JPH0625024Y2 - 補強板付きフレキシブルプリント配線板 - Google Patents
補強板付きフレキシブルプリント配線板Info
- Publication number
- JPH0625024Y2 JPH0625024Y2 JP1988035205U JP3520588U JPH0625024Y2 JP H0625024 Y2 JPH0625024 Y2 JP H0625024Y2 JP 1988035205 U JP1988035205 U JP 1988035205U JP 3520588 U JP3520588 U JP 3520588U JP H0625024 Y2 JPH0625024 Y2 JP H0625024Y2
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing plate
- fpc
- printed wiring
- flexible printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 title claims description 35
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- MINPZZUPSSVGJN-UHFFFAOYSA-N 1,1,1,4,4,4-hexachlorobutane Chemical compound ClC(Cl)(Cl)CCC(Cl)(Cl)Cl MINPZZUPSSVGJN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101150049492 DVR gene Proteins 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988035205U JPH0625024Y2 (ja) | 1988-03-18 | 1988-03-18 | 補強板付きフレキシブルプリント配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988035205U JPH0625024Y2 (ja) | 1988-03-18 | 1988-03-18 | 補強板付きフレキシブルプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01139472U JPH01139472U (enrdf_load_stackoverflow) | 1989-09-22 |
JPH0625024Y2 true JPH0625024Y2 (ja) | 1994-06-29 |
Family
ID=31261857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988035205U Expired - Lifetime JPH0625024Y2 (ja) | 1988-03-18 | 1988-03-18 | 補強板付きフレキシブルプリント配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0625024Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59145058U (ja) * | 1983-03-17 | 1984-09-28 | 松下電器産業株式会社 | 印刷配線板 |
-
1988
- 1988-03-18 JP JP1988035205U patent/JPH0625024Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01139472U (enrdf_load_stackoverflow) | 1989-09-22 |
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