JPH0624003Y2 - ヘッド基板取付構造 - Google Patents
ヘッド基板取付構造Info
- Publication number
- JPH0624003Y2 JPH0624003Y2 JP1988022369U JP2236988U JPH0624003Y2 JP H0624003 Y2 JPH0624003 Y2 JP H0624003Y2 JP 1988022369 U JP1988022369 U JP 1988022369U JP 2236988 U JP2236988 U JP 2236988U JP H0624003 Y2 JPH0624003 Y2 JP H0624003Y2
- Authority
- JP
- Japan
- Prior art keywords
- head
- substrate
- voice
- rear surface
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 46
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988022369U JPH0624003Y2 (ja) | 1988-02-24 | 1988-02-24 | ヘッド基板取付構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988022369U JPH0624003Y2 (ja) | 1988-02-24 | 1988-02-24 | ヘッド基板取付構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01133212U JPH01133212U (enrdf_load_stackoverflow) | 1989-09-11 |
JPH0624003Y2 true JPH0624003Y2 (ja) | 1994-06-22 |
Family
ID=31240425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988022369U Expired - Lifetime JPH0624003Y2 (ja) | 1988-02-24 | 1988-02-24 | ヘッド基板取付構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0624003Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5140959Y2 (enrdf_load_stackoverflow) * | 1971-08-12 | 1976-10-06 | ||
JPS59157212U (ja) * | 1983-04-06 | 1984-10-22 | ティーディーケイ株式会社 | 磁気ヘツド |
-
1988
- 1988-02-24 JP JP1988022369U patent/JPH0624003Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01133212U (enrdf_load_stackoverflow) | 1989-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS60111068U (ja) | フレキシブルプリント基板 | |
JPH0624003Y2 (ja) | ヘッド基板取付構造 | |
JPS5936268U (ja) | 印刷配線板 | |
JP2000099933A (ja) | 磁気ヘッド | |
JPS5889850A (ja) | 面実装型半導体装置 | |
JPH04255291A (ja) | 印刷配線板 | |
JPS6134579Y2 (enrdf_load_stackoverflow) | ||
JPS6352795B2 (enrdf_load_stackoverflow) | ||
JP2819570B2 (ja) | プリント基板の製造方法 | |
JP2000277950A (ja) | 電線保持基台の取付構造 | |
JPH0124755Y2 (enrdf_load_stackoverflow) | ||
JPS6319936Y2 (enrdf_load_stackoverflow) | ||
JPS58131654U (ja) | 厚膜電極構造 | |
JP2506593Y2 (ja) | 磁気ヘッド保持構造 | |
JP3680444B2 (ja) | 磁気ヘッド装置の製造方法、及びその中継基板 | |
JP2000100508A (ja) | プリント配線板 | |
JPS5914373U (ja) | 印刷配線板への電気部品接続装置 | |
JPS59185872U (ja) | 印刷配線板の導箔剥れ補強部材 | |
JPS6085867U (ja) | チツプ部品 | |
JPS59176150U (ja) | 混成集積回路装置 | |
JPS60169901U (ja) | マイクロ波集積回路基板の接着構造 | |
JPH08147626A (ja) | 薄膜磁気ヘッド | |
JPS61175912A (ja) | ヘツド装置 | |
JPS5841980U (ja) | 端子接続構造 | |
JPH05206625A (ja) | 配線プリント基板 |