JPH0644105Y2 - 樹脂モ−ルド型半導体装置のリ−ドフレ−ム - Google Patents
樹脂モ−ルド型半導体装置のリ−ドフレ−ムInfo
- Publication number
- JPH0644105Y2 JPH0644105Y2 JP5312587U JP5312587U JPH0644105Y2 JP H0644105 Y2 JPH0644105 Y2 JP H0644105Y2 JP 5312587 U JP5312587 U JP 5312587U JP 5312587 U JP5312587 U JP 5312587U JP H0644105 Y2 JPH0644105 Y2 JP H0644105Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- mold
- semiconductor device
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 37
- 229920005989 resin Polymers 0.000 title claims description 37
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 238000000465 moulding Methods 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 230000002950 deficient Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5312587U JPH0644105Y2 (ja) | 1987-04-07 | 1987-04-07 | 樹脂モ−ルド型半導体装置のリ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5312587U JPH0644105Y2 (ja) | 1987-04-07 | 1987-04-07 | 樹脂モ−ルド型半導体装置のリ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63159845U JPS63159845U (enrdf_load_html_response) | 1988-10-19 |
| JPH0644105Y2 true JPH0644105Y2 (ja) | 1994-11-14 |
Family
ID=30878905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5312587U Expired - Lifetime JPH0644105Y2 (ja) | 1987-04-07 | 1987-04-07 | 樹脂モ−ルド型半導体装置のリ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644105Y2 (enrdf_load_html_response) |
-
1987
- 1987-04-07 JP JP5312587U patent/JPH0644105Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63159845U (enrdf_load_html_response) | 1988-10-19 |
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