JPH0625017Y2 - Ｌｓｉパッケ−ジのリ−ド構造 - Google Patents

Ｌｓｉパッケ−ジのリ−ド構造

Info

Publication number
JPH0625017Y2
JPH0625017Y2 JP1987107963U JP10796387U JPH0625017Y2 JP H0625017 Y2 JPH0625017 Y2 JP H0625017Y2 JP 1987107963 U JP1987107963 U JP 1987107963U JP 10796387 U JP10796387 U JP 10796387U JP H0625017 Y2 JPH0625017 Y2 JP H0625017Y2
Authority
JP
Japan
Prior art keywords
lead
plating
lsi package
solder
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987107963U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6413152U (no
Inventor
光男 高本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1987107963U priority Critical patent/JPH0625017Y2/ja
Publication of JPS6413152U publication Critical patent/JPS6413152U/ja
Application granted granted Critical
Publication of JPH0625017Y2 publication Critical patent/JPH0625017Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987107963U 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造 Expired - Lifetime JPH0625017Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987107963U JPH0625017Y2 (ja) 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987107963U JPH0625017Y2 (ja) 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造

Publications (2)

Publication Number Publication Date
JPS6413152U JPS6413152U (no) 1989-01-24
JPH0625017Y2 true JPH0625017Y2 (ja) 1994-06-29

Family

ID=31342853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987107963U Expired - Lifetime JPH0625017Y2 (ja) 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造

Country Status (1)

Country Link
JP (1) JPH0625017Y2 (no)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041901A (en) * 1989-05-10 1991-08-20 Hitachi, Ltd. Lead frame and semiconductor device using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60154545A (ja) * 1984-01-23 1985-08-14 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPS6413152U (no) 1989-01-24

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