPH0175294U (et)
JP2000307151A (ja) 半導体発光装置
JPS61234588A (ja) 光半導体素子用サブマウント
JPH0448648U (et)
JPS60183459U (ja) 発光ダイオ−ド
JPS5889956U (ja) 発光ダイオ−ド素子
KR20040032360A (ko) 교류 이용이 가능한 쌍방향 발광다이오드 및 쌍방향발광다이오드 제조방법
JPH0284350U (et)
JPS63278264A (ja) Ｍｏｓｆｅｔモジユ−ル
JPH0582904A (ja) 半導体レーザ装置
JP2001024237A (ja) Ｌｅｄ及びそれを用いた表示装置
JPS6234467Y2 (et)
JPS60131093U (ja) 発光ダイオ−ド駆動回路
JPH02288272A (ja) 半導体発光装置
JPS5866374A (ja) 発光ダイオ−ド
JPS6424867U (et)