JPH0635476Y2 - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPH0635476Y2
JPH0635476Y2 JP13866786U JP13866786U JPH0635476Y2 JP H0635476 Y2 JPH0635476 Y2 JP H0635476Y2 JP 13866786 U JP13866786 U JP 13866786U JP 13866786 U JP13866786 U JP 13866786U JP H0635476 Y2 JPH0635476 Y2 JP H0635476Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
frame
external leads
guide frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13866786U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344457U (US20080094685A1-20080424-C00004.png
Inventor
伸一 豊岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP13866786U priority Critical patent/JPH0635476Y2/ja
Publication of JPS6344457U publication Critical patent/JPS6344457U/ja
Application granted granted Critical
Publication of JPH0635476Y2 publication Critical patent/JPH0635476Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP13866786U 1986-09-10 1986-09-10 混成集積回路 Expired - Lifetime JPH0635476Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13866786U JPH0635476Y2 (ja) 1986-09-10 1986-09-10 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13866786U JPH0635476Y2 (ja) 1986-09-10 1986-09-10 混成集積回路

Publications (2)

Publication Number Publication Date
JPS6344457U JPS6344457U (US20080094685A1-20080424-C00004.png) 1988-03-25
JPH0635476Y2 true JPH0635476Y2 (ja) 1994-09-14

Family

ID=31043856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13866786U Expired - Lifetime JPH0635476Y2 (ja) 1986-09-10 1986-09-10 混成集積回路

Country Status (1)

Country Link
JP (1) JPH0635476Y2 (US20080094685A1-20080424-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022185515A1 (ja) * 2021-03-05 2022-09-09 三菱電機株式会社 半導体モジュール

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2722639B2 (ja) * 1989-04-07 1998-03-04 日本電気株式会社 集積回路パッケージ
JP5556316B2 (ja) * 2010-04-02 2014-07-23 株式会社デンソー 表面実装型電子部品及び表面実装型電子部品の実装構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022185515A1 (ja) * 2021-03-05 2022-09-09 三菱電機株式会社 半導体モジュール

Also Published As

Publication number Publication date
JPS6344457U (US20080094685A1-20080424-C00004.png) 1988-03-25

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