JPH0635470Y2 - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPH0635470Y2
JPH0635470Y2 JP1989001318U JP131889U JPH0635470Y2 JP H0635470 Y2 JPH0635470 Y2 JP H0635470Y2 JP 1989001318 U JP1989001318 U JP 1989001318U JP 131889 U JP131889 U JP 131889U JP H0635470 Y2 JPH0635470 Y2 JP H0635470Y2
Authority
JP
Japan
Prior art keywords
capillary
lead frame
wire bonding
wire
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989001318U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0292929U (enExample
Inventor
久和 大秦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1989001318U priority Critical patent/JPH0635470Y2/ja
Publication of JPH0292929U publication Critical patent/JPH0292929U/ja
Application granted granted Critical
Publication of JPH0635470Y2 publication Critical patent/JPH0635470Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W70/093—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP1989001318U 1989-01-10 1989-01-10 ワイヤボンデイング装置 Expired - Fee Related JPH0635470Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989001318U JPH0635470Y2 (ja) 1989-01-10 1989-01-10 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989001318U JPH0635470Y2 (ja) 1989-01-10 1989-01-10 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPH0292929U JPH0292929U (enExample) 1990-07-24
JPH0635470Y2 true JPH0635470Y2 (ja) 1994-09-14

Family

ID=31201107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989001318U Expired - Fee Related JPH0635470Y2 (ja) 1989-01-10 1989-01-10 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPH0635470Y2 (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54154273A (en) * 1978-05-26 1979-12-05 Shinkawa Seisakusho Kk Mechanism for elevationally moving capillary
JPS5824015B2 (ja) * 1979-04-17 1983-05-18 株式会社新川 ワイヤボンデイング装置
JPS61177732A (ja) * 1985-02-01 1986-08-09 Hitachi Ltd 製造装置

Also Published As

Publication number Publication date
JPH0292929U (enExample) 1990-07-24

Similar Documents

Publication Publication Date Title
US4821945A (en) Single lead automatic clamping and bonding system
US6616030B2 (en) Gantry mounted ultrasonic wire bonder with orbital bonding tool head
US5307978A (en) Smart indexing head for universal lead frame work station
US6015079A (en) Positioning device for controlling the position of a workpiece in a horizontal plane
US20060060631A1 (en) Motion control device for wire bonder bondhead
JPH0367338B2 (enExample)
JPH0635470Y2 (ja) ワイヤボンデイング装置
CN112635367B (zh) 一种直线式固晶机及固晶方法
JP3377725B2 (ja) 基板移送装置
JP2000012567A (ja) ダイボンダの接合材供給方法およびその装置
JPH10303241A (ja) ワイヤボンダー
JP3344639B2 (ja) チップボンディング装置
JP3673051B2 (ja) バンプ形成方法及びバンプボンダー
JPH0522384B2 (enExample)
JPH06140470A (ja) フリップチップボンディング装置
KR101088830B1 (ko) 다이 본더의 도팅 헤드와 도팅 장치, 및 이를 구비한 다이 본더
JP3796022B2 (ja) バンプボンダー
JPH0220833Y2 (enExample)
JPS5856052Y2 (ja) 半田供給装置
JPH0312943A (ja) Ｔａｂ用インナリードボンディング装置
JPH0831459B2 (ja) ボ−ルバンプ形成方法及びその装置
JPH06132345A (ja) ワイヤボンディング装置
JPH0553686B2 (enExample)
JPS6265429A (ja) ダイボンデイング装置
JPH0691121B2 (ja) ボンデイング装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees