JPH0641723Y2 - はんだ付け装置 - Google Patents

はんだ付け装置

Info

Publication number
JPH0641723Y2
JPH0641723Y2 JP1990126473U JP12647390U JPH0641723Y2 JP H0641723 Y2 JPH0641723 Y2 JP H0641723Y2 JP 1990126473 U JP1990126473 U JP 1990126473U JP 12647390 U JP12647390 U JP 12647390U JP H0641723 Y2 JPH0641723 Y2 JP H0641723Y2
Authority
JP
Japan
Prior art keywords
chamber
solder
solder bath
melt
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990126473U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0483474U (en, 2012
Inventor
権士 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP1990126473U priority Critical patent/JPH0641723Y2/ja
Publication of JPH0483474U publication Critical patent/JPH0483474U/ja
Application granted granted Critical
Publication of JPH0641723Y2 publication Critical patent/JPH0641723Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1990126473U 1990-11-30 1990-11-30 はんだ付け装置 Expired - Lifetime JPH0641723Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990126473U JPH0641723Y2 (ja) 1990-11-30 1990-11-30 はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990126473U JPH0641723Y2 (ja) 1990-11-30 1990-11-30 はんだ付け装置

Publications (2)

Publication Number Publication Date
JPH0483474U JPH0483474U (en, 2012) 1992-07-21
JPH0641723Y2 true JPH0641723Y2 (ja) 1994-11-02

Family

ID=31874029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990126473U Expired - Lifetime JPH0641723Y2 (ja) 1990-11-30 1990-11-30 はんだ付け装置

Country Status (1)

Country Link
JP (1) JPH0641723Y2 (en, 2012)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3737563A1 (de) * 1987-11-05 1989-05-18 Ernst Hohnerlein Loetmaschine
JPH0518902Y2 (en, 2012) * 1988-09-19 1993-05-19

Also Published As

Publication number Publication date
JPH0483474U (en, 2012) 1992-07-21

Similar Documents

Publication Publication Date Title
US4270260A (en) Method for the salvage and restoration of integrated circuits from a substrate
JPS648700B2 (en, 2012)
EP2738792A3 (en) Exposure method, substrate stage, exposure apparatus, and device manufacturing method
JPH01246835A (ja) ウエハ処理装置
JPH0641723Y2 (ja) はんだ付け装置
CN110634771B (zh) 一种晶圆刻蚀设备
JP2993260B2 (ja) スクリーン印刷装置
JPH0521948A (ja) 印刷配線板の搬送キヤリヤ
JP3362351B2 (ja) プリント基板の自動はんだ付方法及びその自動はんだ付装置
JP3033008B2 (ja) 処理方法及び処理装置
US6817510B2 (en) Apparatus for increasing wave height of molten solder in solder bath
JPS6239888Y2 (en, 2012)
JPH0565473U (ja) 自動はんだ付け装置
JPH0315255Y2 (en, 2012)
JPH0350789A (ja) 電子部品装置の半田付け方法
JP3431419B2 (ja) 基板処理装置
JPH0563077U (ja) 自動はんだ付装置
JP2551238Y2 (ja) 自動はんだ付け装置
JPH0232526A (ja) 基板周縁露光装置
JPH0566286B2 (en, 2012)
JPH1048843A (ja) 処理装置
JPS63137571A (ja) 自動半田付装置
JPS5892374U (ja) 金属の電気的表面処理に用いる吊治具の自動洗浄装置
JPS5922583B2 (ja) 浸漬塗装装置の溶剤ガス回収装置
JPS6319321Y2 (en, 2012)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term