JPH0623008Y2 - ピン端子ｌｅｄ - Google Patents

ピン端子ｌｅｄ

Info

Publication number
JPH0623008Y2
JPH0623008Y2 JP1988114941U JP11494188U JPH0623008Y2 JP H0623008 Y2 JPH0623008 Y2 JP H0623008Y2 JP 1988114941 U JP1988114941 U JP 1988114941U JP 11494188 U JP11494188 U JP 11494188U JP H0623008 Y2 JPH0623008 Y2 JP H0623008Y2
Authority
JP
Japan
Prior art keywords
stud
lens
resin
pin terminal
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1988114941U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0236061U (US07321065-20080122-C00160.png
Inventor
新吾 乙部
雅彦 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP1988114941U priority Critical patent/JPH0623008Y2/ja
Publication of JPH0236061U publication Critical patent/JPH0236061U/ja
Application granted granted Critical
Publication of JPH0623008Y2 publication Critical patent/JPH0623008Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988114941U 1988-09-02 1988-09-02 ピン端子ｌｅｄ Expired - Fee Related JPH0623008Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988114941U JPH0623008Y2 (ja) 1988-09-02 1988-09-02 ピン端子ｌｅｄ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988114941U JPH0623008Y2 (ja) 1988-09-02 1988-09-02 ピン端子ｌｅｄ

Publications (2)

Publication Number Publication Date
JPH0236061U JPH0236061U (US07321065-20080122-C00160.png) 1990-03-08
JPH0623008Y2 true JPH0623008Y2 (ja) 1994-06-15

Family

ID=31356145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988114941U Expired - Fee Related JPH0623008Y2 (ja) 1988-09-02 1988-09-02 ピン端子ｌｅｄ

Country Status (1)

Country Link
JP (1) JPH0623008Y2 (US07321065-20080122-C00160.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768088A (en) * 1980-10-15 1982-04-26 Toshiba Corp Photosemiconductor device

Also Published As

Publication number Publication date
JPH0236061U (US07321065-20080122-C00160.png) 1990-03-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees