JPH0636586Y2 - 半導体チップ塔載用ヒートシンクテープ構造 - Google Patents

半導体チップ塔載用ヒートシンクテープ構造

Info

Publication number
JPH0636586Y2
JPH0636586Y2 JP1990007715U JP771590U JPH0636586Y2 JP H0636586 Y2 JPH0636586 Y2 JP H0636586Y2 JP 1990007715 U JP1990007715 U JP 1990007715U JP 771590 U JP771590 U JP 771590U JP H0636586 Y2 JPH0636586 Y2 JP H0636586Y2
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor chip
punching
block
fitting hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990007715U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0399444U (enExample
Inventor
智 星野
芳規 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1990007715U priority Critical patent/JPH0636586Y2/ja
Publication of JPH0399444U publication Critical patent/JPH0399444U/ja
Application granted granted Critical
Publication of JPH0636586Y2 publication Critical patent/JPH0636586Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
JP1990007715U 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造 Expired - Lifetime JPH0636586Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990007715U JPH0636586Y2 (ja) 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990007715U JPH0636586Y2 (ja) 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造

Publications (2)

Publication Number Publication Date
JPH0399444U JPH0399444U (enExample) 1991-10-17
JPH0636586Y2 true JPH0636586Y2 (ja) 1994-09-21

Family

ID=31511369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990007715U Expired - Lifetime JPH0636586Y2 (ja) 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造

Country Status (1)

Country Link
JP (1) JPH0636586Y2 (enExample)

Also Published As

Publication number Publication date
JPH0399444U (enExample) 1991-10-17

Similar Documents

Publication Publication Date Title
CN101595560B (zh) 预模制夹头结构
US5198964A (en) Packaged semiconductor device and electronic device module including same
JPH0722576A (ja) 半導体パワーモジュールおよび複合基板、並びに半導体パワーモジュールの製造方法
US20230411254A1 (en) Molded power semiconductor package with gate connector feature
JP3664045B2 (ja) 半導体装置の製造方法
US20240404926A1 (en) Power module package with molded via and dual side press-fit pin
JPH04229643A (ja) 高周波パワ−半導体デバイスおよびその製造方法
CN112071816A (zh) 半导体封装和制造半导体封装的方法
US5445995A (en) Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink
JPH0636586Y2 (ja) 半導体チップ塔載用ヒートシンクテープ構造
JPH02129951A (ja) 半導体装置の製造方法
JP2651427B2 (ja) 半導体装置の製造方法
US20240170378A1 (en) Power module package with molded via and dual side press-fit pin
JPH0473297B2 (enExample)
JPH06204385A (ja) 半導体素子搭載ピングリッドアレイパッケージ基板
JPH1065084A (ja) リードフレーム
JPH06104295A (ja) ハイブリッドｉｃのはんだ付け方法
JP2009164511A (ja) 半導体装置およびその製造方法
JPH0376795B2 (enExample)
KR200143231Y1 (ko) 전자부품용 방열판의 기판 결합구조
JPS635248Y2 (enExample)
US20050189625A1 (en) Lead-frame for electonic devices with extruded pads
JPH0513381B2 (enExample)
JPS6339970Y2 (enExample)
JP2000133762A5 (enExample)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term