JPH0641722Y2 - 噴流はんだ槽 - Google Patents
噴流はんだ槽Info
- Publication number
- JPH0641722Y2 JPH0641722Y2 JP1988009507U JP950788U JPH0641722Y2 JP H0641722 Y2 JPH0641722 Y2 JP H0641722Y2 JP 1988009507 U JP1988009507 U JP 1988009507U JP 950788 U JP950788 U JP 950788U JP H0641722 Y2 JPH0641722 Y2 JP H0641722Y2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- current
- molten solder
- jet
- changing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 60
- 238000005476 soldering Methods 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988009507U JPH0641722Y2 (ja) | 1988-01-29 | 1988-01-29 | 噴流はんだ槽 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988009507U JPH0641722Y2 (ja) | 1988-01-29 | 1988-01-29 | 噴流はんだ槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01114165U JPH01114165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-01 |
JPH0641722Y2 true JPH0641722Y2 (ja) | 1994-11-02 |
Family
ID=31216305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988009507U Expired - Lifetime JPH0641722Y2 (ja) | 1988-01-29 | 1988-01-29 | 噴流はんだ槽 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0641722Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150305216A1 (en) * | 2012-04-27 | 2015-10-22 | Senju Metal Industry Co., Ltd. | Guide Vane and Jetting Apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2022590B1 (en) * | 2006-04-05 | 2011-09-14 | Senju Metal Industry Co., Ltd. | Wave soldering tank |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010433U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-05-29 | 1975-02-03 |
-
1988
- 1988-01-29 JP JP1988009507U patent/JPH0641722Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150305216A1 (en) * | 2012-04-27 | 2015-10-22 | Senju Metal Industry Co., Ltd. | Guide Vane and Jetting Apparatus |
US9622395B2 (en) * | 2012-04-27 | 2017-04-11 | Senju Metal Industry Co., Ltd. | Guide vane and jetting apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH01114165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-01 |