JPH0638416Y2 - 混成集積回路部品 - Google Patents
混成集積回路部品Info
- Publication number
- JPH0638416Y2 JPH0638416Y2 JP1988034665U JP3466588U JPH0638416Y2 JP H0638416 Y2 JPH0638416 Y2 JP H0638416Y2 JP 1988034665 U JP1988034665 U JP 1988034665U JP 3466588 U JP3466588 U JP 3466588U JP H0638416 Y2 JPH0638416 Y2 JP H0638416Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- component
- substrate
- conductor layer
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 25
- 239000011521 glass Substances 0.000 description 7
- 238000010304 firing Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988034665U JPH0638416Y2 (ja) | 1988-03-16 | 1988-03-16 | 混成集積回路部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988034665U JPH0638416Y2 (ja) | 1988-03-16 | 1988-03-16 | 混成集積回路部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01139420U JPH01139420U (enrdf_load_html_response) | 1989-09-22 |
JPH0638416Y2 true JPH0638416Y2 (ja) | 1994-10-05 |
Family
ID=31261362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988034665U Expired - Lifetime JPH0638416Y2 (ja) | 1988-03-16 | 1988-03-16 | 混成集積回路部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0638416Y2 (enrdf_load_html_response) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60151122U (ja) * | 1984-03-16 | 1985-10-07 | 日本電気株式会社 | 多層複合部品 |
-
1988
- 1988-03-16 JP JP1988034665U patent/JPH0638416Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01139420U (enrdf_load_html_response) | 1989-09-22 |
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