JPH0627956Y2 - 電子回路モジュール - Google Patents

電子回路モジュール

Info

Publication number
JPH0627956Y2
JPH0627956Y2 JP1988013312U JP1331288U JPH0627956Y2 JP H0627956 Y2 JPH0627956 Y2 JP H0627956Y2 JP 1988013312 U JP1988013312 U JP 1988013312U JP 1331288 U JP1331288 U JP 1331288U JP H0627956 Y2 JPH0627956 Y2 JP H0627956Y2
Authority
JP
Japan
Prior art keywords
wiring board
circuit module
electronic circuit
wiring
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988013312U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01118494U (cg-RX-API-DMAC10.html
Inventor
豊司 安田
太一 昆
秀起 恒次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP1988013312U priority Critical patent/JPH0627956Y2/ja
Publication of JPH01118494U publication Critical patent/JPH01118494U/ja
Application granted granted Critical
Publication of JPH0627956Y2 publication Critical patent/JPH0627956Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/884—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988013312U 1988-02-03 1988-02-03 電子回路モジュール Expired - Lifetime JPH0627956Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988013312U JPH0627956Y2 (ja) 1988-02-03 1988-02-03 電子回路モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988013312U JPH0627956Y2 (ja) 1988-02-03 1988-02-03 電子回路モジュール

Publications (2)

Publication Number Publication Date
JPH01118494U JPH01118494U (cg-RX-API-DMAC10.html) 1989-08-10
JPH0627956Y2 true JPH0627956Y2 (ja) 1994-07-27

Family

ID=31223510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988013312U Expired - Lifetime JPH0627956Y2 (ja) 1988-02-03 1988-02-03 電子回路モジュール

Country Status (1)

Country Link
JP (1) JPH0627956Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3162485B2 (ja) * 1992-06-24 2001-04-25 株式会社東芝 マルチチップモジュール

Also Published As

Publication number Publication date
JPH01118494U (cg-RX-API-DMAC10.html) 1989-08-10

Similar Documents

Publication Publication Date Title
US5586007A (en) Circuit board having improved thermal radiation
EP0836227A2 (en) Heat conductive substrate mounted in PC board hole for transferring heat from IC to heat sink
JPH06169189A (ja) チップ形発熱部品及びその実装方法
US6008988A (en) Integrated circuit package with a heat spreader coupled to a pair of electrical devices
JPH06309532A (ja) Ｉｃカード
JPS60202956A (ja) 回路モジユ−ル
JP2000058741A (ja) ハイブリッドモジュール
JPH0627956Y2 (ja) 電子回路モジュール
JP3068488B2 (ja) プリント基板
JPH09213847A (ja) 半導体集積回路装置及びこの製造方法並びにそれを用いた電子装置
JP3193142B2 (ja) 基 板
JPS61144855A (ja) 半導体回路のためのパツケージ
JPH07106721A (ja) プリント回路板及びその放熱方法
JPH07321471A (ja) 多層基板
JPH0529502A (ja) プリント基板
JPH05198696A (ja) 半導体チップの実装構造
JP2564645Y2 (ja) 発熱部品を有する混成集積回路装置
JP2000059003A (ja) ハイブリッドモジュール
JP2828385B2 (ja) Ｉｃパッケージの構造
JP2612455B2 (ja) 半導体素子搭載用基板
JPH05275822A (ja) 電子回路の実装装置
JPH07321423A (ja) 回路基板
JPS63289847A (ja) Ｌｓｉパッケ−ジの放熱構造
JPS645895Y2 (cg-RX-API-DMAC10.html)
JPH09260796A (ja) 放熱構造プリント基板